CYStech Electronics Corp.
Spec. No. : C336SG
Issued Date : 2003.06.01
Revised Date :
Page No. : 1/3
CASD501SG
CYStek Product Specification
CASD501SG
Surface Mount Small Signal Schottky Barrier Diodes
Features
For surface mounted application
Extremely low V
F
Extremely Thin Package
Low Stored Charge
Majority Carrier Conduction
Mechanical Data
Case: Molded Plastic, JEDEC SOD-323.
Terminals: Solder plated, solderable per MIL-STD-750 Method 2026
Polarity: Indicated by cathode band.
Mounting Position : Any.
Weight: 0.0045 gram, 0.000159 ounce
Maximum Ratings
(Ta=25, unless otherwise noted)
Parameter Symbol
Conditions
min
typ
max
unit
Repetitive Peak Reverse Voltage
V
RM
45
V
Continuous Reverse Voltage
V
R
40
V
Average Rectified Current
I
O
100
mA
Peak Forward Surge Current
I
FSM
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
1000 mA
Typical Junction Capacitance
C
D
f = 1MHz and applied 10VDC
Reverse Voltage
20 pF
Operating Temperature Range
T
J
-40
+125
C
Storage Temperature Range
T
STG
-40
+125
C
Electrical Characteristics
(Ta=25, unless otherwise noted)
Parameter Symbol
Conditions
min
typ
max
unit
Forward Voltage
V
F
I
F
= 100mA DC
0.55
V
Reverse Leakage Current
I
R
V
R
= 10V DC
30
A
CYStech Electronics Corp.
Spec. No. : C336SG
Issued Date : 2003.06.01
Revised Date :
Page No. : 2/3
CASD501SG
CYStek Product Specification
Characteristic Curves
Forward Characteristics
1
10
100
0
0.1
0.2
0.3
0.4
0.5
0.6
Forward Voltage---V
F
(V)
Forward Current---I
F
(mA)
125
75
25
-25
Reverse Characteristics
0.1
1
10
100
1000
10000
0
10
20
30
40
Reverse Voltage---V
R
(V)
Reverse Current---I
R
(A)
125
75
25
Forward Current Derating Curve
(Mounting on glass epoxy PCBs)
0
20
40
60
80
100
120
0
25
50
75
100
125
150
Ambient Temperature---Ta()
Percentage of Average Forward
Current---(%)
Diode Capacitance vs Reverse Voltage
1
10
100
0
5
10
15
20
25
30
35
Reverse Voltage---V
R
(V)
Diode Capacitance---C
D
(pF)
CYStech Electronics Corp.
Spec. No. : C336SG
Issued Date : 2003.06.01
Revised Date :
Page No. : 3/3
CASD501SG
CYStek Product Specification
SOD-323 Dimension
*:Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.090 0.106 2.3 2.7 D 0.028 0.035 0.7 0.9
B 0.045 0.053 1.15 1.35 R
0.02(typ) 0.5(typ)
C 0.012(typ)
0.3(typ)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SOD-323 Plastic Surface
Mounted Package
CYStek Package Code:SG
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