DALLAS
SEMICONDUCTOR
DS21FT42 / DS21FF42
4 X 3 Twelve Channel T1 Framer
4 X 4 Sixteen Channel T1 Framer
101899
/1231
FEATURES
P
Sixteen (16) or Twelve (12) Completely
Independent T1 Framers in One Small
27mm x 27mm Package
Each Multi-Chip Module (MCM) Contains
Four (FF) or Three (FT) DS21Q42 Die.
Each Quad Framer Can be Concatenated
into a Single 8.192MHz Backplane Data
Stream
IEEE 1149.1 JTAG-Boundary Scan
Architecture
DS21FF42 and DS21FT42 are Pin
Compatible with DS21FF44 and
DS21FT44, respectively, to allow the
Same Footprint to Support T1 and E1
Applications
300pin MCM BGA package (27mm X
27mm)
Low Power 3.3V CMOS with 5V Tolerant
Input & Outputs
1. MULTI-CHIP MODULE (MCM) DESCRIPTION
The Four x Four and Four x Three MCMs offer a high density packaging arrangement for
the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42)
silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical
connections as shown in Figure 1-1.
All of the functions available on the DS21Q42 are also available in the MCM packaged
version. However, in order to minimize package size, some signals have been deleted or
combined. These differences are detailed in Table 1-1. In the Four x Three (FT) version,
the fourth quad framer is not populated and hence all of the signals to and from this fourth
framer are absent and should be treated as No Connects (NC). Table 2-1 lists all of the
signals on the MCM and it also lists the absent signals for the Four x Three.
The availability of both a twelve and a sixteen channel version allow the maximum framer
density with the lowest cost. For example, in a T3 application, two devices (one
DS21FF42 and one DS21FT42) provide a total of 28 framers without the additional cost
and power consumption of any unused framers that appear in an octal approach.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1232
Changes from Normal DS21Q42 Configuration Table 1-1
1. TSYSCLK and RSYSCLK are tied together.
2. The following signals are not available:
RFSYNC / RLCLK / RLINK / RCHCLK / RMSYNC / RLOS/LOTC /
TCHBLK / TLCLK / TLINK / TCHCLK
DS21FF42 / DS21FT42 Schematic Figure 1-1
8MCLK
CLKSI
RCLK1/2/3/4
RPOS1/2/3/4
RNEG1/2/3/4
RSER1/2/3/4
RSIG1/2/3/4
RSYNC1/2/3/4
RSYSCLK1/2/3/4
TCLK1/2/3/4
TNEG1/2/3/4
TPOS1/2/3/4
TSER1/2/3/4
TSIG1/2/3/4
TSSYNC1/2/3/4
TSYNC1/2/3/4
TSYSCLK1/2/3/4
TLINK0/1/2/3
JTDO
JTDI
JTCLK
JTMS
JTRST
INT*
FMS
D0 to D7
A0 to A7
RD*
WR*
BTS
MUX
CS*
FS0/FS1
TEST
Signals Not Connected &
Left Open Circuited Include:
RLOS/LOTC
RLINK
RLCLK
RCHCLK
RMSYNC
RFSYNC
TLCLK
TCHCLK
TCHBLK
DS21Q42 # 1
RCLK5/6/7/8
RPOS5/6/7/8
RNEG5/6/7/8
RSER5/6/7/8
RSIG5/6/7/8
RSYNC5/6/7/8
RSYSCLK5/6/7/8
TCLK5/6/7/8
TNEG5/6/7/8
TPOS5/6/7/8
TSER5/6/7/8
TSIG5/6/7/8
TSSYNC5/6/7/8
TSYNC5/6/7/8
TSYSCLK5/6/7/8
JTDO
JTDI
JTCLK
JTMS
JTRST
INT*
D0 to D7
A0 to A7
RD*
WR*
BTS
MUX
CS*
FS0/FS1
TEST
Signals Not Connected &
Left Open Circuited Include:
RLOS/LOTC
RLINK
RLCLK
RCHCLK
RMSYNC
RFSYNC
TLCLK
TCHCLK
TCHBLK
8MCLK
DS21Q42 # 2
2
8
8
See Connecting Page
RCHBLK5/6/7/8
RCHBLK1/2/3/4
DVDD
DVSS
DVSS
TLINK0/1/2/3
FMS
CLKSI
DVSS
DVSS
DVDD
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1233
DS21FF42 / DS21FT42 Schematic Figure 1-1 (continued)
CLKSI
RCLK9/10/11/12
RPOS9/10/11/12
RNEG9/10/11/12
RSER9/10/11/12
RSIG9/10/11/12
RSYNC9/10/11/12
RSYSCLK9/10/11/12
TCLK9/10/11/12
TNEG9/10/11/12
TPOS9/10/11/12
TSER9/10/11/12
TSIG9/10/11/12
TSSYNC9/10/11/12
TSYNC9/10/11/12
TSYSCLK9/10/11/12
TLINK0/1/2/3
JTDO
JTDI
JTCLK
JTMS
JTRST
INT*
FMS
D0 to D7
A0 to A7
RD*
WR*
BTS
MUX
CS*
FS0/FS1
TEST
Signals Not Connected &
Left Open Circuited Include:
RLOS/LOTC
RLINK
RLCLK
RCHCLK
RMSYNC
RFSYNC
TLCLK
TCHCLK
TCHBLK
8MCLK
DS21Q42 # 3
RCLK13/14/15/16
RPOS13/14/15/16
RNEG13/14/15/16
RSER13/14/15/16
RSIG13/14/15/16
RSYNC13/14/15/16
RSYSCLK13/14/15/16
TCLK13/14/15/16
TNEG13/14/15/16
TPOS13/14/15/16
TSER13/14/15/16
TSIG13/14/15/16
TSSYNC13/14/15/16
TSYNC13/14/15/16
TSYSCLK13/14/15/16
JTDO
JTDI
JTCLK
JTMS
JTRST
INT*
D0 to D7
A0 to A7
RD*
WR*
BTS
MUX
CS*
FS0/FS1
TEST
Signals Not Connected &
Left Open Circuited Include:
RLOS/LOTC
RLINK
RLCLK
RCHCLK
RMSYNC
RFSYNC
TLCLK
TCHCLK
TCHBLK
8MCLK
DS21Q42 # 4
RCHBLK13/14/15/16
RCHBLK9/10/11/12
DVDD
DVSS
DVSS
TLINK0/1/2/3
FMS
CLKSI
DVSS
DVSS
DVDD
See Connecting Page
jtdot
jtdof
The Fourth Quad Framer
is Not Populated
on the 12 Channel
DS21FT42
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1234
TABLE OF CONTENTS
FEATURES ............................................................................................... 1
1. MULTI-CHIP MODULE (MCM) DESCRIPTION.................................... 1
2. MCM LEAD DESCRIPTION ................................................................. 7
3. DS21FF42 (FOUR X FOUR) PCB LAND PATTERN ...............................13
4. DS21FT42 (FOUR X THREE) PCB LAND PATTERN ............................14
5. DS21Q42 FEATURES ..........................................................................15
6. DS21Q42 INTRODUCT ION .................................................................16
7. DS21Q42 PIN FUNCT ION DESCRIPTION ...........................................20
8. DS21Q42 REGISTER MAP..................................................................29
9. PARALLEL PORT ..............................................................................33
10.
CONTROL, ID AND TEST REGISTERS ...........................................33
11.
STATUS AND INFORMAT ION REGISTERS .....................................45
12.
ERROR COUNT REGISTERS ...........................................................54
13.
DS0 MONITORING FUNCTION........................................................58
14.
SIGNALING OPERAT ION................................................................62
14.1 PROCESSOR BASED SIGNALING ...................................................62
14.2 HARDWARE BASED SIGNALING....................................................64
15.
PERCHANNEL CODE (IDLE) GENERATION AND LOOPBACK .....66
15.1 TRANSMIT SIDE CODE GENERATION ...........................................66
15.1.1 Simple Idle Code Insertion and PerChannel Loopback ..................66
15.1.2 PerChannel Code Insertion........................................................67
15.2 RECEIVE SIDE CODE GENERATION ...............................................68
15.2.1 Simple Code Insertion.................................................................68
15.2.2 PerChannel Code Insertion........................................................69
16.
CLOCK BLOCKING REGISTERS ....................................................71
17.
ELASTIC STORES OPERATION .....................................................72
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1235
17.1 RECEIVE SIDE ...............................................................................72
17.2 TRANSMIT SIDE............................................................................73
17.3 MINIMUM DELAY SYNCHRONOUS RSYSCLK/TSYSCLK MODE .....73
18.
HDLC CONTROLLER......................................................................74
18.1 HDLC
FOR
DS0
S
...............................................................................74
19.
FDL/FS EXTRACTION AND INSERTION .........................................75
19.1 HDLC AND BOC CONTROLLER FOR THE FDL ...............................75
19.1.1 General Overview ........................................................................75
19.1.2 Status Register for the HDLC ......................................................76
19.1.3 HDLC/BOC Register Description..................................................79
19.2 LEGACY FDL SUPPORT .................................................................86
19.2.1 Overview ....................................................................................86
19.2.2 Receive Section ...........................................................................86
19.2.3 Transmit Section ........................................................................87
19.3 D4/SLC96 OPERATION .................................................................88
20.
PROGRAMMABLE INBAND CODE GENERATION AND DETECTION
89
21.
TRANSMIT TRANSPARENCY ..........................................................93
22.
INTERLEAVED PCM BUS OPERATION ..........................................94
23.
JTAG-BOUNDARY SCAN ARCHITECTURE AND TEST ACCESS PORT
97
23.1 D
ESCRIPTION
....................................................................................97
23.2 TAP C
ONTROLLER
S
TATE
M
ACHINE
....................................................98
23.3 I
NSTRUCTION
R
EGISTER AND
I
NSTRUCTIONS
......................................... 101
23.4 T
EST
R
EGISTERS
............................................................................. 104
24.
TIMING DIAGRAMS ...................................................................... 109
25.
OPERATING PARAME TERS .......................................................... 124
26.
MCM PACKAGE DIME NSIONS ...................................................... 144
DOCUMENT REVISION HISTORY
Revision
Notes
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1236
8-7-98
Initial Release
12-29-98
TEST and MUX leads were added at previous No Connect (NC) leads.
10-18-99
DS21Q42 die specifications appended to data sheet.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1237
2. MCM LEAD DESCRIPTION
Lead Description Sorted by Symbol Table 2-1
Lead
Symbol
I/O
Description
B7
8MCLK
O
8.192 MHz Clock Based on CLKSI.
G20
A0
I
Address Bus Bit 0 (lsb).
H20
A1
I
Address Bus Bit 1.
G19
A2
I
Address Bus Bit 2.
H19
A3
I
Address Bus Bit 3.
G18
A4
I
Address Bus Bit 4.
H18
A5
I
Address Bus Bit 5.
G17
A6
I
Address Bus Bit 6.
H17
A7
I
Address Bus Bit 7 (msb).
W15
BTS
I
Bus Timing Select. 0 = Intel / 1 = Motorola.
B6
CLKSI
I
Reference clock for the 8.192MHz clock synthesizer.
T8
CS1*
I
Chip Select for Quad Framer 1.
Y4
CS2*
I
Chip Select for Quad Framer 2.
Y15
CS3*
I
Chip Select for Quad Framer 3.
E19
CS4*/NC
I
Chip Select for Quad Framer 4. NC on Four x Three.
L20
D0
I/O
Data Bus Bit 0 (lsb).
M20
D1
I/O
Data Bus Bit 1.
L19
D2
I/O
Data Bus Bit 2.
M19
D3
I/O
Data Bus Bit 3.
L18
D4
I/O
Data Bus Bit 4.
M18
D5
I/O
Data Bus Bit 5.
L17
D6
I/O
Data Bus Bit 6.
M17
D7
I/O
Data Bus Bit 7 (msb).
C7
DVDD1
Digital Positive Supply for Framer 1.
E4
DVDD1
Digital Positive Supply for Framer 1.
D2
DVDD1
Digital Positive Supply for Framer 1.
K3
DVDD2
Digital Positive Supply for Framer 2.
U7
DVDD2
Digital Positive Supply for Framer 2.
P2
DVDD2
Digital Positive Supply for Framer 2.
V19
DVDD3
Digital Positive Supply for Framer 3.
T12
DVDD3
Digital Positive Supply for Framer 3.
L16
DVDD3
Digital Positive Supply for Framer 3.
D17
DVDD4/NC
Digital Positive Supply for Framer 4. NC on Four x Three.
F16
DVDD4/NC
Digital Positive Supply for Framer 4. NC on Four x Three.
B11
DVDD4/NC
Digital Positive Supply for Framer 4. NC on Four x Three.
E9
DVSS1
Digital Signal Ground for Framer 1.
A6
DVSS1
Digital Signal Ground for Framer 1.
D5
DVSS1
Digital Signal Ground for Framer 1.
U3
DVSS2
Digital Signal Ground for Framer 2.
K4
DVSS2
Digital Signal Ground for Framer 2.
U8
DVSS2
Digital Signal Ground for Framer 2.
U4
DVSS3
Digital Signal Ground for Framer 3.
R16
DVSS3
Digital Signal Ground for Framer 3.
Y20
DVSS3
Digital Signal Ground for Framer 3.
J20
DVSS4/NC
Digital Signal Ground for Framer 4. NC on Four x Three.
A11
DVSS4/NC
Digital Signal Ground for Framer 4. NC on Four x Three.
D19
DVSS4/NC
Digital Signal Ground for Framer 4. NC on Four x Three.
Y14
FS0
I
Framer Select 0 for the Parallel Control Port.
W14
FS1
I
Framer Select 1 for the Parallel Control Port.
G16
INT*
O
Interrupt for all four Quad Framers.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1238
V14
JTCLK
I
JTAG Clock.
E10
JTDI
I
JTAG Data Input.
A19
JTDOF/NC
O
JTAG Data Output for Four x Four Version. NC on Four x Three.
T17
JTDOT
O
JTAG Data Output for Four x Three Version.
H16
JTMS
I
JTAG Test Mode Select.
K17
JTRST*
I
JTAG Reset.
A13
TEST
I
Tri-State. 0 = do not tri-state / 1 = tri-state all outputs & I/O signals
P17
MUX
I
Bus Operation Select. 0 = non-multiplexed bus / 1 = multiplexed bus
C2
RCHBLK1
O
Receive Channel Blocking Clock.
G3
RCHBLK2
O
Receive Channel Blocking Clock.
E6
RCHBLK3
O
Receive Channel Blocking Clock.
A8
RCHBLK4
O
Receive Channel Blocking Clock.
N1
RCHBLK5
O
Receive Channel Blocking Clock.
Y1
RCHBLK6
O
Receive Channel Blocking Clock.
U6
RCHBLK7
O
Receive Channel Blocking Clock.
N5
RCHBLK8
O
Receive Channel Blocking Clock.
Y8
RCHBLK9
O
Receive Channel Blocking Clock.
W12
RCHBLK10
O
Receive Channel Blocking Clock.
V17
RCHBLK11
O
Receive Channel Blocking Clock.
U17
RCHBLK12
O
Receive Channel Blocking Clock.
D16
RCHBLK13/NC
O
Receive Channel Blocking Clock. NC on Four x Three.
K20
RCHBLK14/NC
O
Receive Channel Blocking Clock. NC on Four x Three.
B18
RCHBLK15/NC
O
Receive Channel Blocking Clock. NC on Four x Three.
B16
RCHBLK16/NC
O
Receive Channel Blocking Clock. NC on Four x Three.
A2
RCLK1
I
Receive Clock for Framer 1
K1
RCLK2
I
Receive Clock for Framer 2.
D10
RCLK3
I
Receive Clock for Framer 3.
B9
RCLK4
I
Receive Clock for Framer 4.
M3
RCLK5
I
Receive Clock for Framer 5.
V1
RCLK6
I
Receive Clock for Framer 6.
W6
RCLK7
I
Receive Clock for Framer 7.
J3
RCLK8
I
Receive Clock for Framer 8.
T9
RCLK9
I
Receive Clock for Framer 9.
W10
RCLK10
I
Receive Clock for Framer 10.
Y18
RCLK11
I
Receive Clock for Framer 11.
N17
RCLK12
I
Receive Clock for Framer 12.
D14
RCLK13/NC
I
Receive Clock for Framer 13. NC on Four x Three.
P20
RCLK14/NC
I
Receive Clock for Framer 14. NC on Four x Three.
C18
RCLK15/NC
I
Receive Clock for Framer 15. NC on Four x Three.
C12
RCLK16/NC
I
Receive Clock for Framer 16. NC on Four x Three.
E18
RD*
I
Read Input.
B2
RNEG1
I
Receive Negative Data for Framer 1.
H2
RNEG2
I
Receive Negative Data for Framer 2.
D9
RNEG3
I
Receive Negative Data for Framer 3.
A9
RNEG4
I
Receive Negative Data for Framer 4.
M2
RNEG5
I
Receive Negative Data for Framer 5.
V3
RNEG6
I
Receive Negative Data for Framer 6.
V7
RNEG7
I
Receive Negative Data for Framer 7.
P3
RNEG8
I
Receive Negative Data for Framer 8.
U9
RNEG9
I
Receive Negative Data for Framer 9.
W11
RNEG10
I
Receive Negative Data for Framer 10.
W17
RNEG11
I
Receive Negative Data for Framer 11.
T20
RNEG12
I
Receive Negative Data for Framer 12.
E14
RNEG13/NC
I
Receive Negative Data for Framer 13. NC on Four x Three.
N20
RNEG14/NC
I
Receive Negative Data for Framer 14. NC on Four x Three.
C20
RNEG15/NC
I
Receive Negative Data for Framer 15. NC on Four x Three.
B13
RNEG16/NC
I
Receive Negative Data for Framer 16. NC on Four x Three.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/1239
A1
RPOS1
I
Receive Positive Data for Framer 1.
H1
RPOS2
I
Receive Positive Data for Framer 2.
H4
RPOS3
I
Receive Positive Data for Framer 3.
C9
RPOS4
I
Receive Positive Data for Framer 4.
M1
RPOS5
I
Receive Positive Data for Framer 5.
W2
RPOS6
I
Receive Positive Data for Framer 6.
V5
RPOS7
I
Receive Positive Data for Framer 7.
P4
RPOS8
I
Receive Positive Data for Framer 8.
T10
RPOS9
I
Receive Positive Data for Framer 9.
V11
RPOS10
I
Receive Positive Data for Framer 10.
Y19
RPOS11
I
Receive Positive Data for Framer 11.
R19
RPOS12
I
Receive Positive Data for Framer 12.
D15
RPOS13/NC
I
Receive Positive Data for Framer 13. NC on Four x Three.
J18
RPOS14/NC
I
Receive Positive Data for Framer 14. NC on Four x Three.
A20
RPOS15/NC
I
Receive Positive Data for Framer 15. NC on Four x Three.
A14
RPOS16/NC
I
Receive Positive Data for Framer 16. NC on Four x Three.
C1
RSER1
O
Receive Serial Data from Framer 1.
H3
RSER2
O
Receive Serial Data from Framer 2.
C6
RSER3
O
Receive Serial Data from Framer 3.
C8
RSER4
O
Receive Serial Data from Framer 4.
P1
RSER5
O
Receive Serial Data from Framer 5.
W4
RSER6
O
Receive Serial Data from Framer 6.
T7
RSER7
O
Receive Serial Data from Framer 7.
N4
RSER8
O
Receive Serial Data from Framer 8.
U11
RSER9
O
Receive Serial Data from Framer 9.
Y12
RSER10
O
Receive Serial Data from Framer 10.
V16
RSER11
O
Receive Serial Data from Framer 11.
T16
RSER12
O
Receive Serial Data from Framer 12.
E16
RSER13/NC
O
Receive Serial Data from Framer 13. NC on Four x Three.
F20
RSER14/NC
O
Receive Serial Data from Framer 14. NC on Four x Three.
C16
RSER15/NC
O
Receive Serial Data from Framer 15. NC on Four x Three.
A12
RSER16/NC
O
Receive Serial Data from Framer 16. NC on Four x Three.
D3
RSIG1
O
Receive Signaling Output from Framer 1.
G2
RSIG2
O
Receive Signaling Output from Framer 2.
D4
RSIG3
O
Receive Signaling Output from Framer 3.
D8
RSIG4
O
Receive Signaling Output from Framer 4.
N2
RSIG5
O
Receive Signaling Output from Framer 5.
V4
RSIG6
O
Receive Signaling Output from Framer 6.
V6
RSIG7
O
Receive Signaling Output from Framer 7.
K5
RSIG8
O
Receive Signaling Output from Framer 8.
U10
RSIG9
O
Receive Signaling Output from Framer 9.
Y11
RSIG10
O
Receive Signaling Output from Framer 10.
W19
RSIG11
O
Receive Signaling Output from Framer 11.
U20
RSIG12
O
Receive Signaling Output from Framer 12.
E15
RSIG13/NC
O
Receive Signaling Output from Framer 13. NC on Four x Three.
K19
RSIG14/NC
O
Receive Signaling Output from Framer 14. NC on Four x Three.
C17
RSIG15/NC
O
Receive Signaling Output from Framer 15. NC on Four x Three.
A15
RSIG16/NC
O
Receive Signaling Output from Framer 16. NC on Four x Three.
B1
RSYNC1
I/O
Receive Frame/Multiframe Sync for Framer 1.
G1
RSYNC2
I/O
Receive Frame/Multiframe Sync for Framer 2.
D6
RSYNC3
I/O
Receive Frame/Multiframe Sync for Framer 3.
A7
RSYNC4
I/O
Receive Frame/Multiframe Sync for Framer 4.
N3
RSYNC5
I/O
Receive Frame/Multiframe Sync for Framer 5.
Y2
RSYNC6
I/O
Receive Frame/Multiframe Sync for Framer 6.
U5
RSYNC7
I/O
Receive Frame/Multiframe Sync for Framer 7.
J4
RSYNC8
I/O
Receive Frame/Multiframe Sync for Framer 8.
T11
RSYNC9
I/O
Receive Frame/Multiframe Sync for Framer 9.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
10
V13
RSYNC10
I/O
Receive Frame/Multiframe Sync for Framer 10.
V15
RSYNC11
I/O
Receive Frame/Multiframe Sync for Framer 11.
P18
RSYNC12
I/O
Receive Frame/Multiframe Sync for Framer 12.
J17
RSYNC13/NC
I/O
Receive Frame/Multiframe Sync for Framer 13. NC on Four x Three.
J19
RSYNC14/NC
I/O
Receive Frame/Multiframe Sync for Framer 14. NC on Four x Three.
B17
RSYNC15/NC
I/O
Receive Frame/Multiframe Sync for Framer 15. NC on Four x Three.
B12
RSYNC16/NC
I/O
Receive Frame/Multiframe Sync for Framer 16. NC on Four x Three.
B5
SYSCLK1
I
System Clock for Framer 1.
E2
SYSCLK2
I
System Clock for Framer 2.
E5
SYSCLK3
I
System Clock for Framer 3.
B8
SYSCLK4
I
System Clock for Framer 4.
M4
SYSCLK5
I
System Clock for Framer 5.
T2
SYSCLK6
I
System Clock for Framer 6.
Y5
SYSCLK7
I
System Clock for Framer 7.
W3
SYSCLK8
I
System Clock for Framer 8.
T4
SYSCLK9
I
System Clock for Framer 9.
Y9
SYSCLK10
I
System Clock for Framer 10.
U12
SYSCLK11
I
System Clock for Framer 11.
R17
SYSCLK12
I
System Clock for Framer 12.
E13
SYSCLK13/NC
I
System Clock for Framer 13. NC on Four x Three.
N18
SYSCLK14/NC
I
System Clock for Framer 14. NC on Four x Three.
E20
SYSCLK15/NC
I
System Clock for Framer 15. NC on Four x Three.
C14
SYSCLK16/NC
I
System Clock for Framer 16. NC on Four x Three.
D1
TCLK1
I
Transmit Clock for Framer 1.
H5
TCLK2
I
Transmit Clock for Framer 2.
C5
TCLK3
I
Transmit Clock for Framer 3.
A5
TCLK4
I
Transmit Clock for Framer 4.
R1
TCLK5
I
Transmit Clock for Framer 5.
Y3
TCLK6
I
Transmit Clock for Framer 6.
T6
TCLK7
I
Transmit Clock for Framer 7.
K2
TCLK8
I
Transmit Clock for Framer 8.
U13
TCLK9
I
Transmit Clock for Framer 9.
Y13
TCLK10
I
Transmit Clock for Framer 10.
T18
TCLK11
I
Transmit Clock for Framer 11.
P16
TCLK12
I
Transmit Clock for Framer 12.
K16
TCLK13/NC
I
Transmit Clock for Framer 13. NC on Four x Three.
F19
TCLK14/NC
I
Transmit Clock for Framer 14. NC on Four x Three.
E17
TCLK15/NC
I
Transmit Clock for Framer 15. NC on Four x Three.
C11
TCLK16/NC
I
Transmit Clock for Framer 16. NC on Four x Three.
C3
TNEG1
O
Transmit Negative Data from Framer 1.
J1
TNEG2
O
Transmit Negative Data from Framer 2.
F5
TNEG3
O
Transmit Negative Data from Framer 3.
A10
TNEG4
O
Transmit Negative Data from Framer 4.
L1
TNEG5
O
Transmit Negative Data from Framer 5.
V2
TNEG6
O
Transmit Negative Data from Framer 6.
V8
TNEG7
O
Transmit Negative Data from Framer 7.
P5
TNEG8
O
Transmit Negative Data from Framer 8.
U14
TNEG9
O
Transmit Negative Data from Framer 9.
V12
TNEG10
O
Transmit Negative Data from Framer 10.
W18
TNEG11
O
Transmit Negative Data from Framer 11.
T19
TNEG12
O
Transmit Negative Data from Framer 12.
D11
TNEG13/NC
O
Transmit Negative Data from Framer 13. NC on Four x Three.
K18
TNEG14/NC
O
Transmit Negative Data from Framer 14. NC on Four x Three.
C19
TNEG15/NC
O
Transmit Negative Data from Framer 15. NC on Four x Three.
B15
TNEG16/NC
O
Transmit Negative Data from Framer 16. NC on Four x Three.
B3
TPOS1
O
Transmit Positive Data from Framer 1.
J2
TPOS2
O
Transmit Positive Data from Framer 2.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
11
J5
TPOS3
O
Transmit Positive Data from Framer 3.
B10
TPOS4
O
Transmit Positive Data from Framer 4.
L2
TPOS5
O
Transmit Positive Data from Framer 5.
W1
TPOS6
O
Transmit Positive Data from Framer 6.
W7
TPOS7
O
Transmit Positive Data from Framer 7.
R3
TPOS8
O
Transmit Positive Data from Framer 8.
T14
TPOS9
O
Transmit Positive Data from Framer 9.
Y10
TPOS10
O
Transmit Positive Data from Framer 10.
V18
TPOS11
O
Transmit Positive Data from Framer 11.
V20
TPOS12
O
Transmit Positive Data from Framer 12.
E12
TPOS13/NC
O
Transmit Positive Data from Framer 13. NC on Four x Three.
N19
TPOS14/NC
O
Transmit Positive Data from Framer 14. NC on Four x Three.
B19
TPOS15/NC
O
Transmit Positive Data from Framer 15. NC on Four x Three.
B14
TPOS16/NC
O
Transmit Positive Data from Framer 16. NC on Four x Three.
B4
TSER1
I
Transmit Serial Data for Framer 1.
E1
TSER2
I
Transmit Serial Data for Framer 2.
F3
TSER3
I
Transmit Serial Data for Framer 3.
D7
TSER4
I
Transmit Serial Data for Framer 4.
L5
TSER5
I
Transmit Serial Data for Framer 5.
T1
TSER6
I
Transmit Serial Data for Framer 6.
Y6
TSER7
I
Transmit Serial Data for Framer 7.
T3
TSER8
I
Transmit Serial Data for Framer 8.
M16
TSER9
I
Transmit Serial Data for Framer 9.
W9
TSER10
I
Transmit Serial Data for Framer 10.
W16
TSER11
I
Transmit Serial Data for Framer 11.
W20
TSER12
I
Transmit Serial Data for Framer 12.
D13
TSER13/NC
I
Transmit Serial Data for Framer 13. NC on Four x Three.
F17
TSER14/NC
I
Transmit Serial Data for Framer 14. NC on Four x Three.
D18
TSER15/NC
I
Transmit Serial Data for Framer 15. NC on Four x Three.
A18
TSER16/NC
I
Transmit Serial Data for Framer 16. NC on Four x Three.
C4
TSIG1
I
Transmit Signaling Input for Framer 1.
F1
TSIG2
I
Transmit Signaling Input for Framer 2.
G4
TSIG3
I
Transmit Signaling Input for Framer 3.
C10
TSIG4
I
Transmit Signaling Input for Framer 4.
L3
TSIG5
I
Transmit Signaling Input for Framer 5.
U2
TSIG6
I
Transmit Signaling Input for Framer 6.
V9
TSIG7
I
Transmit Signaling Input for Framer 7.
R5
TSIG8
I
Transmit Signaling Input for Framer 8.
U15
TSIG9
I
Transmit Signaling Input for Framer 9.
V10
TSIG10
I
Transmit Signaling Input for Framer 10.
U18
TSIG11
I
Transmit Signaling Input for Framer 11.
R18
TSIG12
I
Transmit Signaling Input for Framer 12.
E11
TSIG13/NC
I
Transmit Signaling Input for Framer 13. NC on Four x Three.
P19
TSIG14/NC
I
Transmit Signaling Input for Framer 14. NC on Four x Three.
B20
TSIG15/NC
I
Transmit Signaling Input for Framer 15. NC on Four x Three.
A16
TSIG16/NC
I
Transmit Signaling Input for Framer 16. NC on Four x Three.
A3
TSSYNC1
I
Transmit System Sync for Framer 1.
F2
TSSYNC2
I
Transmit System Sync for Framer 2.
G5
TSSYNC3
I
Transmit System Sync for Framer 3.
E8
TSSYNC4
I
Transmit System Sync for Framer 4.
L4
TSSYNC5
I
Transmit System Sync for Framer 5.
U1
TSSYNC6
I
Transmit System Sync for Framer 6.
Y7
TSSYNC7
I
Transmit System Sync for Framer 7.
R4
TSSYNC8
I
Transmit System Sync for Framer 8.
T15
TSSYNC9
I
Transmit System Sync for Framer 9.
W8
TSSYNC10
I
Transmit System Sync for Framer 10.
Y17
TSSYNC11
I
Transmit System Sync for Framer 11.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
12
U19
TSSYNC12
I
Transmit System Sync for Framer 12.
C13
TSSYNC13/NC
I
Transmit System Sync for Framer 13. NC on Four x Three.
R20
TSSYNC14/NC
I
Transmit System Sync for Framer 14. NC on Four x Three.
D20
TSSYNC15/NC
I
Transmit System Sync for Framer 15. NC on Four x Three.
A17
TSSYNC16/NC
I
Transmit System Sync for Framer 16. NC on Four x Three.
E3
TSYNC1
I/O
Transmit Sync for Framer 1.
F4
TSYNC2
I/O
Transmit Sync for Framer 2.
E7
TSYNC3
I/O
Transmit Sync for Framer 3.
A4
TSYNC4
I/O
Transmit Sync for Framer 4.
R2
TSYNC5
I/O
Transmit Sync for Framer 5.
W5
TSYNC6
I/O
Transmit Sync for Framer 6.
T5
TSYNC7
I/O
Transmit Sync for Framer 7.
M5
TSYNC8
I/O
Transmit Sync for Framer 8.
T13
TSYNC9
I/O
Transmit Sync for Framer 9.
W13
TSYNC10
I/O
Transmit Sync for Framer 10.
U16
TSYNC11
I/O
Transmit Sync for Framer 11.
N16
TSYNC12
I/O
Transmit Sync for Framer 12.
J16
TSYNC13/NC
I/O
Transmit Sync for Framer 13. NC on Four x Three.
F18
TSYNC14/NC
I/O
Transmit Sync for Framer 14. NC on Four x Three.
C15
TSYNC15/NC
I/O
Transmit Sync for Framer 15. NC on Four x Three.
D12
TSYNC16/NC
I/O
Transmit Sync for Framer 16. NC on Four x Three.
Y16
WR*
I
Write Input.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
13
3. DS21FF42 (Four x Four) PCB Land Pattern
Figure 3-1
The diagram shown below is the lead pattern that will be placed on the target PCB. This is
the same pattern that would be seen as viewed through the MCM from the top.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A
rpos
1
rclk
1
ts
sync
1
tsyn
c
4
tclk
4
dvss
1
rsyn
c
4
rch
blk
4
rneg
4
tneg
4
dvss
4
rser
16
test
rpos
16
rsig
16
tsig
16
ts
sync
16
tser
16
jtdof
rpos
15
B
rsyn
c
1
rneg
1
tpos
1
tser
1
sys
clk
1
clksi
8
mclk
sys
clk
4
rclk
4
tpos
4
dvdd
4
rsyn
c
16
rneg
16
tpos
16
tneg
16
rch
blk
16
rsyn
c
15
rch
blk
15
tpos
15
tsig
15
C
rser
1
rch
blk
1
tneg
1
tsig
1
tclk
3
rser
3
dvdd
1
rser4
rpos
4
tsig
4
tclk
16
rclk
16
ts
sync
13
sys
clk
16
tsyn
c
15
rser
15
rsig
15
rclk
15
tneg
15
rneg
15
D
tclk
1
dvdd
1
rsig
1
rsig
3
dvss
1
rsyn
c
3
tser
4
rsig4
rneg
3
rclk
3
tneg
13
tsyn
c
16
tser
13
rclk
13
rpos
13
rch
blk
13
dvdd
4
tser
15
dvss
4
ts
sync
15
E
tser
2
sys
clk
2
tsyn
c
1
dvdd
1
sys
clk
3
rch
blk
3
tsyn
c
3
ts
sync
4
dvss
1
jtdi
tsig
13
tpos
13
sys
clk
13
rneg
13
rsig
13
rser
13
tclk
15
rd*
cs4*
sys
clk
15
F
tsig
2
ts
sync
2
tser
3
tsyn
c
2
tneg
3
dvdd
4
tser
14
tsyn
c
14
tclk
14
rser
14
G
rsyn
c
2
rsig
2
rch
blk
2
tsig
3
ts
sync
3
int*
A6
A4
A2
A0
H
rpos
2
rneg
2
rser
2
rpos
3
tclk
2
jtms
A7
A5
A3
A1
J
tneg
2
tpos
2
rclk
8
rsyn
c
8
tpos
3
tsyn
c
13
rsyn
c
13
rpos
14
rsyn
c
14
dvss
4
K
rclk
2
tclk
8
dvdd
2
dvss
2
rsig
8
tclk
13
jtrst*
tneg
14
rsig
14
rch
blk
14
L
tneg
5
tpos
5
tsig
5
ts
sync
5
tser
5
dvdd
3
D6
D4
D2
D0
M
rpos
5
rneg
5
rclk
5
sys
clk
5
tsyn
c
8
tser
9
D7
D5
D3
D1
N
rch
blk
5
rsig
5
rsyn
c
5
rser
8
rch
blk
8
tsyn
c
12
rclk
12
sys
clk
14
tpos
14
rneg
14
P
rser
5
dvdd
2
rneg
8
rpos
8
tneg
8
tclk
12
mux
rsyn
c
12
tsig
14
rclk
14
R
tclk
5
tsyn
c
5
tpos
8
ts
sync
8
tsig
8
dvss
3
sys
clk
12
tsig
12
rpos
12
ts
sync
14
T
tser
6
sys
clk
6
tser
8
sys
clk
9
tsyn
c
7
tclk
7
rser
7
cs1*
rclk
9
rpos
9
rsyn
c
9
dvdd
3
tsyn
c
9
tpos
9
ts
sync
9
rser
12
jtdot
tclk
11
tneg
12
rneg
12
U
ts
sync
6
tsig
6
dvss
2
dvss
3
rsyn
c
7
rch
blk
7
dvdd
2
dvss
2
rneg
9
rsig
9
rser
9
sys
clk
11
tclk
9
tneg
9
tsig
9
tsyn
c
11
rch
blk
12
tsig
11
tssy
nc
12
rsig
12
V
rclk
6
tneg
6
rneg
6
rsig
6
rpos
7
rsig
7
rneg
7
tneg
7
tsig
7
tsig
10
rpos
10
tneg
10
rsyn
c
10
jtclk
rsyn
c
11
rser
11
rch
blk
11
tpos
11
dvdd
3
tpos
12
W
tpos
6
rpos
6
sys
clk
8
rser
6
tsyn
c
6
rclk
7
tpos
7
ts
sync
10
tser
10
rclk
10
rneg
10
rch
blk
10
tsyn
c
10
fs1
bts
tser
11
rneg
11
tneg
11
rsig
11
tser
12
Y
rch
blk
6
rsyn
c
6
tclk
6
cs2*
sys
clk
7
tser
7
ts
sync
7
rch
blk
9
sys
clk
10
tpos
10
rsig
10
rser
10
tclk
10
fs0
cs3*
wr*
ts
sync
11
rclk
11
rpos
11
dvss
3
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
14
4. DS21FT42 (Four x Three) PCB Land Pattern
Figure 4-1
The diagram shown below is the lead pattern that will be placed on the target PCB. This is
the same pattern that would be seen as viewed through the MCM from the top.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A
rpos
1
rclk
1
ts
sync
1
tsyn
c
4
tclk
4
dvss
1
rsyn
c
4
rch
blk
4
rneg
4
tneg
4
nc
nc
test
ns
ns
nc
nc
nc
nc
nc
B
rsyn
c
1
rneg
1
tpos
1
tser
1
sys
clk
1
clksi
8
mclk
sys
clk
4
rclk
4
tpos
4
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
C
rser
1
rch
blk
1
tneg
1
tsig
1
tclk
3
rser
3
dvdd
1
rser4
rpos
4
tsig
4
nc
nc
nc
nc
ns
nc
nc
nc
nc
nc
D
tclk
1
dvdd
1
rsig
1
rsig
3
dvss
1
rsyn
c
3
tser
4
rsig4
rneg
3
rclk
3
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
E
tser
2
sys
clk
2
tsyn
c
1
dvdd
1
sys
clk
3
rch
blk
3
tsyn
c
3
ts
sync
4
dvss
1
jtdi
nc
nc
nc
nc
nc
nc
nc
rd*
nc
nc
F
tsig
2
ts
sync
2
tser
3
tsyn
c
2
tneg
3
nc
nc
nc
nc
nc
G
rsyn
c
2
rsig
2
rch
blk
2
tsig
3
ts
sync
3
int*
A6
A4
A2
A0
H
rpos
2
rneg
2
rser
2
rpos
3
tclk
2
jtms
A7
A5
A3
A1
J
tneg
2
tpos
2
rclk
8
rsyn
c
8
tpos
3
nc
nc
nc
nc
nc
K
rclk
2
tclk
8
dvdd
2
dvss
2
rsig
8
nc
jtrst*
nc
nc
nc
L
tneg
5
tpos
5
tsig
5
ts
sync
5
tser
5
dvdd
3
D6
D4
D2
D0
M
rpos
5
rneg
5
rclk
5
sys
clk
5
tsyn
c
8
tser
9
D7
D5
D3
D1
N
rch
blk
5
rsig
5
rsyn
c
5
rser
8
rch
blk
8
tsyn
c
12
rclk
12
nc
nc
nc
P
rser
5
dvdd
2
rneg
8
rpos
8
tneg
8
tclk
12
mux
rsyn
c
12
nc
nc
R
tclk
5
tsyn
c
5
tpos
8
ts
sync
8
tsig
8
dvss
3
sys
clk
12
tsig
12
rpos
12
nc
T
tser
6
sys
clk
6
tser
8
sys
clk
9
tsyn
c
7
tclk
7
rser
7
cs1*
rclk
9
rpos
9
rsyn
c
9
dvdd
3
tsyn
c
9
tpos
9
ts
sync
9
rser
12
jtdot
tclk
11
tneg
12
rneg
12
U
ts
sync
6
tsig
6
dvss
2
dvss
3
rsyn
c
7
rch
blk
7
dvdd
2
dvss
2
rneg
9
rsig
9
rser
9
sys
clk
11
tclk
9
tneg
9
tsig
9
tsyn
c
11
rch
blk
12
tsig
11
tssy
nc
12
rsig
12
V
rclk
6
tneg
6
rneg
6
rsig
6
rpos
7
rsig
7
rneg
7
tneg
7
tsig
7
tsig
10
rpos
10
tneg
10
rsyn
c
10
jtclk
rsyn
c
11
rser
11
rch
blk
11
tpos
11
dvdd
3
tpos
12
W
tpos
6
rpos
6
sys
clk
8
rser
6
tsyn
c
6
rclk
7
tpos
7
ts
sync
10
tser
10
rclk
10
rneg
10
rch
blk
10
tsyn
c
10
fs1
bts
tser
11
rneg
11
tneg
11
rsig
11
tser
12
Y
rch
blk
6
rsyn
c
6
tclk
6
cs2*
sys
clk
7
tser
7
ts
sync
7
rch
blk
9
sys
clk
10
tpos
10
rsig
10
rser
10
tclk
10
fs0
cs3*
wr*
ts
sync
11
rclk
11
rpos
11
dvss
3
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
15
5. DS21Q42 FEATURES
Four T1 DS1/ISDNPRI/J1 framing
transceivers
All four framers are fully independent
Each of the four framers contain dual twoframe
elastic store slip buffers that can connect to
asynchronous backplanes up to 8.192 MHz
8bit parallel control port that can be used
directly on either multiplexed or non
multiplexed buses (Intel or Motorola)
Programmable output clocks for Fractional T1
Fully independent transmit and receive
functionality
Integral HDLC controller with 64-byte buffers.
Configurable for FDL or DS0 operation
Generates and detects inband loop codes from
1 to 8 bits in length including CSU loop codes
Pin compatible with DS21Q44 E1 Enhanced
Quad E1 Framer
3.3V supply with 5V tolerant I/O; low power
CMOS
Available in 128pin TQFP package
IEEE 1149.1 support
FUNCTIONAL DIAGRAM
Receive
Framer
Elastic
Store
Transmit
Formatter
Elastic
Store
FRAMER #0
FRAMER #1
FRAMER #2
FRAMER #3
Control Port
DESCRIPTION
The DS21Q42 is an enhanced version of the DS21Q41B Quad T1 Framer. The DS21Q42
contains four framers that are configured and read through a common microprocessor
compatible parallel port. Each framer consists of a receive framer, receive elastic store,
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
16
transmit formatter and transmit elastic store. All four framers in the DS21Q42 are totally
independent, they do not share a common framing synchronizer. Also the transmit and
receive sides of each framer are totally independent. The dual two-frame elastic stores
contained in each of the four framers can be independently enabled and disabled as required.
The device fully meets all of the latest T1 specifications including ANSI T1.4031995,
ANSI T1.2311993, AT&T TR 62411 (1290), AT&T TR54016, and ITU G.704 and
G.706.
6. DS21Q42 INTRODUCTION
The DS21Q42 is a superset version of the popular DS21Q41 Quad T1 framer offering the
new features listed below. All of the original features of the DS21Q41 have been retained and
software created for the original device is transferable to the DS21Q42. Setting the Framer
Mode Select (FMS) pin to a logic 1 allows the DS21Q42 to be used as a replacement for the
DS21Q41 allowing an existing design to use most of the new features. FMS is tied to
ground for the DS21FF42/DS21FT42.
New Features
Additional hardware signaling capability including:
Receive signaling re-insertion to a backplane multiframe sync
Availability of signaling in a separate PCM data stream
Signaling freezing
Interrupt generated on change of signaling data
Full HDLC controller with 64byte buffers in both transmit and receive paths.
Configurable for FDL or DS0 access
Perchannel code insertion in both transmit and receive paths
Ability to monitor one DS0 channel in both the transmit and receive paths
RCL, RLOS, RRA, and RAIS alarms now interrupt on change of state
Detects AIS-CI
8.192 MHz clock synthesizer
Perchannel loopback
Ability to calculate and check CRC6 according to the Japanese standard
Ability to pass the FBit position through the elastic stores in the 2.048 MHz backplane
mode
IEEE 1149.1 support
Features
Four T1 DS1/ISDNPRI/J1 framing transceivers
All four framers are fully independent
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
17
Frames to D4, ESF, and SLC96 R formats
Each of the four framers contain dual twoframe elastic store slip buffers that can connect to
asynchronous backplanes up to 8.192 MHz
8bit parallel control port that can be used directly on either multiplexed or non
multiplexed buses (Intel or Motorola)
Extracts and inserts robbed bit signaling
Detects and generates yellow (RAI) and blue (AIS) alarms
Programmable output clocks for Fractional T1
Fully independent transmit and receive functionality
Generates and detects inband loop codes from 1 to 8 bits in length including CSU loop
codes
Contains ANSI one's density monitor and enforcer
Large path and line error counters including BPV, CV, CRC6, and framing bit errors
Pin compatible with DS21Q44 E1 Enhanced Quad E1 Framer
3.3V supply with 5V tolerant I/O; low power CMOS
Available in 128pin TQFP package
Functional Description
The receive side framer locates D4 (SLC96) or ESF multiframe boundaries as well as
detects incoming alarms including, carrier loss, loss of synchronization, blue (AIS) and
yellow alarms. If needed, the receive side elastic store can be enabled in order to absorb the
phase and frequency differences between the recovered T1 data stream and an asynchronous
backplane clock which is provided at the RSYSCLK input. The clock applied at the
RSYSCLK input can be either a 2.048 MHz clock or a 1.544 MHz clock. The RSYSCLK
can be a burst clock with speeds up to 8.192 MHz.
The transmit side of the DS21Q42 is totally independent from the receive side in both the
clock requirements and characteristics. Data off of a backplane can be passed through a
transmit side elastic store if necessary. The transmit formatter will provide the necessary
frame/multiframe data overhead for T1 transmission.
Reader's Note: This data sheet assumes a particular nomenclature of the T1 operating
environment. In each 125 us frame, there are 24 eightbit channels plus a framing bit. It is
assumed that the framing bit is sent first followed by channel 1. Each channel is made up of
eight bits which are numbered 1 to 8. Bit number 1 is the MSB and is transmitted first. Bit
number 8 is the LSB and is transmitted last. Throughout this data sheet, the following
abbreviations will be used:
D4
Superframe (12 frames per multiframe) Multiframe Structure
SLC96
Subscriber Loop Carrier 96 Channels (SLC96 is an AT&T registered trademark)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
18
ESF
Extended Superframe (24 frames per multiframe) Multiframe Structure
B8ZS
Bipolar with 8 Zero Substitution
CRC
Cyclical Redundancy Check
Ft
Terminal Framing Pattern in D4
Fs
Signaling Framing Pattern in D4
FPS
Framing Pattern in ESF
MF
Multiframe
BOC
Bit Oriented Code
HDLC
High Level Data Link Control
FDL
Facility Data Link
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
19
DS21Q42 ENHANCED QUAD T1 FRAMER Figure 6-1
VSS
VDD
FRAMER #1
FRAMER #3
FRAMER #2
FRAMER #0
Parallel & Test Control Port
(routed to all blocks)
D0 to D7 /
AD0 to AD7
FS1
BTS
INT*
WR*
(R/W*)
RD*
(DS*)
FS0
CS*
TEST
ALE
(AS)/
A6
A0 to A5,
A7
MUX
7
8
FMS
Framer Loopback
Payload Loopback
AIS Generation
B8ZS Encode
CRC Generation
Yellow Alarm Generation
Signaling Insertion
Clear Channel
FDL Insertion
F-Bit Insertion
Receive Side Framer
Transmit Side Formatter
BPV Counter
Alarm Detection
Per-Channel Code Insert
Elastic
Store
One's Density Enforcer
Loop Code Generation
One's Density Monitor
sync
data
clock
sync
data
clock
TSYNC
TCLK
TCHCLK
TSER
TCHBLK
RCHCLK
RCHBLK
RLCLK
RMSYNC
TSSYNC
TSYSCLK
RLINK
RSER
RSYSCLK
RSYNC
RFSYNC
TLINK
TLCLK
FDL Extraction
Timing Control
Elastic
Store
Sync Control
Timing Control
B8ZS Decoder
Synchronizer
Loop Code Detector
CRC/Frame Error Count
Signaling Extraction
Channel Marking
Signaling
Buffer
RSIG
Hardware
Signaling
Insertion
TSIG
Remote Loopback
8MCLK
Per-Channel Code Insert
Per-Channel Loopback
64-Byte Buffer
BOM Detection
RPOS
RCLK
RNEG
TPOS
TNEG
CLKS I
FDL Insertion
64-Byte Buffer
BOM Generation
HDLC Engine
DS0 Insertion
HDLC Engine
DS0 Insertion
Power
3
3
JTAG Port
JTRST*
JTMS
JTCLK
JTDI
JTDO
RLOS/LOTC1
1
1
1
Note:
1. Alternate pin functions. Consult data sheet for restrictions.
LOTC DET
&
MUX
8.192MHz Clock
Synthesizer
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
20
7. DS21Q42 PIN FUNCTION DESCRIPTION
This section describes the signals on the DS21Q42 die. Signals which are not bonded out
or have limited functionality in the DS21FT42 and DS21FF42 are noted in italics.
TRANSMIT SIDE PINS
Signal Name:
TCLK
Signal Description:
Transmit Clock
Signal Type:
Input
A 1.544 MHz primary clock. Used to clock data through the transmit side formatter.
Signal Name:
TSER
Signal Description:
Transmit Serial Data
Signal Type:
Input
Transmit NRZ serial data. Sampled on the falling edge of TCLK when the transmit side
elastic store is disabled. Sampled on the falling edge of TSYSCLK when the transmit side
elastic store is enabled.
Signal Name:
TCHCLK
Signal Description:
Transmit Channel Clock
Signal Type:
Output
A 192 KHz clock which pulses high during the LSB of each channel. Synchronous with
TCLK when the transmit side elastic store is disabled. Synchronous with TSYSCLK when
the transmit side elastic store is enabled. Useful for parallel to serial conversion of channel
data. This function is available when FMS = 1 (DS21Q41 emulation). This signal is not
bonded out in the DS21FF42/DS21FT42.
Signal Name:
TCHBLK
Signal Description:
Transmit Channel Block
Signal Type:
Output
A user programmable output that can be forced high or low during any of the 24 T1
channels. Synchronous with TCLK when the transmit side elastic store is disabled.
Synchronous with TSYSCLK when the transmit side elastic store is enabled. Useful for
blocking clocks to a serial UART or LAPD controller in applications where not all T1
channels are used such as Fractional T1, 384 Kbps service, 768 Kbps or ISDNPRI . Also
useful for locating individual channels in dropandinsert applications, for external per
channel loopback, and for perchannel conditioning. See Section 16 for details. This signal
is not bonded out in the DS21FF42/DS21FT42.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
21
Signal Name:
TSYSCLK
Signal Description:
Transmit System Clock
Signal Type:
Input
1.544 MHz or 2.048 MHz clock. Only used when the transmit side elastic store function is
enabled. Should be tied low in applications that do not use the transmit side elastic store.
Can be burst at rates up to 8.192 MHz. This pin is tied to the RSYSCLK signal in the
DS21FF42/DS21FT42.
Signal Name:
TLCLK
Signal Description:
Transmit Link Clock
Signal Type:
Output
4 KHz or 2 KHz (ZBTSI) demand clock for the TLINK input. See Section 19 for details.
This signal is not bonded out in the DS21FF42/DS21FT42.
Signal Name:
TLINK
Signal Description:
Transmit Link Data
Signal Type:
Input
If enabled via TCR1.2, this pin will be sampled on the falling edge of TCLK for data
insertion into either the FDL stream (ESF) or the Fsbit position (D4) or the Zbit position
(ZBTSI). See Section 19 for details. This signal is not bonded out in the
DS21FF42/DS21FT42.
Signal Name:
TSYNC
Signal Description:
Transmit Sync
Signal Type:
Input /Output
A pulse at this pin will establish either frame or multiframe boundaries for the transmit side.
Via TCR2.2, the DS21Q42 can be programmed to output either a frame or multiframe pulse
at this pin. If this pin is set to output pulses at frame boundaries, it can also be set via
TCR2.4 to output doublewide pulses at signaling frames. See Section 24 for details.
Signal Name:
TSSYNC
Signal Description:
Transmit System Sync
Signal Type:
Input
Only used when the transmit side elastic store is enabled. A pulse at this pin will establish
either frame or multiframe boundaries for the transmit side. Should be tied low in
applications that do not use the transmit side elastic store.
Signal Name:
TSIG
Signal Description:
Transmit Signaling Input
Signal Type:
Input
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
22
When enabled, this input will sample signaling bits for insertion into outgoing PCM T1
data stream. Sampled on the falling edge of TCLK when the transmit side elastic store is
disabled. Sampled on the falling edge of TSYSCLK when the transmit side elastic store is
enabled. This function is available when FMS = 0. FMS is tied to ground for the
DS21FF42/DS21FT42.
Signal Name:
TPOS
Signal Description:
Transmit Positive Data Output
Signal Type:
Output
Updated on the rising edge of TCLK with the bipolar data out of the transmit side formatter.
Can be programmed to source NRZ data via the Output Data Format (CCR1.6) control bit.
Signal Name:
TNEG
Signal Description:
Transmit Negative Data Output
Signal Type:
Output
Updated on the rising edge of TCLK with the bipolar data out of the transmit side formatter.
RECEIVE SIDE PINS
Signal Name:
RLINK
Signal Description:
Receive Link Data
Signal Type:
Output
Updated with either FDL data (ESF) or Fs bits (D4) or Z bits (ZBTSI) one RCLK before
the start of a frame. See Section 24 for details. This signal is not bonded out in the
DS21FF42/DS21FT42.
Signal Name:
RLCLK
Signal Description:
Receive Link Clock
Signal Type:
Output
A 4 KHz or 2 KHz (ZBTSI) clock for the RLINK output. This signal is not bonded out in
the DS21FF42/DS21FT42.
Signal Name:
RCHCLK
Signal Description:
Receive Channel Clock
Signal Type:
Output
A 192 KHz clock which pulses high during the LSB of each channel. Synchronous with
RCLK when the receive side elastic store is disabled. Synchronous with RSYSCLK when
the receive side elastic store is enabled. Useful for parallel to serial conversion of channel
data. This function is available when FMS = 1 (DS21Q41 emulation). This signal is not
bonded out in the DS21FF42/DS21FT42.
Signal Name:
RCHBLK
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
23
Signal Description:
Receive Channel Block
Signal Type:
Output
A user programmable output that can be forced high or low during any of the 24 T1
channels. Synchronous with RCLK when the receive side elastic store is disabled.
Synchronous with RSYSCLK when the receive side elastic store is enabled. Useful for
blocking clocks to a serial UART or LAPD controller in applications where not all T1
channels are used such as Fractional T1, 384K bps service, 768K bps, or ISDNPRI. Also
useful for locating individual channels in dropandinsert applications, for external per
channel loopback, and for perchannel conditioning. See Section 16 for details.
Signal Name:
RSER
Signal Description:
Receive Serial Data
Signal Type:
Output
Received NRZ serial data. Updated on rising edges of RCLK when the receive side elastic
store is disabled. Updated on the rising edges of RSYSCLK when the receive side elastic
store is enabled.
Signal Name:
RSYNC
Signal Description:
Receive Sync
Signal Type:
Input /Output
An extracted pulse, one RCLK wide, is output at this pin which identifies either frame
(RCR2.4 = 0) or multiframe (RCR2.4 = 1) boundaries. If set to output frame boundaries
then via RCR2.5, RSYNC can also be set to output doublewide pulses on signaling
frames. If the receive side elastic store is enabled via CCR1.2, then this pin can be enabled
to be an input via RCR2.3 at which a frame or multiframe boundary pulse is applied. See
Section 24 for details.
Signal Name:
RFSYNC
Signal Description:
Receive Frame Sync
Signal Type:
Output
An extracted 8 KHz pulse, one RCLK wide, is output at this pin which identifies frame
boundaries. This signal is not bonded out in the DS21FF42/DS21FT42.
Signal Name:
RMSYNC
Signal Description:
Receive Multiframe Sync
Signal Type:
Output
An extracted pulse, one RSYSCLK wide, is output at this pin which identifies multiframe
boundaries. If the receive side elastic store is disabled, then this output will output
multiframe boundaries associated with RCLK. This function is available when FMS = 1
(DS21Q41 emulation). This signal is not bonded out in the DS21FF42/DS21FT42.
Signal Name:
RSYSCLK
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
24
Signal Description:
Receive System Clock
Signal Type:
Input
1.544 MHz or 2.048 MHz clock. Only used when the elastic store function is enabled.
Should be tied low in applications that do not use the elastic store. Can be burst at rates up
to 8.192 MHz. This pin is tied to the TSYSCLK signal in the DS21FF42/DS21FT42.
Signal Name:
RSIG
Signal Description:
Receive Signaling Output
Signal Type:
Output
Outputs signaling bits in a PCM format. Updated on rising edges of RCLK when the
receive side elastic store is disabled. Updated on the rising edges of RSYSCLK when the
receive side elastic store is enabled. This function is available when FMS = 0. FMS is tied
to ground for the DS21FF42/DS21FT42.
Signal Name:
RLOS/LOTC
Signal Description:
Receive Loss of Sync / Loss of Transmit Clock
Signal Type:
Output
A dual function output that is controlled by the CCR3.5 control bit. This pin can be
programmed to either toggle high when the synchronizer is searching for the frame and
multiframe or to toggle high if the TCLK pin has not been toggled for 5 usec. This function
is available when FMS = 1 (DS21Q41 emulation). This signal is not bonded out in the
DS21FF42/DS21FT42.
Signal Name:
CLKSI
Signal Description:
8 MHz Clock Reference
Signal Type:
Input
A 1.544 MHz reference clock used in the generation of 8MCLK. This function is available
when FMS = 0. FMS is tied to ground for the DS21FF42/DS21FT42.
Signal Name:
8MCLK
Signal Description:
8 MHz Clock
Signal Type:
Output
A 8.192 MHz output clock that is referenced to the clock that is input at the CLKSI pin.
This function is available when FMS = 0. FMS is tied to ground for the
DS21FF42/DS21FT42.
Signal Name:
RPOS
Signal Description:
Receive Positive Data Input
Signal Type:
Input
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
25
Sampled on the falling edge of RCLK for data to be clocked through the receive side framer.
RPOS and RNEG can be tied together for an NRZ interface. Connecting RPOS to RNEG
disables the bipolar violation monitoring circuitry.
Signal Name:
RNEG
Signal Description:
Receive Negative Data Input
Signal Type:
Input
Sampled on the falling edge of RCLK for data to be clocked through the receive side framer.
RPOS and RNEG can be tied together for an NRZ interface. Connecting RPOS to RNEG
disables the bipolar violation monitoring circuitry.
Signal Name:
RCLK
Signal Description:
Receive Clock Input
Signal Type:
Input
Clock used to clock data through the receive side framer.
PARALLEL CONTROL PORT PINS
Signal Name:
INT*
Signal Description:
Interrupt
Signal Type:
Output
Flags host controller during conditions and change of conditions defined in the Status
Registers 1 and 2 and the HDLC Status Register. Active low, open drain output.
Signal Name:
FMS
Signal Description:
Framer Mode Select
Signal Type:
Input
Set low to select DS21Q42 feature set. Set high to select DS21Q41 emulation. FMS is tied
to ground for the DS21FF42/DS21FT42.
Signal Name:
MUX
Signal Description:
Bus Operation
Signal Type:
Input
Set low to select nonmultiplexed bus operation. Set high to select multiplexed bus
operation.
Signal Name:
D0 to D7/ AD0 to AD7
Signal Description:
Data Bus or Address/Data Bus
Signal Type:
Input /Output
In nonmultiplexed bus operation (MUX = 0), serves as the data bus. In multiplexed bus
operation (MUX = 1), serves as a 8bit multiplexed address / data bus.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
26
Signal Name:
A0 to A5, A7
Signal Description:
Address Bus
Signal Type:
Input
In nonmultiplexed bus operation (MUX = 0), serves as the address bus. In multiplexed bus
operation (MUX = 1), these pins are not used and should be tied low.
Signal Name:
ALE(AS)/A6
Signal Description:
A6 or Address Latch Enable (Address Strobe)
Signal Type:
Input
In nonmultiplexed bus operation (MUX = 0), serves as address bit 6. In multiplexed bus
operation (MUX = 1), serves to demultiplex the bus on a positivegoing edge.
Signal Name:
BTS
Signal Description:
Bus Type Select
Signal Type:
Input
Strap high to select Motorola bus timing; strap low to select Intel bus timing. This pin
controls the function of the RD*(DS*), ALE(AS), and WR*(R/W*) pins. If BTS = 1, then
these pins assume the function listed in parenthesis ().
Signal Name:
RD*(DS*)
Signal Description:
Read Input (Data Strobe)
Signal Type:
Input
RD* and DS* are active low signals. Note: DS is active high when MUX=1. Refer to bus
timing diagrams in section 25.
Signal Name:
FS0 AND FS1
Signal Description:
Framer Selects
Signal Type:
Input
Selects which of the four framers to be accessed.
Signal Name:
CS*
Signal Description:
Chip Select
Signal Type:
Input
Must be low to read or write to the device. CS* is an active low signal.
Signal Name:
WR*( R/W*)
Signal Description:
Write Input(Read/Write)
Signal Type:
Input
WR* is an active low signal.
TEST ACCESS PORT PINS
Signal Name:
TEST
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
27
Signal Description:
3State Control
Signal Type:
Input
Set high to 3state all output and I/O pins (including the parallel control port) when FMS =
1 or when FMS = 0 and JTRST* is tied low. Set low for normal operation. Ignored when
FMS = 0 and JTRST* = 1. Useful in board level testing. FMS is tied to ground for the
DS21FF42/DS21FT42.
Signal Name:
JTRST*
Signal Description:
IEEE 1149.1 Test Reset
Signal Type:
Input
This signal is used to asynchronously reset the test access port controller. At power up,
JTRST* must be set low and then high. This action will set the device into the DEVICE
ID mode allowing normal device operation. If boundary scan is not used and FMS = 0, this
pin should be held low. This function is available when FMS = 0. When FMS=1, this pin
is held LOW internally. This pin is pulled up internally by a 10K ohm resistor. FMS is
tied to ground for the DS21FF42/DS21FT42.
Signal Name:
JTMS
Signal Description:
IEEE 1149.1 Test Mode Select
Signal Type:
Input
This pin is sampled on the rising edge of JTCLK and is used to place the test port into the
various defined IEEE 1149.1 states. This pin is pulled up internally by a 10K ohm resistor.
If not used, this pin should be left unconnected. This function is available when FMS = 0.
FMS is tied to ground for the DS21FF42/DS21FT42.
Signal Name:
JTCLK
Signal Description:
IEEE 1149.1 Test Clock Signal
Signal Type:
Input
This signal is used to shift data into JTDI pin on the rising edge and out of JTDO pin on
the falling edge. If not used, this pin should be connected to VSS. This function is available
when FMS = 0. FMS is tied to ground for the DS21FF42/DS21FT42.
Signal Name:
JTDI
Signal Description:
IEEE 1149.1 Test Data Input
Signal Type:
Input
Test instructions and data are clocked into this pin on the rising edge of JTCLK. This pin
is pulled up internally by a 10K ohm resistor. If not used, this pin should be left
unconnected. This function is available when FMS = 0. FMS is tied to ground for the
DS21FF42/DS21FT42.
Signal Name:
JTDO
Signal Description:
IEEE 1149.1 Test Data Output
Signal Type:
Output
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
28
Test instructions and data are clocked out of this pin on the falling edge of JTCLK. If not
used, this pin should be left unconnected. This function is available when FMS = 0. FMS
is tied to ground for the DS21FF42/DS21FT42.
SUPPLY PINS
Signal Name:
VDD
Signal Description:
Positive Supply
Signal Type:
Supply
2.97 to 3.63 volts.
Signal Name:
VSS
Signal Description:
Signal Ground
Signal Type:
Supply
0.0 volts.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
29
8. DS21Q42 REGISTER MAP
Register Map Sorted by Address Table 8-1
ADDRESS
R/W
REGISTER NAME
REGISTER
ABBREVIATION
00
R/W
HDLC Control
HCR
01
R/W
HDLC Status
HSR
02
R/W
HDLC Interrupt Mask
HIMR
03
R/W
Receive HDLC Information
RHIR
04
R/W
Receive Bit Oriented Code
RBOC
05
R
Receive HDLC FIFO
RHFR
06
R/W
Transmit HDLC Information
THIR
07
R/W
Transmit Bit Oriented Code
TBOC
08
W
Transmit HDLC FIFO
THFR
09
Not used
(set to 00H)
0A
R/W
Common Control 7
CCR7
0B
Not used
(set to 00H)
0C
Not used
(set to 00H)
0D
Not used
(set to 00H)
0E
Not used
(set to 00H)
0F
R
Device ID
IDR
10
R/W
Receive Information 3
RIR3
11
R/W
Common Control 4
CCR4
12
R/W
InBand Code Control
IBCC
13
R/W
Transmit Code Definition
TCD
14
R/W
Receive Up Code Definition
RUPCD
15
R/W
Receive Down Code Definition
RDNCD
16
R/W
Transmit Channel Control 1
TCC1
17
R/W
Transmit Channel Control 2
TCC2
18
R/W
Transmit Channel Control 3
TCC3
19
R/W
Common Control 5
CCR5
1A
R
Transmit DS0 Monitor
TDS0M
1B
R/W
Receive Channel Control 1
RCC1
1C
R/W
Receive Channel Control 2
RCC2
1D
R/W
Receive Channel Control 3
RCC3
1E
R/W
Common Control 6
CCR6
1F
R
Receive DS0 Monitor
RDS0M
20
R/W
Status 1
SR1
21
R/W
Status 2
SR2
22
R/W
Receive Information 1
RIR1
23
R
Line Code Violation Count 1
LCVCR1
24
R
Line Code Violation Count 2
CVCR2
25
R
Path Code Violation Count 1
PCVCR1
26
R
Path Code violation Count 2
PCVCR2
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
30
27
R
Multiframe Out of Sync Count 2
MOSCR2
28
R
Receive FDL Register
RFDL
29
R/W
Receive FDL Match 1
RMTCH1
2A
R/W
Receive FDL Match 2
RMTCH2
2B
R/W
Receive Control 1
RCR1
2C
R/W
Receive Control 2
RCR2
2D
R/W
Receive Mark 1
RMR1
2E
R/W
Receive Mark 2
RMR2
2F
R/W
Receive Mark 3
RMR3
30
R/W
Common Control 3
CCR3
31
R/W
Receive Information 2
RIR2
32
R/W
Transmit Channel Blocking 1
TCBR1
33
R/W
Transmit Channel blocking 2
TCBR2
34
R/W
Transmit Channel Blocking 3
TCBR3
35
R/W
Transmit Control 1
TCR1
36
R/W
Transmit Control 2
TCR2
37
R/W
Common Control 1
CCR1
38
R/W
Common Control 2
CCR2
39
R/W
Transmit Transparency 1
TTR1
3A
R/W
Transmit Transparency 2
TTR2
3B
R/W
Transmit Transparency 3
TTR3
3C
R/W
Transmit Idle 1
TIR1
3D
R/W
Transmit Idle 2
TIR2
3E
R/W
Transmit Idle 3
TIR3
3F
R/W
Transmit Idle Definition
TIDR
40
R/W
Transmit Channel 9
TC9
41
R/W
Transmit Channel 10
TC10
42
R/W
Transmit Channel 11
TC11
43
R/W
Transmit Channel 12
TC12
44
R/W
Transmit Channel 13
TC13
45
R/W
Transmit Channel 14
TC14
46
R/W
Transmit Channel 15
TC15
47
R/W
Transmit Channel 16
TC16
48
R/W
Transmit Channel 17
TC17
49
R/W
Transmit Channel 18
TC18
4A
R/W
Transmit Channel 19
TC19
4B
R/W
Transmit Channel 20
TC20
4C
R/W
Transmit Channel 21
TC21
4D
R/W
Transmit Channel 22
TC22
4E
R/W
Transmit Channel 23
TC23
4F
R/W
Transmit Channel 24
TC24
50
R/W
Transmit Channel 1
TC1
51
R/W
Transmit Channel 2
TC2
52
R/W
Transmit Channel 3
TC3
53
R/W
Transmit Channel 4
TC4
54
R/W
Transmit Channel 5
TC5
55
R/W
Transmit Channel 6
TC6
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
31
56
R/W
Transmit Channel 7
TC7
57
R/W
Transmit Channel 8
TC8
58
R/W
Receive Channel 17
RC17
59
R/W
Receive Channel 18
RC18
5A
R/W
Receive Channel 19
RC19
5B
R/W
Receive Channel 20
RC20
5C
R/W
Receive Channel 21
RC21
5D
R/W
Receive Channel 22
RC22
5E
R/W
Receive Channel 23
RC23
5F
R/W
Receive Channel 24
RC24
60
R
Receive Signaling 1
RS1
61
R
Receive Signaling 2
RS2
62
R
Receive Signaling 3
RS3
63
R
Receive Signaling 4
RS4
64
R
Receive Signaling 5
RS5
65
R
Receive Signaling 6
RS6
66
R
Receive Signaling 7
RS7
67
R
Receive Signaling 8
RS8
68
R
Receive Signaling 9
RS9
69
R
Receive Signaling 10
RS10
6A
R
Receive Signaling 11
RS11
6B
R
Receive Signaling 12
RS12
6C
R/W
Receive Channel Blocking 1
RCBR1
6D
R/W
Receive Channel Blocking 2
RCBR2
6E
R/W
Receive Channel Blocking 3
RCBR3
6F
R/W
Interrupt Mask 2
IMR2
70
R/W
Transmit Signaling 1
TS1
71
R/W
Transmit Signaling 2
TS2
72
R/W
Transmit Signaling 3
TS3
73
R/W
Transmit Signaling 4
TS4
74
R/W
Transmit Signaling 5
TS5
75
R/W
Transmit Signaling 6
TS6
76
R/W
Transmit Signaling 7
TS7
77
R/W
Transmit Signaling 8
TS8
78
R/W
Transmit Signaling 9
TS9
79
R/W
Transmit Signaling 10
TS10
7A
R/W
Transmit Signaling 11
TS11
7B
R/W
Transmit Signaling 12
TS12
7C
Not used
(set to 00H)
7D
R/W
Test 1
TEST1 (set to 00h)
7E
R/W
Transmit FDL Register
TFDL
7F
R/W
Interrupt Mask Register 1
IMR1
80
R/W
Receive Channel 1
RC1
81
R/W
Receive Channel 2
RC2
82
R/W
Receive Channel 3
RC3
83
R/W
Receive Channel 4
RC4
84
R/W
Receive Channel 5
RC5
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
32
85
R/W
Receive Channel 6
RC6
86
R/W
Receive Channel 7
RC7
87
R/W
Receive Channel 8
RC8
88
R/W
Receive Channel 9
RC9
89
R/W
Receive Channel 10
RC10
8A
R/W
Receive Channel 11
RC11
8B
R/W
Receive Channel 12
RC12
8C
R/W
Receive Channel 13
RC13
8D
R/W
Receive Channel 14
RC14
8E
R/W
Receive Channel 15
RC15
8F
R/W
Receive Channel 16
RC16
90
R/W
Receive HDLC DS0 Control Register 1
RDC1
91
R/W
Receive HDLC DS0 Control Register 2
RDC2
92
R/W
Transmit HDLC DS0 Control Register 1
TDC1
93
R/W
Transmit HDLC DS0 Control Register 2
TDC2
94
R/W
Interleave Bus Operation Register
IBO
95
Not used
(set to 00H)
96
R/W
Test 2
TEST2 (set to 00h)
97
Not used
(set to 00H)
98
Not used
(set to 00H)
99
Not used
(set to 00H)
9A
Not used
(set to 00H)
9B
Not used
(set to 00H)
9C
Not used
(set to 00H)
9D
Not used
(set to 00H)
9E
Not used
(set to 00H)
9F
Not used
(set to 00H)
NOTES:
1. Test Registers 1 and 2 are used only by the factory; these registers must be cleared (set to all zeros) on
power up initialization to insure proper operation.
2. Register banks AxH, BxH, CxH, DxH, ExH, and FxH are not accessible.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
33
9. PARALLEL PORT
The DS21Q42 is controlled via either a nonmultiplexed (MUX = 0) or a multiplexed (MUX
= 1) bus by an external microcontroller or microprocessor. The DS21Q42 can operate with
either Intel or Motorola bus timing configurations. If the BTS pin is tied low, Intel timing
will be selected; if tied high, Motorola timing will be selected. All Motorola bus signals are
listed in parenthesis (). See the timing diagrams in the A.C. Electrical Characteristics in
Section 25 for more details.
10. CONTROL, ID AND TEST REGISTERS
The operation of each framer within the DS21Q42 is configured via a set of eleven control
registers. Typically, the control registers are only accessed when the system is first powered
up. Once a channel in the DS21Q42 has been initialized, the control registers will only need
to be accessed when there is a change in the system configuration. There are two Receive
Control Register (RCR1 and RCR2), two Transmit Control Registers (TCR1 and TCR2),
and seven Common Control Registers (CCR1 to CCR7). Each of the eleven registers are
described in this section. There is a device Identification Register (IDR) at address 0Fh. The
MSB of this readonly register is fixed to a zero indicating that the DS21Q42 is present.
The E1 pinforpin compatible version of the DS21Q42 is the DS21Q44 and it also has an
ID register at address 0Fh and the user can read the MSB to determine which chip is present
since in the DS21Q42 the MSB will be set to a zero and in the DS21Q44 it will be set to a
one. The lower four bits of the IDR are used to display the die revision of the chip.
PowerUp Sequence
The DS21Q42 does not automatically clear its register space on powerup. After the
supplies are stable, each of the four framer's register space should be configured for operation
by writing to all of the internal registers. This includes setting the Test and all unused
registers to 00Hex.
This can be accomplished using a two-pass approach on each framer within the DS21Q42.
1.
Clear framer's register space by writing 00H to the addresses 00H through 09FH.
2.
Program required registers to achieve desired operating mode.
Note: When emulating the DS21Q41 feature set (FMS = 1), the full address space (00H
through 09FH) must be initialized. DS21Q41 emulation requires address pin A7 to be used.
FMS is tied to ground for the DS21FF42/DS21FT42.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
34
Finally, after the TSYSCLK and RSYSCLK inputs are stable, the ESR bit should be
toggled from a zero to a one (this step can be skipped if the elastic stores are disabled).
IDR: DEVICE IDENTIFICATION REGISTER (Address=0F Hex)
(MSB)
(LSB)
T1E1
0
0
0
ID3
ID2
ID1
ID0
SYMBOL
POSITION
NAME AND DESCRIPTION
T1E1
IDR.7
T1 or E1 Chip Determination Bit.
0=T1 chip
1=E1 chip
ID3
IDR.3
Chip Revision Bit 3. MSB of a decimal code that represents the chip
revision.
ID2
IDR.1
Chip Revision Bit 2.
ID1
IDR.2
Chip Revision Bit 1.
ID0
IDR.0
Chip Revision Bit 0. LSB of a decimal code that represents the chip
revision.
RCR1: RECEIVE CONTROL REGISTER 1 (Address=2B Hex)
(MSB)
(LSB)
LCVCRF
ARC
OOF1
OOF2
SYNCC
SYNCT
SYNCE
RESYNC
SYMBOL
POSITION
NAME AND DESCRIPTION
LCVCRF
RCR1.7
Line Code Violation Count Register Function Select.
0 = do not count excessive zeros
1 = count excessive zeros
ARC
RCR1.6
Auto Resync Criteria.
0 = Resync on OOF or RCL event
1 = Resync on OOF only
OOF1
RCR1.5
Out Of Frame Select 1.
0 = 2/4 frame bits in error
1 = 2/5 frame bits in error
OOF2
RCR1.4
Out Of Frame Select 2.
0 = follow RCR1.5
1 = 2/6 frame bits in error
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
35
SYNCC
RCR1.3
Sync Criteria.
In D4 Framing Mode.
0 = search for Ft pattern, then search for Fs pattern
1 = cross couple Ft and Fs pattern
In ESF Framing Mode.
0 = search for FPS pattern only
1 = search for FPS and verify with CRC6
SYNCT
RCR1.2
Sync Time.
0 = qualify 10 bits
1 = qualify 24 bits
SYNCE
RCR1.1
Sync Enable.
0 = auto resync enabled
1 = auto resync disabled
RESYNC
RCR1.0
Resync. When toggled from low to high, a resynchronization of the
receive side framer is initiated. Must be cleared and set again for a
subsequent resync.
RCR2: RECEIVE CONTROL REGISTER 2 (Address=2C Hex)
(MSB)
(LSB)
RCS
RZBTSI
RSDW
RSM
RSIO
RD4YM
FSBE
MOSCRF
SYMBOL
POSITION
NAME AND DESCRIPTION
RCS
RCR2.7
Receive Code Select. See Section 15 for more details.
0 = idle code (7F Hex)
1 = digital milliwatt code (1E/0B/0B/1E/9E/8B/8B/9E Hex)
RZBTSI
RCR2.6
Receive Side ZBTSI Enable.
0 = ZBTSI disabled
1 = ZBTSI enabled
RSDW
RCR2.5
RSYNC DoubleWide. (note: this bit must be set to zero when RCR2.4
= 1 or when RCR2.3 = 1)
0 = do not pulse double wide in signaling frames
1 = do pulse double wide in signaling frames
RSM
RCR2.4
RSYNC Mode Select. (A Don't Care if RSYNC is programmed as an
input)
0 = frame mode (see the timing in Section 24)
1 = multiframe mode (see the timing in Section 24)
RSIO
RCR2.3
RSYNC I/O Select. (note: this bit must be set to zero when CCR1.2 =
0)
0 = RSYNC is an output
1 = RSYNC is an input (only valid if elastic store enabled)
RD4YM
RCR2.2
Receive Side D4 Yellow Alarm Select.
0 = zeros in bit 2 of all channels
1 = a one in the Sbit position of frame 12
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
36
FSBE
RCR2.1
PCVCR FsBit Error Report Enable.
0 = do not report bit errors in Fsbit position; only Ft bit position
1 = report bit errors in Fsbit position as well as Ft bit position
MOSCRF
RCR2.0
Multiframe Out of Sync Count Register Function Select.
0 = count errors in the framing bit position
1 = count the number of multiframes out of sync
TCR1: TRANSMIT CONTROL REGISTER 1 (Address=35 Hex)
(MSB)
(LSB)
LOTCMC
TFPT
TCPT
TSSE
GB7S
TFDLS
TBL
TYEL
SYMBOL
POSITION
NAME AND DESCRIPTION
LOTCMC
TCR1.7
Loss Of Transmit Clock Mux Control. Determines whether the
transmit side formatter should switch to RCLK if the TCLK input
should fail to transition (see Figure 6-1 for details).
0 = do not switch to RCLK if TCLK stops
1 = switch to RCLK if TCLK stops
TFPT
TCR1.6
Transmit FBit Pass Through. (see note below)
0 = F bits sourced internally
1 = F bits sampled at TSER
TCPT
TCR1.5
Transmit CRC Pass Through. (see note below)
0 = source CRC6 bits internally
1 = CRC6 bits sampled at TSER during Fbit time
TSSE
TCR1.4
Software Signaling Insertion Enable. (see note below)
0 = no signaling is inserted in any channel
1 = signaling is inserted in all channels from the TS1-TS12 registers
(the TTR registers can be used to block insertion on a channel by
channel basis)
GB7S
TCR1.3
Global Bit 7 Stuffing. (see note below)
0 = allow the TTR registers to determine which channels containing
all zeros are to be Bit 7 stuffed
1 = force Bit 7 stuffing in all zero byte channels regardless of how the
TTR registers are programmed
TFDLS
TCR1.2
TFDL Register Select. (see note below)
0 = source FDL or Fs bits from the internal TFDL register (legacy
FDL support mode)
1 = source FDL or Fs bits from the internal HDLC/BOC controller or
the TLINK pin
TBL
TCR1.1
Transmit Blue Alarm. (see note below)
0 = transmit data normally
1 = transmit an unframed all one's code at TPOS and TNEG
TYEL
TCR1.0
Transmit Yellow Alarm. (see note below)
0 = do not transmit yellow alarm
1 = transmit yellow alarm
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
37
NOTE: For a description of how the bits in TCR1 affect the transmit side formatter, see Figure 24-15.
TCR2: TRANSMIT CONTROL REGISTER 2 (Address=36 Hex)
(MSB)
(LSB)
TEST1
TEST0
TZBTSI
TSDW
TSM
TSIO
TD4YM
TB7ZS
SYMBOL
POSITION
NAME AND DESCRIPTION
TEST1
TCR2.7
Test Mode Bit 1 for Output Pins. See Table 101.
TEST0
TCR2.6
Test Mode Bit 0 for Output Pins. See Table 101.
TZBTSI
TCR2.5
Transmit Side ZBTSI Enable.
0 = ZBTSI disabled
1 = ZBTSI enabled
TSDW
TCR2.4
TSYNC DoubleWide. (note: this bit must be set to zero when
TCR2.3=1 or when TCR2.2=0)
0 = do not pulse doublewide in signaling frames
1 = do pulse doublewide in signaling frames
TSM
TCR2.3
TSYNC Mode Select.
0 = frame mode (see the timing in Section 24)
1 = multiframe mode (see the timing in Section 24)
TSIO
TCR2.2
TSYNC I/O Select.
0 = TSYNC is an input
1 = TSYNC is an output
TD4YM
TCR2.1
Transmit Side D4 Yellow Alarm Select.
0 = zeros in bit 2 of all channels
1 = a one in the Sbit position of frame 12
TB7ZS
TCR2.0
Transmit Side Bit 7 Zero Suppression Enable.
0 = no stuffing occurs
1 = Bit 7 force to a one in channels with all zeros
OUTPUT PIN TEST MODES Table 10-1
TEST 1
TEST 0
EFFECT ON OUTPUT PINS
0
0
operate normally
0
1
force all of the selected framer's output pins 3state (excludes other
framers I/O pins and parallel port pins)
1
0
force all of the selected framer's output pins low (excludes other
framers I/O pins and parallel port pins)
1
1
force all of the selected framer's output pins high (excludes other
framers I/O pins and parallel port pins)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
38
CCR1: COMMON CONTROL REGISTER 1 (Address=37 Hex)
(MSB)
(LSB)
TESE
ODF
RSAO
TSCLKM
RSCLKM
RESE
PLB
FLB
SYMBOL
POSITION
NAME AND DESCRIPTION
TESE
CCR1.7
Transmit Elastic Store Enable.
0 = elastic store is bypassed
1 = elastic store is enabled
ODF
CCR1.6
Output Data Format.
0 = bipolar data at TPOS and TNEG
1 = NRZ data at TPOS; TNEG = 0
RSAO
CCR1.5
Receive Signaling All One's. This bit should not be enabled if
hardware signaling is being utilized. See Section 14 for more details.
0 = allow robbed signaling bits to appear at RSER
1 = force all robbed signaling bits at RSER to one
TSCLKM
CCR1.4
TSYSCLK Mode Select.
0 = if TSYSCLK is 1.544 MHz
1 = if TSYSCLK is 2.048 MHz
RSCLKM
CCR1.3
RSYSCLK Mode Select.
0 = if RSYSCLK is 1.544 MHz
1 = if RSYSCLK is 2.048 MHz
RESE
CCR1.2
Receive Elastic Store Enable.
0 = elastic store is bypassed
1 = elastic store is enabled
PLB
CCR1.1
Payload Loopback.
0 = loopback disabled
1 = loopback enabled
FLB
CCR1.0
Framer Loopback.
0 = loopback disabled
1 = loopback enabled
Payload Loopback
When CCR1.1 is set to a one, the DS21Q42 will be forced into Payload LoopBack (PLB). Normally, this
loopback is only enabled when ESF framing is being performed but can be enabled also in D4 framing
applications. In a PLB situation, the DS21Q42 will loop the 192 bits of payload data (with BPVs corrected) from
the receive section back to the transmit section. The FPS framing pattern, CRC6 calculation, and the FDL bits are
not looped back, they are reinserted by the DS21Q42. When PLB is enabled, the following will occur:
1. data will be transmitted from the TPOS and TNEG pins synchronous with RCLK instead of TCLK
2. all of the receive side signals will continue to operate normally
3. the TCHCLK and TCHBLK signals are forced low
4. data at the TSER, and TSIG pins is ignored
5. the TLCLK signal will become synchronous with RCLK instead of TCLK.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
39
Framer Loopback
When CCR1.0 is set to a one, the DS21Q42 will enter a Framer LoopBack (FLB) mode. This loopback is useful in
testing and debugging applications. In FLB, the DS21Q42 will loop data from the transmit side back to the receive
side. When FLB is enabled, the following will occur:
1. an unframed all one's code will be transmitted at TPOS and TNEG
2. data at RPOS and RNEG will be ignored
3. all receive side signals will take on timing synchronous with TCLK instead of RCLK
Please note that it is not acceptable to have RCLK tied to TCLK during this loopback because this will cause an
unstable condition.
CCR2: COMMON CONTROL REGISTER 2 (Address=38 Hex)
(MSB)
(LSB)
TFM
TB8ZS
TSLC96
TZSE
RFM
RB8ZS
RSLC96
RZSE
SYMBOL
POSITION
NAME AND DESCRIPTION
TFM
CCR2.7
Transmit Frame Mode Select.
0 = D4 framing mode
1 = ESF framing mode
TB8ZS
CCR2.6
Transmit B8ZS Enable.
0 = B8ZS disabled
1 = B8ZS enabled
TSLC96
CCR2.5
Transmit SLC96 / FsBit Insertion Enable. Only set this bit to a one
in D4 framing applications. Must be set to one to source the Fs pattern.
See Section 19 for details.
0 = SLC96/Fsbit insertion disabled
1 = SLC96/Fsbit insertion enabled
TZSE
CCR2.4
Transmit FDL Zero Stuffer Enable. Set this bit to zero if using the
internal HDLC/BOC controller instead of the legacy support for the
FDL. See Section 19 for details.
0 = zero stuffer disabled
1 = zero stuffer enabled
RFM
CCR2.3
Receive Frame Mode Select.
0 = D4 framing mode
1 = ESF framing mode
RB8ZS
CCR2.2
Receive B8ZS Enable.
0 = B8ZS disabled
1 = B8ZS enabled
RSLC96
CCR2.1
Receive SLC96 Enable. Only set this bit to a one in D4/SLC96
framing applications. See Section 19 for details.
0 = SLC96 disabled
1 = SLC96 enabled
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
40
RZSE
CCR2.0
Receive FDL Zero Destuffer Enable. Set this bit to zero if using the
internal HDLC/BOC controller instead of the legacy support for the
FDL. See Section 19 for details.
0 = zero destuffer disabled
1 = zero destuffer enabled
CCR3: COMMON CONTROL REGISTER 3 (Address=30 Hex)
(MSB)
(LSB)
RESMDM
TCLKSRC
RLOSF
RSMS
PDE
ECUS
TLOOP
TESMDM
SYMBOL
POSITION
NAME AND DESCRIPTION
RESMDM
CCR3.7
Receive Elastic Store Minimum Delay Mode. See Section 17 for
details.
0 = elastic stores operate at full two frame depth
1 = elastic stores operate at 32bit depth
TCLKSRC
CCR3.6
Transmit Clock Source Select. This function allows the user to
internally select RCLK as the clock source for the transmit side
formatter.
0 = Transmit side formatter clocked with signal applied at TCLK pin.
LOTC Mux function is operational (TCR1.7)
1 = Transmit side formatter clocked with RCLK.
RLOSF
CCR3.5
Function of the RLOS/LOTC Output. Active only when FMS = 1
(DS21Q41 emulation).
0 = Receive Loss of Sync (RLOS)
1 = Loss of Transmit Clock (LOTC)
FMS is tied to ground for the DS21FF42/DS21FT42.
RSMS
CCR3.4
RSYNC Multiframe Skip Control. Useful in framing format
conversions from D4 to ESF. This function is not available when the
receive side elastic store is enabled.
0 = RSYNC will output a pulse at every multiframe
1 = RSYNC will output a pulse at every other multiframe note: for this
bit to have any affect, the RSYNC must be set to output multiframe
pulses (RCR2.4=1 and RCR2.3=0).
PDE
CCR3.3
Pulse Density Enforcer Enable.
0 = disable transmit pulse density enforcer
1 = enable transmit pulse density enforcer
ECUS
CCR3.2
Error Counter Update Select. See Section 12 for details.
0 = update error counters once a second
1 = update error counters every 42 ms (333 frames)
TLOOP
CCR3.1
Transmit Loop Code Enable. See Section 20 for details.
0 = transmit data normally
1 = replace normal transmitted data with repeating code as defined in
TCD register
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
41
TESMDM
CCR3.0
Transmit Elastic Store Minimum Delay Mode. See Section 17 for
details.
0 = elastic stores operate at full two frame depth
1 = elastic stores operate at 32bit depth
Pulse Density Enforcer
The Framer always examines both the transmit and receive data streams for violations of the following rules
which are required by ANSI T1.403:
no more than 15 consecutive zeros
at least N ones in each and every time window of 8 x (N +1) bits where N = 1 through 23
Violations for the transmit and receive data streams are reported in the RIR2.0 and RIR2.1 bits respectively.
When the CCR3.3 is set to one, the DS21Q42 will force the transmitted stream to meet this requirement no
matter the content of the transmitted stream. When running B8ZS, the CCR3.3 bit should be set to zero since
B8ZS encoded data streams cannot violate the pulse density requirements.
CCR4: COMMON CONTROL REGISTER 4 (Address=11 Hex)
(MSB)
(LSB)
RSRE
RPCSI
RFSA1
RFE
RFF
THSE
TPCSI
TIRFS
SYMBOL
POSITION
NAME AND DESCRIPTION
RSRE
CCR4.7
Receive Side Signaling ReInsertion Enable. See Section 14 for
details.
0 = do not reinsert signaling bits into the data stream presented at the
RSER pin
1 = reinsert the signaling bits into data stream presented at the RSER
pin
RPCSI
CCR4.6
Receive PerChannel Signaling Insert. See Section 14 for more
details.
0 = do not use RCHBLK to determine which channels should have
signaling reinserted
1 = use RCHBLK to determine which channels should have signaling
reinserted
RFSA1
CCR4.5
Receive Force Signaling All Ones. See Section 14 for more details.
0 = do not force extracted robbedbit signaling bit positions to a one
1 = force extracted robbedbit signaling bit positions to a one
RFE
CCR4.4
Receive Freeze Enable. See Section 14 for details.
0 = no freezing of receive signaling data will occur
1 = allow freezing of receive signaling data at RSIG (and RSER if
CCR4.7 = 1).
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
42
RFF
CCR4.3
Receive Force Freeze. Freezes receive side signaling at RSIG (and
RSER if CCR4.7=1); will override Receive Freeze Enable (RFE). See
Section 14 for details.
0 = do not force a freeze event
1 = force a freeze event
THSE
CCR4.2
Transmit Hardware Signaling Insertion Enable. See Section 14 for
details.
0 = do not insert signaling from the TSIG pin into the data stream
presented at the TSER pin.
1 = Insert the signaling from the TSIG pin into data stream presented
at the TSER pin.
TPCSI
CCR4.1
Transmit PerChannel Signaling Insert. See Section 14 for details.
0 = do not use TCHBLK to determine which channels should have
signaling inserted from the TSIG pin.
1 = use TCHBLK to determine which channels should have signaling
inserted from the TSIG pin.
TIRFS
CCR4.0
Transmit Idle Registers (TIR) Function Select. See Section 15 for
timing details.
0 = TIRs define in which channels to insert idle code
1 = TIRs define in which channels to insert data from RSER (i.e., Per
= Channel Loopback function)
CCR5: COMMON CONTROL REGISTER 5 (Address=19 Hex)
(MSB)
(LSB)
TJC
TCM4
TCM3
TCM2
TCM1
TCM0
SYMBOL
POSITION
NAME AND DESCRIPTION
TJC
CCR5.7
Transmit Japanese CRC6 Enable.
0 = use ANSI/AT&T/ITU CRC6 calculation (normal operation)
1 = use Japanese standard JTG704 CRC6 calculation
CCR5.6
Not Assigned. Must be set to zero when written.
CCR5.5
Not Assigned. Must be set to zero when written.
TCM4
CCR5.4
Transmit Channel Monitor Bit 4. MSB of a channel decode that
determines which transmit channel data will appear in the TDS0M
register. See Section 13 for details.
TCM3
CCR5.3
Transmit Channel Monitor Bit 3.
TCM2
CCR5.2
Transmit Channel Monitor Bit 2.
TCM1
CCR5.1
Transmit Channel Monitor Bit 1.
TCM0
CCR5.0
Transmit Channel Monitor Bit 0. LSB of the channel decode.
CCR6: COMMON CONTROL REGISTER 6 (Address=1E Hex)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
43
(MSB)
(LSB)
RJC
RESALGN
TESALGN
RCM4
RCM3
RCM2
RCM1
RCM0
SYMBOL
POSITION
NAME AND DESCRIPTION
RJC
CCR6.7
Receive Japanese CRC6 Enable.
0 = use ANSI/AT&T/ITU CRC6 calculation (normal operation)
1 = use Japanese standard JTG704 CRC6 calculation
RESALGN
CCR6.6
Receive Elastic Store Align. Setting this bit from a zero to a one may
force the receive elastic store's write/read pointers to a minimum
separation of half a frame. No action will be taken if the pointer
separation is already greater or equal to half a frame. If pointer
separation is less then half a frame, the command will be executed
and data will be disrupted. Should be toggled after RSYSCLK has been
applied and is stable. Must be cleared and set again for a subsequent
align. See Section 17 for details.
TESALGN
CCR6.5
Transmit Elastic Store Align. Setting this bit from a zero to a one
may force the transmit elastic store's write/read pointers to a
minimum separation of half a frame. No action will be taken if the
pointer separation is already greater or equal to half a frame. If
pointer separation is less then half a frame, the command will be
executed and data will be disrupted. Should be toggled after
TSYSCLK has been applied and is stable. Must be cleared and set
again for a subsequent align. See Section 17 for details.
RCM4
CCR6.4
Receive Channel Monitor Bit 4. MSB of a channel decode that
determines which receive channel data will appear in the RDS0M
register. See Section 13 for details.
RCM3
CCR6.3
Receive Channel Monitor Bit 3.
RCM2
CCR6.2
Receive Channel Monitor Bit 2.
RCM1
CCR6.1
Receive Channel Monitor Bit 1.
RCM0
CCR6.0
Receive Channel Monitor Bit 0. LSB of the channel decode.
CCR7: COMMON CONTROL REGISTER 7 (Address=0A Hex)
(MSB)
(LSB)
RLB
RESR
TESR
SYMBOL
POSITION
NAME AND DESCRIPTION
CCR7.7
Not Assigned. Should be set to zero when written to.
RLB
CCR7.6
Remote Loopback.
0 = loopback disabled
1 = loopback enabled
RESR
CCR7.5
Receive Elastic Store Reset. Setting this bit from a zero to a one will
force the receive elastic store to a depth of one frame. Receive data is
lost during the reset. Should be toggled after RSYSCLK has been
applied and is stable. Do not leave this bit set high.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
44
TESR
CCR7.4
Transmit Elastic Store Reset. Setting this bit from a zero to a one will
force the transmit elastic store to a depth of one frame. Transmit data
is lost during the reset. Should be toggled after TSYSCLK has been
applied and is stable. Do not leave this bit set high.
CCR7.3
Not Assigned. Should be set to zero when written to.
CCR7.2
Not Assigned. Should be set to zero when written to.
CCR7.1
Not Assigned. Should be set to zero when written to.
CCR7.0
Not Assigned. Should be set to zero when written to.
Remote Loopback
When CCR7.6 is set to a one, the DS21Q42 will be forced into Remote LoopBack (RLB). In this loopback, data
input via the RPOS and RNEG pins will be transmitted back to the TPOS and TNEG pins. Data will continue to
pass through the receive side framer of the DS21Q42 as it would normally and the data from the transmit side
formatter will be ignored. Please see Figure 6-1 for more details.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
45
11. STATUS AND INFORMATION REGISTERS
There is a set of nine registers per channel that contain information on the current real time
status of a framer in the DS21Q42, Status Register 1 (SR1), Status Register 2 (SR2),
Receive Information Registers 1 to 3 (RIR1/RIR2/RIR3) and a set of four registers for the
onboard HDLC and BOC controller. The specific details on the four registers pertaining to
the HDLC and BOC controller are covered in Section 19 but they operate the same as the
other status registers in the DS21Q42 and this operation is described below.
When a particular event has occurred (or is occurring), the appropriate bit in one of these
nine registers will be set to a one. All of the bits in SR1, SR2, RIR1, RIR2, and RIR3
registers operate in a latched fashion. This means that if an event or an alarm occurs and a
bit is set to a one in any of the registers, it will remain set until the user reads that bit. The
bit will be cleared when it is read and it will not be set again until the event has occurred
again (or in the case of the RBL, RYEL, LRCL, and RLOS alarms, the bit will remain set
if the alarm is still present). There are bits in the four HDLC and BOC status registers that
are not latched and these bits are listed in Section 19.
The user will always precede a read of any of the nine registers with a write. The byte
written to the register will inform the DS21Q42 which bits the user wishes to read and have
cleared. The user will write a byte to one of these registers, with a one in the bit positions
he or she wishes to read and a zero in the bit positions he or she does not wish to obtain the
latest information on. When a one is written to a bit location, the read register will be
updated with the latest information. When a zero is written to a bit position, the read
register will not be updated and the previous value will be held. A write to the status and
information registers will be immediately followed by a read of the same register. The read
result should be logically AND'ed with the mask byte that was just written and this value
should be written back into the same register to insure that bit does indeed clear. This
second write step is necessary because the alarms and events in the status registers occur
asynchronously in respect to their access via the parallel port. This writeread write scheme
allows an external microcontroller or microprocessor to individually poll certain bits
without disturbing the other bits in the register. This operation is key in controlling the
DS21Q42 with higherorder software languages.
The SR1, SR2, and FDLS registers have the unique ability to initiate a hardware interrupt
via the INT* output pin. Each of the alarms and events in the SR1, SR2, and HSR can be
either masked or unmasked from the interrupt pin via the Interrupt Mask Register 1 (IMR1),
Interrupt Mask Register 2 (IMR2), and HDLC Interrupt Mask Register (HIMR) respectively.
The FIMR register is covered in Section 19. The INTERRUPT STATUS REGISTER can
be used to determine which framer is requesting interrupt servicing and the type of the
request: status or the HDLC controller.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
46
The interrupts caused by alarms in SR1 (namely RYEL, RCL, RBL, RLOS and LOTC) act
differently than the interrupts caused by events in SR1 and SR2 (namely LUP, LDN,
RSLIP, RMF, TMF, SEC, RFDL, TFDL, RMTCH, RAF, and RSC) and HIMR. The
alarm caused interrupts will force the INT* pin low whenever the alarm changes state (i.e.,
the alarm goes active or inactive according to the set/clear criteria in Table 11-1). The INT*
pin will be allowed to return high (if no other interrupts are present) when the user reads the
alarm bit that caused the interrupt to occur even if the alarm is still present.
The event caused interrupts will force the INT* pin low when the event occurs. The INT*
pin will be allowed to return high (if no other interrupts are present) when the user reads the
event bit that caused the interrupt to occur.
ISR: INTERRUPT STATUS REGISTER (Any address from A0H to FFH)
(MSB)
(LSB)
F3HDLC
F3SR
F2HDLC
F2SR
F1HDLC
F1SR
F0HDLC
F0SR
SYMBOL
POSITION
NAME AND DESCRIPTION
F3HDLC
ISR.7
FRAMER 3 HDLC CONTROLLER INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F3SR
ISR.6
FRAMER 3 SR1 or SR2 INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F2HDLC
ISR.5
FRAMER 2 HDLC CONTROLLER INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F2SR
ISR.4
FRAMER 2 SR1 or SR2 INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F1HDLC
ISR.3
FRAMER 1 HDLC CONTROLLER INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F1SR
ISR.2
FRAMER 1 SR1 or SR2 INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F0HDLC
ISR.1
FRAMER 0 HDLC CONTROLLER INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
F0SR
ISR.0
FRAMER 0 SR1 or SR2 INTERRUPT REQUEST.
0 = No interrupt request pending.
1 = Interrupt request pending.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
47
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
48
RIR1: RECEIVE INFORMATION REGISTER 1 (Address=22 Hex)
(MSB)
(LSB)
COFA
8ZD
16ZD
RESF
RESE
SEFE
B8ZS
FBE
SYMBOL
POSITION
NAME AND DESCRIPTION
COFA
RIR1.7
Change of Frame Alignment. Set when the last resync resulted in a
change of frame or multiframe alignment.
8ZD
RIR1.6
Eight Zero Detect. Set when a string of at least eight consecutive
zeros (regardless of the length of the string) have been received at
RPOS and RNEG.
16ZD
RIR1.5
Sixteen Zero Detect. Set when a string of at least sixteen consecutive
zeros (regardless of the length of the string) have been received at
RPOS and RNEG.
RESF
RIR1.4
Receive Elastic Store Full. Set when the receive elastic store buffer
fills and a frame is deleted.
RESE
RIR1.3
Receive Elastic Store Empty. Set when the receive elastic store
buffer empties and a frame is repeated.
SEFE
RIR1.2
Severely Errored Framing Event. Set when 2 out of 6 framing bits
(Ft or FPS) are received in error.
B8ZS
RIR1.1
B8ZS Code Word Detect. Set when a B8ZS code word is detected at
RPOS and RNEG independent of whether the B8ZS mode is selected
or not via CCR2.6. Useful for automatically setting the line coding.
FBE
RIR1.0
Frame Bit Error. Set when a Ft (D4) or FPS (ESF) framing bit is
received in error.
RIR2: RECEIVE INFORMATION REGISTER 2 (Address=31 Hex)
(MSB)
(LSB)
RLOSC
RCLC
TESF
TESE
TSLIP
RBLC
RPDV
TPDV
SYMBOL
POSITION
NAME AND DESCRIPTION
RLOSC
RIR2.7
Receive Loss of Sync Clear. Set when the framer achieves
synchronization; will remain set until read.
RCLC
RIR2.6
Receive Carrier Loss Clear. Set when the carrier signal is restored;
will remain set until read. See Table 11-1.
TESF
RIR2.5
Transmit Elastic Store Full. Set when the transmit elastic store buffer
fills and a frame is deleted.
TESE
RIR2.4
Transmit Elastic Store Empty. Set when the transmit elastic store
buffer empties and a frame is repeated.
TSLIP
RIR2.3
Transmit Elastic Store Slip Occurrence. Set when the transmit
elastic store has either repeated or deleted a frame.
RBLC
RIR2.2
Receive Blue Alarm Clear. Set when the Blue Alarm (AIS) is no
longer detected; will remain set until read. See Table 11-1.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
49
RPDV
RIR2.1
Receive Pulse Density Violation. Set when the receive data stream
does not meet the ANSI T1.403 requirements for pulse density.
TPDV
RIR2.0
Transmit Pulse Density Violation. Set when the transmit data stream
does not meet the ANSI T1.403 requirements for pulse density.
RIR3: RECEIVE INFORMATION REGISTER 3 (Address=10 Hex)
(MSB)
(LSB)
LORC
RAIS-CI
SYMBOL
POSITION
NAME AND DESCRIPTION
RIR3.7
Not Assigned. Could be any value when read.
RIR3.6
Not Assigned. Could be any value when read.
RIR3.5
Not Assigned. Could be any value when read.
LORC
RIR3.4
Loss of Receive Clock. Set when the RCLK pin has not transitioned
for at least 2 us (3 us ??1 us).
RIR3.3
Not Assigned. Could be any value when read.
RIR3.2
Not Assigned. Could be any value when read.
RIR3.1
Not Assigned. Could be any value when read.
RAIS-CI
RIR3.0
Receive AIS-CI Detect. Set when the AIS-CI pattern is detected.
SR1: STATUS REGISTER 1 (Address=20 Hex)
(MSB)
(LSB)
LUP
LDN
LOTC
RSLIP
RBL
RYEL
RCL
RLOS
SYMBOL
POSITION
NAME AND DESCRIPTION
LUP
SR1.7
Loop Up Code Detected. Set when the loop up code as defined in the
RUPCD register is being received. See Section 20 for details.
LDN
SR1.6
Loop Down Code Detected. Set when the loop down code as defined
in the RDNCD register is being received. See Section 20 for details.
LOTC
SR1.5
Loss of Transmit Clock. Set when the TCLK pin has not transitioned
for one channel time (or 5.2 us). Will force the RLOS/LOTC pin high
if enabled via CCR3.5. Also will force transmit side formatter to
switch to RCLK if so enabled via TCR1.7.
RSLIP
SR1.4
Receive Elastic Store Slip Occurrence. Set when the receive elastic
store has either repeated or deleted a frame.
RBL
SR1.3
Receive Blue Alarm. Set when an unframed all one's code is
received at RPOS and RNEG.
RYEL
SR1.2
Receive Yellow Alarm. Set when a yellow alarm is received at
RPOS and RNEG.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
50
RCL
SR1.1
Receive Carrier Loss. Set when a red alarm is received at RPOS and
RNEG.
RLOS
SR1.0
Receive Loss of Sync. Set when the device is not synchronized to the
receive T1 stream.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
51
ALARM CRITERIA Table 11-1
ALARM
SET CRITERIA
CLEAR CRITERIA
Blue Alarm (AIS) (see note 1
below)
when over a 3 ms window, 5 or
less zeros are received
when over a 3 ms window, 6 or
more zeros are received
Yellow Alarm (RAI)
1. D4 bit 2 mode(RCR2.2=0)
2. D4 12th Fbit mode
(RCR2.2=1; this mode is also
referred to as the "Japanese
Yellow Alarm")
3. ESF mode
when bit 2 of 256 consecutive
channels is set to zero for at least
254 occurrences
when the 12th framing bit is set
to one for two consecutive
occurrences
when 16 consecutive patterns of
00FF appear in the FDL
when bit 2 of 256 consecutive
channels is set to zero for less
than 254 occurrences
when the 12th framing bit is set
to zero for two consecutive
occurrences
when 14 or less patterns of 00FF
hex out of 16 possible appear in
the FDL
Red Alarm (RCL) (this alarm is
also referred to as Loss Of
Signal)
when 192 consecutive zeros are
received
when 14 or more ones out of 112
possible bit positions are received
starting with the first one
received
NOTES:
1. The definition of Blue Alarm (or Alarm Indication Signal) is an unframed all ones signal. Blue alarm
detectors should be able to operate properly in the presence of a 103 error rate and they should not falsely
trigger on a framed all ones signal. The blue alarm criteria in the DS21Q42 has been set to achieve this
performance. It is recommended that the RBL bit be qualified with the RLOS bit.
2. ANSI specifications use a different nomenclature than the DS21Q42 does; the following terms are equivalent:
RBL = AIS
RCL = LOS
RLOS = LOF
RYEL = RAI
SR2: STATUS REGISTER 2 (Address=21 Hex)
(MSB)
(LSB)
RMF
TMF
SEC
RFDL
TFDL
RMTCH
RAF
RSC
SYMBOL
POSITION
NAME AND DESCRIPTION
RMF
SR2.7
Receive Multiframe. Set on receive multiframe boundaries.
TMF
SR2.6
Transmit Multiframe. Set on transmit multiframe boundaries.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
52
SEC
SR2.5
One Second Timer. Set on increments of one second based on RCLK;
will be set in increments of 999 ms, 999 ms, and 1002 ms every 3
seconds.
RFDL
SR2.4
Receive FDL Buffer Full. Set when the receive FDL buffer (RFDL)
fills to capacity (8 bits).
TFDL
SR2.3
Transmit FDL Buffer Empty. Set when the transmit FDL buffer
(TFDL) empties.
RMTCH
SR2.2
Receive FDL Match Occurrence. Set when the RFDL matches
either RMTCH1 or RMTCH2.
RAF
SR2.1
Receive FDL Abort. Set when eight consecutive one's are received
in the FDL.
RSC
SR2.0
Receive Signaling Change. Set when the DS21Q42 detects a change
of state in any of the robbedbit signaling bits.
IMR1: INTERRUPT MASK REGISTER 1 (Address=7F Hex)
(MSB)
(LSB)
LUP
LDN
LOTC
SLIP
RBL
RYEL
RCL
RLOS
SYMBOL
POSITION
NAME AND DESCRIPTION
LUP
IMR1.7
Loop Up Code Detected.
0 = interrupt masked
1 = interrupt enabled
LDN
IMR1.6
Loop Down Code Detected.
0 = interrupt masked
1 = interrupt enabled
LOTC
IMR1.5
Loss of Transmit Clock.
0 = interrupt masked
1 = interrupt enabled
SLIP
IMR1.4
Elastic Store Slip Occurrence.
0 = interrupt masked
1 = interrupt enabled
RBL
IMR1.3
Receive Blue Alarm.
0 = interrupt masked
1 = interrupt enabled
RYE
IMR1.2
Receive Yellow Alarm.
0 = interrupt masked
1 = interrupt enabled
RCL
IMR1.1
Receive Carrier Loss.
0 = interrupt masked
1 = interrupt enabled
RLOS
IMR1.0
Receive Loss of Sync.
0 = interrupt masked
1 = interrupt enabled
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
53
IMR2: INTERRUPT MASK REGISTER 2 (Address=6F Hex)
(MSB)
(LSB)
RMF
TMF
SEC
RFDL
TFDL
RMTCH
RAF
RSC
SYMBOL
POSITION
NAME AND DESCRIPTION
RMF
IMR2.7
Receive Multiframe.
0 = interrupt masked
1 = interrupt enabled
TMF
IMR2.6
Transmit Multiframe.
0 = interrupt masked
1 = interrupt enabled
SEC
IMR2.5
One Second Timer.
0 = interrupt masked
1 = interrupt enabled
RFDL
IMR2.4
Receive FDL Buffer Full.
0 = interrupt masked
1 = interrupt enabled
TFDL
IMR2.3
Transmit FDL Buffer Empty.
0 = interrupt masked
1 = interrupt enabled
RMTCH
IMR2.2
Receive FDL Match Occurrence.
0 = interrupt masked
1 = interrupt enabled
RAF
IMR2.1
Receive FDL Abort.
0 = interrupt masked
1 = interrupt enabled
RSC
IMR2.0
Receive Signaling Change.
0 = interrupt masked
1 = interrupt enabled
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
54
12. ERROR COUNT REGISTERS
There are a set of three counters in each framer that record bipolar violations, excessive zeros,
errors in the CRC6 code words, framing bit errors, and number of multiframes that the
device is out of receive synchronization. Each of these three counters are automatically
updated on either one second boundaries (CCR3.2=0) or every 42 ms (CCR3.2=1) as
determined by the timer in Status Register 2 (SR2.5). Hence, these registers contain
performance data from either the previous second or the previous 42 ms. The user can use
the interrupt from the one second timer to determine when to read these registers. The user
has a full second (or 42 ms) to read the counters before the data is lost. All three counters
will saturate at their respective maximum counts and they will not rollover (note: only the
Line Code Violation Count Register has the potential to overflow but the bit error would
have to exceed 10
-2
before this would occur).
Line Code Violation Count Register (LCVCR)
Line Code Violation Count Register 1 (LCVCR1) is the most significant word and
LCVCR2 is the least significant word of a 16bit counter that records code violations
(CVs). CVs are defined as Bipolar Violations (BPVs) or excessive zeros. See Table 12-1 for
details of exactly what the LCVCRs count. If the B8ZS mode is set for the receive side via
CCR2.2, then B8ZS code words are not counted. This counter is always enabled; it is not
disabled during receive loss of synchronization (RLOS=1) conditions.
LCVCR1: LINE CODE VIOLATION COUNT REGISTER 1 (Address = 23 Hex)
LCVCR2: LINE CODE VIOLATION COUNT REGISTER 2 (Address = 24 Hex)
(MSB)
(LSB)
LCV15
LCV14
LCV13
LCV12
LCV11
LCV10
LCV9
LCV8
LCVCR1
LCV7
LCV6
LCV5
LCV4
LCV3
LCV2
LCV1
LCV0
LCVCR2
SYMBOL
POSITION
NAME AND DESCRIPTION
LCV15
LCVCR1.7
MSB of the 16bit code violation count
LCV0
LCVCR2.0
LSB of the 16bit code violation count
LINE CODE VIOLATION COUNTING ARRANGEMENTS Table 12-1
COUNT EXCESSIVE ZEROS?
(RCR1.7)
B8ZS ENABLED?
(CCR2.2)
WHAT IS COUNTED
IN THE LCVCRs
no
no
BPVs
yes
no
BPVs + 16 consecutive zeros
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
55
no
yes
BPVs (B8ZS code words not
counted)
yes
yes
BPV's + 8 consecutive zeros
Path Code Violation Count Register
(PCVCR) When the receive side of a framer is set to operate in the ESF framing mode (CCR2.3=1), PCVCR
will automatically be set as a 12bit counter that will record errors in the CRC6 code words. When set to operate
in the D4 framing mode (CCR2.3=0), PCVCR will automatically count errors in the Ft framing bit position. Via
the RCR2.1 bit, a framer can be programmed to also report errors in the Fs framing bit position. The PCVCR will
be disabled during receive loss of synchronization (RLOS=1) conditions. See Table 12-2 for a detailed
description of exactly what errors the PCVCR counts.
PCVCR1: PATH VIOLATION COUNT REGISTER 1 (Address = 25 Hex)
PCVCR2: PATH VIOLATION COUNT REGISTER 2 (Address = 26 Hex)
(MSB)
(LSB)
(note 1)
(note 1)
(note 1)
(note 1)
CRC/
FB11
CRC/
FB10
CRC/
FB9
CRC/
FB8
PCVCR1
CRC/
FB7
CRC/
FB6
CRC/
FB5
CRC/
FB4
CRC/
FB3
CRC/
FB2
CRC/
FB1
CRC/
FB0
PCVCR2
SYMBOL
POSITION
NAME AND DESCRIPTION
CRC/FB11
PCVCR1.3
MSB of the 12Bit CRC6 Error or Frame Bit Error Count (note
#2)
CRC/FB0
PCVCR2.0
LSB of the 12Bit CRC6 Error or Frame Bit Error Count (note
#2)
NOTES:
1. The upper nibble of the counter at address 25 is used by the Multiframes Out of Sync Count Register
2. PCVCR counts either errors in CRC code words (in the ESF framing mode; CCR2.3=1) or errors in the
framing bit position (in the D4 framing mode; CCR2.3=0).
PATH CODE VIOLATION COUNTING ARRANGEMENTS Table 12-2
FRAMING MODE
(CCR2.3)
COUNT Fs ERRORS?
(RCR2.1)
WHAT IS COUNTED
IN THE PCVCRs
D4
no
errors in the Ft pattern
D4
yes
errors in both the Ft & Fs patterns
ESF
don't care
errors in the CRC6 code words
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
56
MULTIFRAMES OUT OF SYNC COUNT REGISTER (MOSCR)
Normally the MOSCR is used to count the number of multiframes that the receive synchronizer is out of sync
(RCR2.0=1). This number is useful in ESF applications needing to measure the parameters Loss Of Frame Count
(LOFC) and ESF Error Events as described in AT&T publication TR54016. When the MOSCR is operated in this
mode, it is not disabled during receive loss of synchronization (RLOS=1) conditions. The MOSCR has alternate
operating mode whereby it will count either errors in the Ft framing pattern (in the D4 mode) or errors in the
FPS framing pattern (in the ESF mode). When the MOSCR is operated in this mode, it is disabled during receive
loss of synchronization (RLOS = 1)conditions. See Table 12-3 for a detailed description of what the MOSCR is
capable of counting.
MOSCR1: MULTIFRAMES OUT OF SYNC COUNT REGISTER 1 (Address = 25 Hex)
MOSCR2: MULTIFRAMES OUT OF SYNC COUNT REGISTER 2 (Address = 27 Hex)
(MSB)
(LSB)
MOS/
FB11
MOS/
FB10
MOS/
FB9
MOS/
FB8
(note 1)
(note 1)
(note 1)
(note 1)
MOSCR1
MOS/
FB7
MOS/
FB6
MOS/
FB5
MOS/
FB4
MOS/
FB3
MOS/
FB2
MOS/
FB1
MOS/
FB0
MOSCR2
SYMBOL
POSITION
NAME AND DESCRIPTION
MOS/FB11
MOSCR1.7
MSB of the 12Bit Multiframes Out of Sync or FBit Error Count
(note #2)
MOS/FB0
MOSCR2.0
LSB of the 12Bit Multiframes Out of Sync or FBit Error Count
(note #2)
NOTES:
1. The lower nibble of the counter at address 25 is used by the Path Code Violation Count Register
2. MOSCR counts either errors in framing bit position (RCR2.0=0) or the number of multiframes out of sync
(RCR2.0=1)
MULTIFRAMES OUT OF SYNC COUNTING ARRANGEMENTS Table 12-3
FRAMING MODE
(CCR2.3)
COUNT MOS OR FBIT
ERRORS
(RCR2.0)
WHAT IS COUNTED
IN THE MOSCRs
D4
MOS
number of multiframes out of
sync
D4
FBit
errors in the Ft pattern
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
57
ESF
MOS
number of multiframes out of
sync
ESF
FBit
errors in the FPS pattern
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
58
13. DS0 MONITORING FUNCTION
Each framer in the DS21Q42 has the ability to monitor one DS0 64 Kbps channel in the
transmit direction and one DS0 channel in the receive direction at the same time. In the
transmit direction the user will determine which channel is to be monitored by properly
setting the TCM0 to TCM4 bits in the CCR5 register. In the receive direction, the RCM0
to RCM4 bits in the CCR6 register need to be properly set. The DS0 channel pointed to by
the TCM0 to TCM4 bits will appear in the Transmit DS0 Monitor (TDS0M) register and
the DS0 channel pointed to by the RCM0 to RCM4 bits will appear in the Receive DS0
(RDS0M) register. The TCM4 to TCM0 and RCM4 to RCM0 bits should be programmed
with the decimal decode of the appropriate T1 channel. Channels 1 through 24 map to
register values 0 through 23. For example, if DS0 channel 6 (timeslot 5) in the transmit
direction and DS0 channel 15 (timeslot 14) in the receive direction needed to be monitored,
then the following values would be programmed into CCR5 and CCR6:
TCM4 = 0 RCM4 = 0
TCM3 = 0 RCM3 = 1
TCM2 = 1 RCM2 = 1
TCM1 = 0 RCM1 = 1
TCM0 = 1 RCM0 = 0
CCR5: COMMON CONTROL REGISTER 5 (Address=19 Hex)
[repeated here from section 10 for convenience]
(MSB)
(LSB)
TJC
TCM4
TCM3
TCM2
TCM1
TCM0
SYMBOL
POSITION
NAME AND DESCRIPTION
TJC
CCR5.7
Transmit Japanese CRC Enable. See Section 10 for details.
CCR5.5
Not Assigned. Must be set to zero when written.
CCR5.5
Not Assigned. Must be set to zero when written.
TCM4
CCR5.4
Transmit Channel Monitor Bit 4. MSB of a channel decode that
determines which transmit DS0 channel data will appear in the
TDS0M register.
TCM3
CCR5.3
Transmit Channel Monitor Bit 3.
TCM2
CCR5.2
Transmit Channel Monitor Bit 2.
TCM1
CCR5.1
Transmit Channel Monitor Bit 1.
TCM0
CCR5.0
Transmit Channel Monitor Bit 0. LSB of the channel decode that
determines which transmit DS0 channel data will appear in the
TDS0M register.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
59
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
60
TDS0M: TRANSMIT DS0 MONITOR REGISTER (Address=1A Hex)
(MSB)
(LSB)
B1
B2
B3
B4
B5
B6
B7
B8
SYMBOL
POSITION
NAME AND DESCRIPTION
B1
TDS0M.7
Transmit DS0 Channel Bit 1. MSB of the DS0 channel (first bit to be
transmitted).
B2
TDS0M.6
Transmit DS0 Channel Bit 2.
B3
TDS0M.5
Transmit DS0 Channel Bit 3.
B4
TDS0M.4
Transmit DS0 Channel Bit 4.
B5
TDS0M.3
Transmit DS0 Channel Bit 5.
B6
TDS0M.2
Transmit DS0 Channel Bit 6.
B7
TDS0M.1
Transmit DS0 Channel Bit 7.
B8
TDS0M.0
Transmit DS0 Channel Bit 8. LSB of the DS0 channel (last bit to be
transmitted).
CCR6: COMMON CONTROL REGISTER 6 (Address=1E Hex)
[repeated here from section 10 for convenience]
(MSB)
(LSB)
RJC
RESALGN
TESALGN
RCM4
RCM3
RCM2
RCM1
RCM0
SYMBOL
POSITION
NAME AND DESCRIPTION
RJC
CCR6.7
Receive Japanese CRC6 Enable.
0 = use ANSI/AT&T/ITU CRC6 calculation (normal operation)
1 = use Japanese standard JTG704 CRC6 calculation
RESALGN
CCR6.6
Receive Elastic Store Align. Setting this bit from a zero to a one will
force the receive elastic store's write/read pointers to a minim
separation of half a frame. If pointer separation is already greater
than half a frame, setting this bit will have no effect. Should be toggled
after RSYSCLK has been applied and is stable. Must be cleared and
set again for a subsequent align. See Section 17 for details.
TESALGN
CCR6.5
Transmit Elastic Store Align. Setting this bit from a zero to a one will
force the transmit elastic store's write/read pointers to a minimum
separation of half a frame. If pointer separation is already greater
than half a frame, setting this bit will have no effect. Should be toggled
after TSYSCLK has been applied and is stable. Must be cleared and
set again for a subsequent align. See Section 17 for details.
RCM4
CCR6.4
Receive Channel Monitor Bit 4. MSB of a channel decode that
determines which receive channel data will appear in the RDS0M
register. See Section 13 for details.
RCM3
CCR6.3
Receive Channel Monitor Bit 3.
RCM2
CCR6.2
Receive Channel Monitor Bit 2.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
61
RCM1
CCR6.1
Receive Channel Monitor Bit 1.
RCM0
CCR6.0
Receive Channel Monitor Bit 0. LSB of the channel decode.
RDS0M: RECEIVE DS0 MONITOR REGISTER (Address=1F Hex)
(MSB)
(LSB)
B1
B2
B3
B4
B5
B6
B7
B8
SYMBOL
POSITION
NAME AND DESCRIPTION
B1
RDS0M.7
Receive DS0 Channel Bit 1. MSB of the DS0 channel (first bit to be
received).
B2
RDS0M.6
Receive DS0 Channel Bit 2.
B3
RDS0M.5
Receive DS0 Channel Bit 3.
B4
RDS0M.4
Receive DS0 Channel Bit 4.
B5
RDS0M.3
Receive DS0 Channel Bit 5.
B6
RDS0M.2
Receive DS0 Channel Bit 6.
B7
RDS0M.1
Receive DS0 Channel Bit 7.
B8
RDS0M.0
Receive DS0 Channel Bit 8. LSB of the DS0 channel (last bit to be
received).
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
62
14. SIGNALING OPERATION
Each framer in the DS21Q42 contains provisions for both processor based (i.e., software based) signaling bit
access and for hardware based access. Both the processor based access and the hardware based access can be
used simultaneously if necessary. The processor based signaling is covered in Section 14.1 and the hardware
based signaling is covered in Section 14.2.
14.1 PROCESSOR BASED SIGNALING
The robbedbit signaling bits embedded in the T1 stream can be extracted from the receive
stream and inserted into the transmit stream by each framer. There is a set of 12 registers for
the receive side (RS1 to RS12) and 12 registers on the transmit side (TS1 to TS12). The
signaling registers are detailed below. The CCR1.5 bit is used to control the robbed
signaling bits as they appear at RSER. If CCR1.5 is set to zero, then the robbed signaling
bits will appear at the RSER pin in their proper position as they are received. If CCR1.5 is
set to a one, then the robbed signaling bit positions will be forced to a one at RSER. If
hardware based signaling is being used, then CCR1.5 must be set to zero.
RS1 TO RS12: RECEIVE SIGNALING REGISTERS (Address=60 to 6B Hex)
(MSB)
(LSB)
A(8)
A(7)
A(6)
A(5)
A(4)
A(3)
A(2)
A(1)
RS1 (60)
A(16)
A(15)
A(14)
A(13)
A(12)
A(11)
A(10)
A(9)
RS2 (61)
A(24)
A(23)
A(22)
A(21)
A(20)
A(19)
A(18)
A(17)
RS3 (62)
B(8)
B(7)
B(6)
B(5)
B(4)
B(3)
B(2)
B(1)
RS4 (63)
B(16)
B(15)
B(14)
B(13)
B(12)
B(11)
B(10)
B(9)
RS5 (64)
B(24)
B(23)
B(22)
B(21)
B(20)
B(19)
B(18)
B(17)
RS6 (65)
A/C(8)
A/C(7)
A/C(6)
A/C(5)
A/C(4)
A/C(3)
A/C(2)
A/C(1)
RS7 (66)
A/C(16)
A/C(15)
A/C(14)
A/C(13)
A/C(12)
A/C(11)
A/C(10)
A/C(9)
RS8 (67)
A/C(24)
A/C(23)
A/C(22)
A/C(21)
A/C(20)
A/C(19)
A/C(18)
A/C(17)
RS9 (68)
B/D(8)
B/D(7)
B/D(6)
B/D(5)
B/D(4)
B/D(3)
B/D(2)
B/D(1)
RS10 (69)
B/D(16)
B/D(15)
B/D(14)
B/D(13)
B/D(12)
B/D(11)
B/D(10)
B/D(9)
RS11 (6A)
B/D(24)
B/D(23)
B/D(22)
B/D(21)
B/D(20)
B/D(19)
B/D(18)
B/D(17)
RS12 (6B)
SYMBOL
POSITION
NAME AND DESCRIPTION
D(24)
RS12.7
Signaling Bit D in Channel 24
A(1)
RS1.0
Signaling Bit A in Channel 1
Each Receive Signaling Register (RS1 to RS12) reports the incoming robbed bit signaling
from eight DS0 channels. In the ESF framing mode, there can be up to four signaling bits
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
63
per channel (A, B, C, and D). In the D4 framing mode, there are only two signaling bits per
channel (A and B). In the D4 framing mode, the framer will replace the C and D signaling
bit positions with the A and B signaling bits from the previous multiframe. Hence, whether
the framer is operated in either framing mode, the user needs only to retrieve the signaling
bits every 3 ms. The bits in the Receive Signaling Registers are updated on multiframe
boundaries so the user can utilize the Receive Multiframe Interrupt in the Receive Status
Register 2 (SR2.7) to know when to retrieve the signaling bits. The Receive Signaling
Registers are frozen and not updated during a loss of sync condition (SR1.0=1). They will
contain the most recent signaling information before the "OOF" occurred. The signaling
data reported in RS1 to RS12 is also available at the RSIG and RSER pins.
A change in the signaling bits from one multiframe to the next will cause the RSC status bit
(SR2.0) to be set. The user can enable the INT* pin to toggle low upon detection of a
change in signaling by setting the IMR2.0 bit. Once a signaling change has been detected,
the user has at least 2.75 ms to read the data out of the RS1 to RS12 registers before the
data will be lost.
TS1 TO TS12: TRANSMIT SIGNALING REGISTERS (Address=70 to 7B Hex)
(MSB)
(LSB)
A(8)
A(7)
A(6)
A(5)
A(4)
A(3)
A(2)
A(1)
TS1 (70)
A(16)
A(15)
A(14)
A(13)
A(12)
A(11)
A(10)
A(9)
TS2 (71)
A(24)
A(23)
A(22)
A(21)
A(20)
A(19)
A(18)
A(17)
TS3 (72)
B(8)
B(7)
B(6)
B(5)
B(4)
B(3)
B(2)
B(1)
TS4 (73)
B(16)
B(15)
B(14)
B(13)
B(12)
B(11)
B(10)
B(9)
TS5 (74)
B(24)
B(23)
B(22)
B(21)
B(20)
B(19)
B(18)
B(17)
TS7 (75)
A/C(8)
A/C(7)
A/C(6)
A/C(5)
A/C(4)
A/C(3)
A/C(2)
A/C(1)
TS7 (76)
A/C(16)
A/C(15)
A/C(14)
A/C(13)
A/C(12)
A/C(11)
A/C(10)
A/C(9)
TS8 (77)
A/C(24)
A/C(23)
A/C(22)
A/C(21)
A/C(20)
A/C(19)
A/C(18)
A/C(17)
TS9 (78)
B/D(8)
B/D(7)
B/D(6)
B/D(5)
B/D(4)
B/D(3)
B/D(2)
B/D(1)
TS10 (79)
B/D(16)
B/D(15)
B/D(14)
B/D(13)
B/D(12)
B/D(11)
B/D(10)
B/D(9)
TS11 (7A)
B/D(24)
B/D(23)
B/D(22)
B/D(21)
B/D(20)
B/D(19)
B/D(18)
B/D(17)
TS12 (7B)
SYMBOL
POSITION
NAME AND DESCRIPTION
D(24)
TS12.7
Signaling Bit D in Channel 24
A(1)
TS1.0
Signaling Bit A in Channel 1
Each Transmit Signaling Register (TS1 to TS12) contains the Robbed Bit signaling for
eight DS0 channels that will be inserted into the outgoing stream if enabled to do so via
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
64
TCR1.4. In the ESF framing mode, there can be up to four signaling bits per channel (A, B,
C, and D). On multiframe boundaries, the framer will load the values present in the
Transmit Signaling Register into an outgoing signaling shift register that is internal to the
device. The user can utilize the Transmit Multiframe Interrupt in Status Register 2 (SR2.6)
to know when to update the signaling bits. In the ESF framing mode, the interrupt will
come every 3 ms and the user has a full 3ms to update the TSRs. In the D4 framing mode,
there are only two signaling bits per channel (A and B). However in the D4 framing mode,
the framer uses the C and D bit positions as the A and B bit positions for the next
multiframe. The framer will load the values in the TSRs into the outgoing shift register
every other D4 multiframe.
14.2 HARDWARE BASED SIGNALING
Receive Side
In the receive side of the hardware based signaling, there are two operating modes for the
signaling buffer; signaling extraction and signaling reinsertion. Signaling extraction
involves pulling the signaling bits from the receive data stream and buffering them over a
four multiframe buffer and outputting them in a serial PCM fashion on a channelbychannel
basis at the RSIG output. This mode is always enabled. In this mode, the receive elastic
store may be enabled or disabled. If the receive elastic store is enabled, then the backplane
clock (RSYSCLK) can be either 1.544 MHz or 2.048 MHz. In the ESF framing mode, the
ABCD signaling bits are output on RSIG in the lower nibble of each channel. The RSIG
data is updated once a multiframe (3 ms) unless a freeze is in effect. In the D4 framing mode,
the AB signaling bits are output twice on RSIG in the lower nibble of each channel. Hence,
bits 5 and 6 contain the same data as bits 7 and 8 respectively in each channel. The RSIG
data is updated once a multiframe (1.5 ms) unless a freeze is in effect. See the timing
diagrams in Section 24 for some examples.
The other hardware based signaling operating mode called signaling reinsertion can be
invoked by setting the RSRE control bit high (CCR4.7=1). In this mode, the user will
provide a multiframe sync at the RSYNC pin and the signaling data will be realigned at
the RSER output according to this applied multiframe boundary. In this mode, the elastic
store must be enabled however the backplane clock can be either 1.544 MHz or 2.048 MHz.
If the signaling reinsertion mode is enabled, the user can control which channels have
signaling reinsertion performed on a channelbychannel basis by setting the RPCSI
control bit high (CCR4.6) and then programming the RCHBLK output pin to go high in
the channels in which the signaling reinsertion should not occur. If the RPCSI bit is set
low, then signaling reinsertion will occur in all channels when the signaling reinsertion
mode is enabled (RSRE=1). How to control the operation of the RCHBLK output pin is
covered in Section 16.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
65
In both hardware based signaling operating modes, the user has the option to replace all of
the extracted robbedbit signaling bit positions with ones. This option is enabled via the
RFSA1 control bit (CCR4.5) and it can be invoked on a perchannel basis by setting the
RPCSI control bit (CCR4.6) high and then programming RCHBLK appropriately just like
the perchannel signaling reinsertion operates.
The signaling data in the four multiframe buffer will be frozen in a known good state upon
either a loss of synchronization (OOF event), carrier loss, or frame slip. This action meets
the requirements of BellCore TR TSY000170 for signaling freezing. To allow this freeze
action to occur, the RFE control bit (CCR4.4) should be set high. The user can force a
freeze by setting the RFF control bit (CCR4.3) high. The four multiframe buffer provides a
three multiframe delay in the signaling bits provided at the RSIG pin (and at the RSER pin
if RSRE=1). When freezing is enabled (RFE=1), the signaling data will be held in the last
known good state until the corrupting error condition subsides. When the error condition
subsides, the signaling data will be held in the old state for at least an additional 9 ms (or
4.5 ms in D4 framing mode) before being allowed to be updated with new signaling data.
Transmit Side
Via the THSE control bit (CCR4.2), the framer can be set up to take the signaling data
presented at the TSIG pin and insert the signaling data into the PCM data stream that is
being input at the TSER pin. The user has the ability to control which channels are to have
signaling data from the TSIG pin inserted into them on a channelbychannel basis by
setting the TPCSI control bit (CCR4.1) high. When TPCSI is enabled, channels in which
the TCHBLK output has been programmed to be set high in, will not have signaling data
from the TSIG pin inserted into them. The hardware signaling insertion capabilities of the
framer are available whether the transmit side elastic store is enabled or disabled. If the
elastic store is enabled, the backplane clock (TSYSCLK) can be either 1.544 MHz or 2.048
MHz.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
66
15. PERCHANNEL CODE (IDLE) GENERATION AND LOOPBACK
Each framer in the DS21Q42 can replace data on a channelbychannel basis in both the
transmit and receive directions. The transmit direction is from the backplane to the T1 line
and is covered in Section 15.1. The receive direction is from the T1 line to the backplane
and is covered in Section 15.2.
15.1
TRANSMIT SIDE CODE GENERATION
In the transmit direction there are two methods by which channel data from the backplane
can be overwritten with data generated by the framer. The first method which is covered in
Section 15.1.1 was a feature contained in the original DS21Q41 while the second method
which is covered in Section 15.1.2 is a new feature of the DS21Q42.
15.1.1
Simple Idle Code Insertion and PerChannel Loopback
The first method involves using the Transmit Idle Registers (TIR1/2/3) to determine which
of the 24 T1 channels should be overwritten with the code placed in the Transmit Idle
Definition Register (TIDR). This method allows the same 8bit code to be placed into any
of the 24 T1 channels. If this method is used, then the CCR4.0 control bit must be set to
zero.
Each of the bit position in the Transmit Idle Registers (TIR1/TIR2/TIR3) represent a DS0
channel in the outgoing frame. When these bits are set to a one, the corresponding channel
will transmit the Idle Code contained in the Transmit Idle Definition Register (TIDR).
Robbed bit signaling and Bit 7 stuffing will occur over the programmed Idle Code unless
the DS0 channel is made transparent by the Transmit Transparency Registers.
The Transmit Idle Registers (TIRs) have an alternate function that allow them to define a
PerChannel LoopBack (PCLB). If the TIRFS control bit (CCR4.0) is set to one, then the
TIRs will determine which channels (if any) from the backplane should be replaced with the
data from the receive side or in other words, off of the T1 line. If this mode is enabled, then
transmit and receive clocks and frame syncs must be synchronized. One method to
accomplish this would be to tie RCLK to TCLK and RFSYNC to TSYNC.
TIR1/TIR2/TIR3: TRANSMIT IDLE REGISTERS (Address=3C to 3E Hex)
[Also used for PerChannel Loopback]
(MSB)
(LSB)
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
TIR1 (3C)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
67
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
TIR2 (3D)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
TIR3 (3E)
SYMBOLS
POSITIONS
NAME AND DESCRIPTION
CH1 - 24
TIR1.0 - 3.7
Transmit Idle Code Insertion Control Bits.
0 = do not insert the Idle Code in the TIDR into this channel
1 = insert the Idle Code in the TIDR into this channel
NOTE:
If CCR4.0=1, then a zero in the TIRs implies that channel data is to be sourced from TSER and a one implies that
channel data is to be sourced from the output of the receive side framer (i.e., PerChannel Loopback; see Figure
61).
TIDR: TRANSMIT IDLE DEFINITION REGISTER (Address=3F Hex)
(MSB)
(LSB)
TIDR7
TIDR6
TIDR5
TIDR4
TIDR3
TIDR2
TIDR1
TIDR0
SYMBOL
POSITION
NAME AND DESCRIPTION
TIDR7
TIDR.7
MSB of the Idle Code (this bit is transmitted first)
TIDR0
TIDR.0
LSB of the Idle Code (this bit is transmitted last)
15.1.2
PerChannel Code Insertion
The second method involves using the Transmit Channel Control Registers (TCC1/2/3) to
determine which of the 24 T1 channels should be overwritten with the code placed in the
Transmit Channel Registers (TC1 to TC24). This method is more flexible than the first in
that it allows a different 8bit code to be placed into each of the 24 T1 channels.
TC1 TO TC24: TRANSMIT CHANNEL REGISTERS (Address=40 to 4F and 50 to 57 Hex)
(for brevity, only channel one is shown; see Table 8-1 for other register address)
(MSB)
(LSB)
C7
C6
C5
C4
C3
C2
C1
C0
TC1 (50)
SYMBOL
POSITION
NAME AND DESCRIPTION
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
68
C7
TC1.7
MSB of the Code (this bit is transmitted first)
C0
TC1.0
LSB of the Code (this bit is transmitted last)
TCC1/TCC2/TCC3: TRANSMIT CHANNEL CONTROL REGISTER (Address=16 to 18 Hex)
(MSB)
(LSB)
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
TCC1 (16)
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
TCC2 (17)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
TCC3 (18)
SYMBOL
POSITION
NAME AND DESCRIPTION
CH1 - 24
TCC1.0 - 3.7
Transmit Code Insertion Control Bits
0 = do not insert data from the TC register into the transmit data
stream
1 = insert data from the TC register into the transmit data stream
15.2
RECEIVE SIDE CODE GENERATION
In the receive direction there are also two methods by which channel data to the backplane
can be overwritten with data generated by the framer. The first method which is covered in
Section 15.2.1 was a feature contained in the original DS21Q41 while the second method
which is covered in Section 15.2.2 is a new feature of the DS21Q42.
15.2.1
Simple Code Insertion
The first method on the receive side involves using the Receive Mark Registers (RMR1/2/3)
to determine which of the 24 T1 channels should be overwritten with either a 7Fh idle code
or with a digital milliwatt pattern. The RCR2.7 bit will determine which code is used. The
digital milliwatt code is an eight byte repeating pattern that represents a 1 KHz sine wave
(1E/0B/0B/1E/9E/8B/8B/9E). Each bit in the RMRs, represents a particular channel. If a bit
is set to a one, then the receive data in that channel will be replaced with one of the two
codes. If a bit is set to zero, no replacement occurs.
RMR1/RMR2/RMR3: RECEIVE MARK REGISTERS (Address=2D to 2F Hex)
(MSB)
(LSB)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
69
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
RMR1(2D)
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
RMR2(2E)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
RMR3(2F)
SYMBOLS
POSITIONS
NAME AND DESCRIPTION
CH1 - 24
RMR1.0 - 3.7
Receive Channel Mark Control Bits
0 =do not affect the receive data associated with this channel
1 = replace the receive data associated with this channel with either
the idle code or the digital milliwatt code (depends on the RCR2.7 bit)
15.2.2
PerChannel Code Insertion
The second method involves using the Receive Channel Control Registers (RCC1/2/3) to
determine which of the 24 T1 channels off of the T1 line and going to the backplane should
be overwritten with the code placed in the Receive Channel Registers (RC1 to RC24). This
method is more flexible than the first in that it allows a different 8bit code to be placed into
each of the 24 T1 channels.
RC1 TO RC24: RECEIVE CHANNEL REGISTERS (Address=58 to 5F and 80 to 8F Hex)
(for brevity, only channel one is shown; see Table 8-1 for other register address)
(MSB)
(LSB)
C7
C6
C5
C4
C3
C2
C1
C0
RC1 (80)
SYMBOL
POSITION
NAME AND DESCRIPTION
C7
RC1.7
MSB of the Code (this bit is sent first to the backplane)
C0
RC1.0
LSB of the Code (this bit is sent last to the backplane)
RCC1/RCC2/RCC3: RECEIVE CHANNEL CONTROL REGISTER (Address=1B to 1D Hex)
(MSB)
(LSB)
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
RCC1 (1B)
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
RCC2 (1C)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
RCC3 (1D)
SYMBOL
POSITION
NAME AND DESCRIPTION
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
70
CH1 - 24
RCC1.0 - 3.7
Receive Code Insertion Control Bits
0 = do not insert data from the RC register into the receive data
stream
1 = insert data from the RC register into the receive data stream
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
71
16. CLOCK BLOCKING REGISTERS
The Receive Channel Blocking Registers (RCBR1/RCBR2/RCBR3) and the Transmit
Channel Blocking Registers (TCBR1/TCBR2/TCBR3) control the RCHBLK and
TCHBLK pins respectively. The RCHBLK and TCHCLK pins are user programmable
outputs that can be forced either high or low during individual channels. These outputs can
be used to block clocks to a USART or LAPD controller in Fractional T1 or ISDNPRI
applications. When the appropriate bits are set to a one, the RCHBLK and TCHCLK pins
will be held high during the entire corresponding channel time. See the timing in Section
24 for an example.
RCBR1/RCBR2/RCBR3: RECEIVE CHANNEL BLOCKING REGISTERS (Address=6C to 6E Hex)
(MSB)
(LSB)
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
RCBR1 (6C)
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
RCBR2 (6D)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
RCBR3 (6E)
SYMBOLS
POSITIONS
NAME AND DESCRIPTION
CH1 - 24
RCBR1.0 - 3.7
Receive Channel Blocking Control Bits.
0 = force the RCHBLK pin to remain low during this channel time
1 = force the RCHBLK pin high during this channel time
TCBR1/TCBR2/TCBR3: TRANSMIT CHANNEL BLOCKING REGISTERS (Address=32 to 34 Hex)
(MSB)
(LSB)
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
TCBR1 (32)
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
TCBR2 (33)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
TCBR3 (34)
SYMBOLS
POSITIONS
NAME AND DESCRIPTION
CH1 - 24
TCBR1.0 - 3.7
Transmit Channel Blocking Control Bits.
0 = force the TCHBLK pin to remain low during this channel time
1 = force the TCHBLK pin high during this channel time
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
72
17. ELASTIC STORES OPERATION
Each framer in the DS21Q42 contains dual twoframe (386 bits) elastic stores, one for the
receive direction, and one for the transmit direction. These elastic stores have two main
purposes. First, they can be used to rate convert the T1 data stream to 2.048 Mbps (or a
multiple of 2.048 Mbps) which is the E1 rate. Secondly, they can be used to absorb the
differences in frequency and phase between the T1 data stream and an asynchronous (i.e., not
frequency locked) backplane clock (which can be 1.544 MHz or 2.048 MHz). The backplane
clock can burst at rates up to 8.192 MHz. Both elastic stores contain full controlled slip
capability which is necessary for this second purpose. Both elastic stores within the framer
are fully independent and no restrictions apply to the sourcing of the various clocks that are
applied to them. The transmit side elastic store can be enabled whether the receive elastic
store is enabled or disabled and vice versa. Also, each elastic store can interface to either a
1.544 MHz or 2.048 MHz backplane without regard to the backplane rate the other elastic
store is interfacing.
Two mechanisms are available to the user for resetting the elastic stores. The Elastic Store
Reset (TX - CCR7.4 & RX - CCR7.5) function forces the elastic stores to a depth of one
frame unconditionally. Data is lost during the reset. The second method, the Elastic Store
Align (TX - CCR6.5 & RX - CCR6.6) forces the elastic store depth to a minimum depth of
half a frame only if the current pointer separation is already less then half a frame. If a
realignment occurs data is lost. In both mechanisms, independent resets are provided for
both the receive and transmit elastic stores.
17.1
RECEIVE SIDE
If the receive side elastic store is enabled (CCR1.2=1), then the user must provide either a
1.544 MHz (CCR1.3=0) or 2.048 MHz (CCR1.3=1) clock at the RSYSCLK pin. The user
has the option of either providing a frame/multiframe sync at the RSYNC pin (RCR2.3=1)
or having the RSYNC pin provide a pulse on frame boundaries (RCR2.3=0). If the user
wishes to obtain pulses at the frame boundary, then RCR2.4 must be set to zero and if the
user wishes to have pulses occur at the multiframe boundary, then RCR2.4 must be set to
one. The framer will always indicate frame boundaries via the RFSYNC output whether the
elastic store is enabled or not. If the elastic store is enabled, then multiframe boundaries will
be indicated via the RMSYNC output. If the user selects to apply a 2.048 MHz clock to the
RSYSCLK pin, then the data output at RSER will be forced to all ones every fourth
channel. Hence channels 1 (except for the MSB), 5, 9, 13, 17, 21, 25, and 29 (timeslots 0,
4, 8, 12, 16, 20, 24, and 28) will be forced to a one. The Fbit will be passed in the MSB
of channel 1. Also, in 2.048 MHz applications, the RCHBLK output will be forced high
during the same channels as the RSER pin. See Section 23 for more details. This is useful
in T1 to CEPT (E1) conversion applications. If the 386bit elastic buffer either fills or
empties, a controlled slip will occur. If the buffer empties, then a full frame of data (193 bits)
will be repeated at RSER and the SR1.4 and RIR1.3 bits will be set to a one. If the buffer
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
73
fills, then a full frame of data will be deleted and the SR1.4 and RIR1.4 bits will be set to a
one.
17.2
TRANSMIT SIDE
The operation of the transmit elastic store is very similar to the receive side. The transmit
side elastic store is enabled via CCR1.7. A 1.544 MHz (CCR1.4=0) or 2.048 MHz
(CCR1.4=1) clock can be applied to the TSYSCLK input. If the user selects to apply a
2.048 MHz clock to the TSYSCLK pin, then the data input at TSER will be ignored every
fourth channel. Hence channels 1 (except for the MSB), 5, 9, 13, 17, 21, 25, and 29
(timeslots 0, 4, 8, 12, 16, 20, 24, and 28) will be ignored. A special case exists for the
MSB of channel 1. Via TCR1.6 the MSB of channel 1 can be sampled as the F-bit. The
user must supply a 8 KHz frame sync pulse to the TSSYNC input. Also, in 2.048 MHz
applications, the TCHBLK output will be forced high during the channels ignored by the
framer. See Section 23 for more details. Controlled slips in the transmit elastic store are
reported in the RIR2.3 bit and the direction of the slip is reported in the RIR2.5 and RIR2.4
bits.
17.3
MINIMUM DELAY SYNCHRONOUS RSYSCLK/TSYSCLK MODE
In applications where the framer is connected to backplanes that are frequency locked to the
recovered T1 clock (i.e., the RCLK output), the full two frame depth of the onboard elastic
stores is really not needed. In fact, in some delay sensitive applications, the normal two
frame depth may be excessive. Register bits CCR3.7 and CCR3.0 control the RX and TX
elastic stores depths. In this mode, RSYSCLK and TSYSCLK must be tied together and
they must be frequency locked to RCLK. All of the slip contention logic in the framer is
disabled (since slips cannot occur). Also, since the buffer depth is no longer two frames
deep, the framer must be set up to source a frame pulse at the RSYNC pin and this output
must be tied to the TSSYNC input. On powerup after the RSYSCLK and TSYSCLK
signals have locked to the RCLK signal, the elastic stores should be reset.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
74
18. HDLC CONTROLLER
The DS21Q42 has an enhanced HDLC controller configurable for use with the Facilities
Data Link or DS0s. There are 64 byte buffers in both the transmit and receive paths. The
user can select any DS0 or multiple DS0s as well as any specific bits within the DS0(s) to
pass through the HDLC controller. See Figure 24-15 for details on formatting the transmit
side. Note that TBOC.6 = 1 and TDC1.7 = 1 cannot exist without corrupting the data in
the FDL. For use with the FDL, see section 19.1. See Table 18-1 for configuring the
transmit HDLC controller.
Four new registers were added for the enhanced functionality of the HDLC controller; RDC1,
RDC2, TDC1, and TDC2. Note that the BOC controller is functional when the HDLC
controller is used for DS0s. Section 19 contains all of the HDLC and BOC registers and
information on FDL/Fs Extraction and Insertion with and without the HDLC controller.
Transmit HDLC Configuration Table 18-1
Function
TBOC.6
TDC1.7
TCR1.2
DS0(s)
0
1
1 or 0
FDL
1
0
1
Disable
0
0
1 or 0
18.1
HDLC for DS0s
When using the HDLC controllers for DS0s, the same registers shown in section 19 will be
used except for the TBOC and RBOC registers and bits HCR.7, HSR.7, and HIMR.7. As a
basic guideline for interpreting and sending HDLC messages and BOC messages, the
following sequences can be applied.
Receive a HDLC Message
1. Enable RPS interrupts
2. Wait for interrupt to occur
3. Disable RPS interrupt and enable either RPE, RNE, or RHALF interrupt
4. Read RHIR to obtain REMPTY status
a. If REMPTY=0, then record OBYTE, CBYTE, and POK bits and then read the
FIFO
a1. If CBYTE=0 then skip to step 5
a2. If CBYTE=1 then skip to step 7
b. If REMPTY=1, then skip to step 6
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
75
5. Repeat step 4
6. Wait for interrupt, skip to step 4
7. If POK=0, then discard whole packet, if POK=1, accept the packet
8. Disable RPE, RNE, or RHALF interrupt, enable RPS interrupt and return to step 1.
Transmit a HDLC Message
1. Make sure HDLC controller is done sending any previous messages and is current
sending flags by checking that the FIFO is empty by reading the TEMPTY status bit in the
THIR register
2. Enable either the THALF or TNF interrupt
3. Read THIR to obtain TFULL status
a. If TFULL=0, then write a byte into the FIFO and skip to next step (special case
occurs when the last byte is to be written, in this case set TEOM=1 before writing
the byte and then skip to step 6)
b. If TFULL=1, then skip to step 5
4. Repeat step 3
5. Wait for interrupt, skip to step 3
6. Disable THALF or TNF interrupt and enable TMEND interrupt
7. Wait for an interrupt, then read TUDR status bit to make sure packet was transmitted
correctly.
19. FDL/Fs EXTRACTION AND INSERTION
Each Framer/Formatter has the ability to extract/insert data from/ into the Facility Data Link
(FDL) in the ESF framing mode and from/into Fsbit position in the D4 framing mode.
Since SLC96 utilizes the Fsbit position, this capability can also be used in SLC96
applications. The DS21Q42 contains a complete HDLC and BOC controller for the FDL
and this operation is covered in Section 19.1. To allow for backward compatibility between
the DS21Q42 and earlier devices, the DS21Q42 maintains some legacy functionality for the
FDL and this is covered in Section 19.2. Section 19.3 covers D4 and SLC96 operation.
Please contact the factory for a copy of C language source code for implementing the FDL on
the DS21Q42.
19.1
HDLC AND BOC CONTROLLER FOR THE FDL
19.1.1
General Overview
The DS21Q42 contains a complete HDLC controller with 64byte buffers in both the
transmit and receive directions as well as separate dedicated hardware for Bit Oriented Codes
(BOC). The HDLC controller performs all the necessary overhead for generating and
receiving Performance Report Messages (PRM) as described in ANSI T1.403 and the
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
76
messages as described in AT&T TR54016. The HDLC controller automatically generates
and detects flags, generates and checks the CRC check sum, generates and detects abort
sequences, stuffs and destuffs zeros (for transparency), and byte aligns to the HDLC data
stream. The 64byte buffers in the HDLC controller are large enough to allow a full PRM to
be received or transmitted without host intervention. The BOC controller will automatically
detect incoming BOC sequences and alert the host. When the BOC ceases, the DS21Q42
will also alert the host. The user can set the device up to send any of the possible 6bit
BOC codes.
There are thirteen registers that the host will use to operate and control the operation of the
HDLC and BOC controllers. A brief description of the registers is shown in Table 191.
HDLC/BOC CONTROLLER REGISTER LIST Table 19-1
NAME
FUNCTION
HDLC Control Register (HCR)
general control over the HDLC and BOC
controllers
HDLC Status Register (HSR)
key status information for both transmit and
receive directions
HDLC Interrupt Mask Register (HIMR)
allows/stops status bits to/from causing an interrupt
Receive HDLC Information Register (RHIR)
status information on receive HDLC controller
Receive BOC Register (RBOC)
status information on receive BOC controller
Receive HDLC FIFO Register (RHFR)
access to 64byte HDLC FIFO in receive direction
Receive HDLC DS0 Control Register 1 (RDC1)
Receive HDLC DS0 Control Register 2 (RDC2)
controls the HDLC function when used on DS0
channels
Transmit HDLC Information Register (THIR)
status information on transmit HDLC controller
Transmit BOC Register (TBOC)
enables/disables transmission of BOC codes
Transmit HDLC FIFO Register (THFR)
access to 64byte HDLC FIFO in transmit direction
Transmit HDLC DS0 Control Register 1 (TDC1)
Transmit HDLC DS0 Control Register 2 (TDC2)
controls the HDLC function when used on DS0
channels
19.1.2
Status Register for the HDLC
Four of the HDLC/BOC controller registers (HSR, RHIR, RBOC, and THIR) provide
status information. When a particular event has occurred (or is occurring), the appropriate bit
in one of these four registers will be set to a one. Some of the bits in these four HDLC status
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
77
registers are latched and some are real time bits that are not latched. Section 19.1.4 contains
register descriptions that list which bits are latched and which are not. With the latched bits,
when an event occurs and a bit is set to a one, it will remain set until the user reads that bit.
The bit will be cleared when it is read and it will not be set again until the event has
occurred again. The real time bits report the current instantaneous conditions that are
occurring and the history of these bits is not latched.
Like the other status registers in the DS21Q42, the user will always proceed a read of any of
the four registers with a write. The byte written to the register will inform the DS21Q42
which of the latched bits the user wishes to read and have cleared (the real time bits are not
affected by writing to the status register). The user will write a byte to one of these registers,
with a one in the bit positions he or she wishes to read and a zero in the bit positions he or
she does not wish to obtain the latest information on. When a one is written to a bit
location, the read register will be updated with current value and it will be cleared. When a
zero is written to a bit position, the read register will not be updated and the previous value
will be held. A write to the status and information registers will be immediately followed by
a read of the same register. The read result should be logically AND'ed with the mask byte
that was just written and this value should be written back into the same register to insure
that bit does indeed clear. This second write step is necessary because the alarms and events
in the status registers occur asynchronously in respect to their access via the parallel port.
This writereadwrite (for polled driven access) or writeread (for interrupt driven access)
scheme allows an external microcontroller or microprocessor to individually poll certain bits
without disturbing the other bits in the register. This operation is key in controlling the
DS21Q42 with higherorder software languages.
Like the SR1 and SR2 status registers, the HSR register has the unique ability to initiate a
hardware interrupt via the INT* output pin. Each of the events in the HSR can be either
masked or unmasked from the interrupt pin via the HDLC Interrupt Mask Register (HIMR).
Interrupts will force the INT* pin low when the event occurs. The INT* pin will be allowed
to return high (if no other interrupts are present) when the user reads the event bit that caused
the interrupt to occur. Basic Operation Details
To allow the framer to properly source/receive data from/to the HDLC and BOC controller
the legacy FDL circuitry (which is described in Section 19.2) should be disabled and the
following bits should be programmed as shown:
TCR1.2 = 1 (source FDL data from the HDLC and BOC controller)
TBOC.6 = 1 (enable HDLC and BOC controller)
CCR2.5 = 0 (disable SLC96 and D4 Fsbit insertion)
CCR2.4 = 0 (disable legacy FDL zero stuffer)
CCR2.1 = 0 (disable SLC96 reception)
CCR2.0 = 0 (disable legacy FDL zero stuffer)
IMR2.4 = 0 (disable legacy receive FDL buffer full interrupt)
IMR2.3 = 0 (disable legacy transmit FDL buffer empty interrupt)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
78
IMR2.2 = 0 (disable legacy FDL match interrupt)
IMR2.1 = 0 (disable legacy FDL abort interrupt).
As a basic guideline for interpreting and sending both HDLC messages and BOC messages,
the following sequences can be applied:
Receive a HDLC Message or a BOC
1. Enable RBOC and RPS interrupts
2. Wait for interrupt to occur
3. If RBOC=1, then follow steps 5 and 6
4. If RPS=1, then follow steps 7 through 12
5. If LBD=1, a BOC is present, then read the code from the RBOC register and take action
as needed
6. If BD=0, a BOC has ceased, take action as needed and then return to step 1
7. Disable RPS interrupt and enable either RPE, RNE, or RHALF interrupt
8. Read RHIR to obtain REMPTY status a. if REMPTY=0, then record OBYTE, CBYTE,
and POK bits and then read the FIFO a1. if CBYTE=0 then skip to step 9 a2. if CBYTE=1
then skip to step 11 b. if REMPTY=1, then skip to step 10
9. Repeat step 8
10. Wait for interrupt, skip to step 8
11. If POK=0, then discard whole packet, if POK=1, accept the packet 12. disable RPE,
RNE, or RHALF interrupt, enable RPS interrupt and return to step 1.
Transmit a HDLC Message
1. Make sure HDLC controller is done sending any previous messages and is current
sending flags by checking that the FIFO is empty by reading the TEMPTY status bit in the
THIR register
2. Enable either the THALF or TNF interrupt
3. Read THIR to obtain TFULL status a. if TFULL=0, then write a byte into the FIFO and
skip to next step (special case occurs when the last byte is to be written, in this case set
TEOM=1 before writing the byte and then skip to step 6) b. if TFULL=1, then skip to step
5
4. Repeat step 3
5. Wait for interrupt, skip to step 3
6. Disable THALF or TNF interrupt and enable TMEND interrupt
7. Wait for an interrupt, then read TUDR status bit to make sure packet was transmitted
correctly.
Transmit a BOC
1. Write 6bit code into TBOC
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
79
2. Set SBOC bit in TBOC=1
19.1.3
HDLC/BOC Register Description
HCR: HDLC CONTROL REGISTER (Address = 00 Hex)
(MSB)
(LSB)
RBR
RHR
TFS
THR
TABT
TEOM
TZSD
TCRCD
SYMBOL
POSITION
NAME AND DESCRIPTION
RBR
HCR.7
Receive BOC Reset. A 0 to 1 transition will reset the BOC circuitry.
Must be cleared and set again for a subsequent reset.
RHR
HCR.6
Receive HDLC Reset. A 0 to 1 transition will reset the HDLC
controller. Must be cleared and set again for a subsequent reset.
TFS
HCR.5
Transmit Flag/Idle Select.
0 = 7Eh
1 = FFh
THR
HCR.4
Transmit HDLC/BOC Reset. A 0 to 1 transition will reset both the
HDLC controller and the transmit BOC circuitry. Must be cleared and
set again for a subsequent reset.
TABT
HCR.3
Transmit Abort. A 0 to 1 transition will cause the FIFO contents to be
dumped and one FEh abort to be sent followed by 7Eh or FFh
flags/idle until a new packet is initiated by writing new data into the
FIFO. Must be cleared and set again for a subsequent abort to be sent.
TEOM
HCR.2
Transmit End of Message. Should be set to a one just before the last
data byte of a HDLC packet is written into the transmit FIFO at THFR.
The HDLC controller will clear this bit when the last byte has been
transmitted.
TZSD
HCR.1
Transmit Zero Stuffer Defeat. Overrides internal enable.
0 = enable the zero stuffer (normal operation)
1 = disable the zero stuffer
TCRCD
HCR.0
Transmit CRC Defeat.
0 = enable CRC generation (normal operation)
1 = disable CRC generation
HSR: HDLC STATUS REGISTER (Address = 01 Hex)
(MSB)
(LSB)
RBOC
RPE
RPS
RHALF
RNE
THALF
TNF
TMEND
SYMBOL
POSITION
NAME AND DESCRIPTION
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
80
RBOC
HSR.7
Receive BOC Detector Change of State. Set whenever the BOC
detector sees a change of state from a BOC Detected to a No Valid
Code seen or vice versa. The setting of this bit prompt the user to read
the RBOC register for details.
RPE
HSR.6
Receive Packet End. Set when the HDLC controller detects either the
finish of a valid message (i.e., CRC check complete) or when the
controller has experienced a message fault such as a CRC checking
error, or an overrun condition, or an abort has been seen. The setting
of this bit prompts the user to read the RHIR register for details.
RPS
HSR.5
Receive Packet Start. Set when the HDLC controller detects an
opening byte. The setting of this bit prompts the user to read the RHIR
register for details.
RHALF
HSR.4
Receive FIFO Half Full. Set when the receive 64byte FIFO fills
beyond the half way point. The setting of this bit prompts the user to
read the RHIR register for details.
RNE
HSR.3
Receive FIFO Not Empty. Set when the receive 64byte FIFO has at
least one byte available for a read. The setting of this bit prompts the
user to read the RHIR register for details.
THALF
HSR.2
Transmit FIFO Half Empty. Set when the transmit 64byte FIFO
empties beyond the half way point. The setting of this bit prompts the
user to read the THIR register for details.
TNF
HSR.1
Transmit FIFO Not Full. Set when the transmit 64byte FIFO has at
least one byte available. The setting of this bit prompts the user to read
the THIR register for details.
TMEND
HSR.0
Transmit Message End. Set when the transmit HDLC controller has
finished sending a message. The setting of this bit prompts the user to
read the THIR register for details.
NOTE:
The RBOC, RPE, RPS, and TMEND bits are latched and will be cleared when read.
HIMR: HDLC INTERRUPT MASK REGISTER (Address = 02 Hex)
(MSB)
(LSB)
RBOC
RPE
RPS
RHALF
RNE
THALF
TNF
TMEND
SYMBOL
POSITION
NAME AND DESCRIPTION
RBOC
HIMR.7
Receive BOC Detector Change of State.
0 = interrupt masked
1 = interrupt enabled
RPE
HIMR.6
Receive Packet End.
0 = interrupt masked
1 = interrupt enabled
RPS
HIMR.5
Receive Packet Start.
0 = interrupt masked
1 = interrupt enabled
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
81
RHALF
HIMR.4
Receive FIFO Half Full.
0 = interrupt masked
1 = interrupt enabled
RNE
HIMR.3
Receive FIFO Not Empty.
0 = interrupt masked
1 = interrupt enabled
THALF
HIMR.2
Transmit FIFO Half Empty.
0 = interrupt masked
1 = interrupt enabled
TNF
HIMR.1
Transmit FIFO Not Full.
0 = interrupt masked
1 = interrupt enabled
TMEND
HIMR.0
Transmit Message End.
0 = interrupt masked
1 = interrupt enabled
RHIR: RECEIVE HDLC INFORMATION REGISTER (Address = 03 Hex)
(MSB)
(LSB)
RABT
RCRCE
ROVR
RVM
REMPTY
POK
CBYTE
OBYTE
SYMBOL
POSITION
NAME AND DESCRIPTION
RABT
RHIR.7
Abort Sequence Detected. Set whenever the HDLC controller sees 7
or more ones in a row.
RCRCE
RHIR.6
CRC Error. Set when the CRC checksum is in error.
ROVR
RHIR.5
Overrun. Set when the HDLC controller has attempted to write a byte
into an already full receive FIFO.
RVM
RHIR.4
Valid Message. Set when the HDLC controller has detected and
checked a complete HDLC packet.
REMPTY
RHIR.3
Empty. A realtime bit that is set high when the receive FIFO is
empty.
POK
RHIR.2
Packet OK. Set when the byte available for reading in the receive
FIFO at RHFR is the last byte of a valid message (and hence no abort
was seen, no overrun occurred, and the CRC was correct).
CBYTE
RHIR.1
Closing Byte. Set when the byte available for reading in the receive
FIFO at RHFR is the last byte of a message (whether the message was
valid or not).
OBYTE
RHIR.0
Opening Byte. Set when the byte available for reading in the receive
FIFO at RHFR is the first byte of a message.
NOTE:
The RABT, RCRCE, ROVR, and RVM bits are latched and will be cleared when read.
RBOC: RECEIVE BIT ORIENTED CODE REGISTER (Address = 04 Hex)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
82
(MSB)
(LSB)
LBD
BD
BOC5
BOC4
BOC3
BOC2
BOC1
BOC0
SYMBOL
POSITION
NAME AND DESCRIPTION
LBD
RBOC.7
Latched BOC Detected. A latched version of the BD status bit
(RBOC.6). Will be cleared when read.
BD
RBOC.6
BOC Detected. A realtime bit that is set high when the BOC
detector is presently seeing a valid sequence and set low when no
BOC is currently being detected.
BOC5
RBOC.5
BOC Bit 5. Last bit received of the 6bit code word.
BOC4
RBOC.4
BOC Bit 4.
BOC3
RBOC.3
BOC Bit 3.
BOC2
RBOC.2
BOC Bit 2.
BOC1
RBOC.1
BOC Bit 1.
BOC0
RBOC.0
BOC Bit 0. First bit received of the 6bit code word.
NOTE:
1. The LBD bit is latched and will be cleared when read.
2. The RBOC0 to RBOC5 bits display the last valid BOC code verified; these bits will be set to all ones on reset.
RHFR: RECEIVE HDLC FIFO (Address = 05 Hex)
(MSB)
(LSB)
HDLC7
HDLC6
HDLC5
HDLC4
HDLC3
HDLC2
HDLC1
HDLC0
SYMBOL
POSITION
NAME AND DESCRIPTION
HDLC7
RHFR.7
HDLC Data Bit 7. MSB of a HDLC packet data byte.
HDLC6
RHFR.6
HDLC Data Bit 6.
HDLC5
RHFR.5
HDLC Data Bit 5.
HDLC4
RHFR.4
HDLC Data Bit 4.
HDLC3
RHFR.3
HDLC Data Bit 3.
HDLC2
RHFR.2
HDLC Data Bit 2.
HDLC1
RHFR.1
HDLC Data Bit 1.
HDLC0
RHFR.0
HDLC Data Bit 0. LSB of a HDLC packet data byte.
THIR: TRANSMIT HDLC INFORMATION (Address = 06 Hex)
(MSB)
(LSB)
TEMPTY
TFULL
TUDR
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
83
SYMBOL
POSITION
NAME AND DESCRIPTION
THIR.7
Not Assigned. Could be any value when read.
THIR.6
Not Assigned. Could be any value when read.
THIR.5
Not Assigned. Could be any value when read.
THIR.4
Not Assigned. Could be any value when read.
THIR.3
Not Assigned. Could be any value when read.
TEMPTY
THIR.2
Transmit FIFO Empty. A realtime bit that is set high when the FIFO
is empty.
TFULL
THIR.1
Transmit FIFO Full. A realtime bit that is set high when the FIFO is
full.
TUDR
THIR.0
Transmit FIFO Underrun. Set when the transmit FIFO unwantedly
empties out and an abort is automatically sent.
NOTE:
The TUDR bit is latched and will be cleared when read.
TBOC: TRANSMIT BIT ORIENTED CODE (Address = 07 Hex)
(MSB)
(LSB)
SBOC
HBEN
BOC5
BOC4
BOC3
BOC2
BOC1
BOC0
SYMBOL
POSITION
NAME AND DESCRIPTION
SBOC
TBOC.7
Send BOC. Rising edge triggered. Must be transitioned from a 0 to a 1
transmit the BOC code placed in the BOC0 to BOC5 bits instead of
data from the HDLC controller.
HBEN
TBOC.6
Transmit HDLC & BOC Controller Enable.
0 = source FDL data from the TLINK pin
1 = source FDL data from the onboard HDLC and BOC controller
BOC5
TBOC.5
BOC Bit 5. Last bit transmitted of the 6bit code word.
BOC4
TBOC.4
BOC Bit 4.
BOC3
TBOC.3
BOC Bit 3.
BOC2
TBOC.2
BOC Bit 2.
BOC1
TBOC.1
BOC Bit 1.
BOC0
TBOC.0
BOC Bit 0. First bit transmitted of the 6bit code word.
THFR: TRANSMIT HDLC FIFO (Address = 08 Hex)
(MSB)
(LSB)
HDLC7
HDLC6
HDLC5
HDLC4
HDLC3
HDLC2
HDLC1
HDLC0
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
84
SYMBOL
POSITION
NAME AND DESCRIPTION
HDLC7
THFR.7
HDLC Data Bit 7. MSB of a HDLC packet data byte.
HDLC6
THFR.6
HDLC Data Bit 6.
HDLC5
THFR.5
HDLC Data Bit 5.
HDLC4
THFR.4
HDLC Data Bit 4.
HDLC3
THFR.3
HDLC Data Bit 3.
HDLC2
THFR.2
HDLC Data Bit 2.
HDLC1
THFR.1
HDLC Data Bit 1.
HDLC0
THFR.0
HDLC Data Bit 0. LSB of a HDLC packet data byte.
RDC1: RECEIVE HDLC DS0 CONTROL REGISTER 1 (Address = 90 Hex)
(MSB)
(LSB)
RDS0E
-
RDS0M
RD4
RD3
RD2
RD1
RD0
SYMBOL
POSITION
NAME AND DESCRIPTION
RDS0E
RDC1.7
HDLC DS0 Enable.
0 = use receive HDLC controller for the FDL.
1 = use receive HDLC controller for one or more DS0 channels.
-
RDC1.6
Not Assigned. Should be set to 0.
RDS0M
RDC1.5
DS0 Selection Mode.
0 = utilize the RD0 to RD4 bits to select which single DS0 channel to
use.
1 = utilize the RCHBLK control registers to select which DS0 channels
to use.
RD4
RDC1.4
DS0 Channel Select Bit 4. MSB of the DS0 channel select.
RD3
RDC1.3
DS0 Channel Select Bit 3.
RD2
RDC1.2
DS0 Channel Select Bit 2.
RD1
RDC1.1
DS0 Channel Select Bit 1.
RD0
RDC1.0
DS0 Channel Select Bit 0. LSB of the DS0 channel select.
RDC2: RECEIVE HDLC DS0 CONTROL REGISTER 2 (Address = 91 Hex)
(MSB)
(LSB)
RDB8
RDB7
RDB6
RDB5
RDB4
RDB3
RDB2
RDB1
SYMBOL
POSITION
NAME AND DESCRIPTION
RDB8
RDC2.7
DS0 Bit 8 Suppress Enable. MSB of the DS0. Set to one to stop this bit
from being used.
RDB7
RDC2.6
DS0 Bit 7 Suppress Enable. Set to one to stop this bit from being used.
RDB6
RDC2.5
DS0 Bit 6 Suppress Enable. Set to one to stop this bit from being used.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
85
RDB5
RDC2.4
DS0 Bit 5 Suppress Enable. Set to one to stop this bit from being used.
RDB4
RDC2.3
DS0 Bit 4 Suppress Enable. Set to one to stop this bit from being used.
RDB3
RDC2.2
DS0 Bit 3 Suppress Enable. Set to one to stop this bit from being used.
RDB2
RDC2.1
DS0 Bit 2 Suppress Enable. Set to one to stop this bit from being used.
RDB1
RDC2.0
DS0 Bit 1 Suppress Enable. LSB of the DS0. Set to one to stop this bit
from being used.
TDC1: TRANSMIT HDLC DS0 CONTROL REGISTER 1 (Address = 92 Hex)
(MSB)
(LSB)
TDS0E
-
TDS0M
TD4
TD3
TD2
TD1
TD0
SYMBOL
POSITION
NAME AND DESCRIPTION
TDS0E
TDC1.7
HDLC DS0 Enable.
0 = use transmit HDLC controller for the FDL.
1 = use transmit HDLC controller for one or more DS0 channels.
-
TDC1.6
Not Assigned. Should be set to 0.
TDS0M
TDC1.5
DS0 Selection Mode.
0 = utilize the TD0 to TD4 bits to select which single DS0 channel to
use.
1 = utilize the TCHBLK control registers to select which DS0 channels
to use.
TD4
TDC1.4
DS0 Channel Select Bit 4. MSB of the DS0 channel select.
TD3
TDC1.3
DS0 Channel Select Bit 3.
TD2
TDC1.2
DS0 Channel Select Bit 2.
TD1
TDC1.1
DS0 Channel Select Bit 1.
TD0
TDC1.0
DS0 Channel Select Bit 0. LSB of the DS0 channel select.
TDC2: TRANSMIT HDLC DS0 CONTROL REGISTER 2 (Address = 93 Hex)
(MSB)
(LSB)
TDB8
TDB7
TDB6
TDB5
TDB4
TDB3
TDB2
TDB1
SYMBOL
POSITION
NAME AND DESCRIPTION
TDB8
TDC2.7
DS0 Bit 8 Suppress Enable. MSB of the DS0. Set to one to stop this bit
from being used.
TDB7
TDC2.6
DS0 Bit 7 Suppress Enable. Set to one to stop this bit from being used.
TDB6
TDC2.5
DS0 Bit 6 Suppress Enable. Set to one to stop this bit from being used.
TDB5
TDC2.4
DS0 Bit 5 Suppress Enable. Set to one to stop this bit from being used.
TDB4
TDC2.3
DS0 Bit 4 Suppress Enable. Set to one to stop this bit from being used.
TDB3
TDC2.2
DS0 Bit 3 Suppress Enable. Set to one to stop this bit from being used.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
86
TDB2
TDC2.1
DS0 Bit 2 Suppress Enable. Set to one to stop this bit from being used.
TDB1
TDC2.0
DS0 Bit 1 Suppress Enable. LSB of the DS0. Set to one to stop this bit
from being used.
19.2
LEGACY FDL SUPPORT
19.2.1
Overview
The DS21Q42 maintains the circuitry that existed in the previous generation of Dallas
Semiconductor's single chip transceivers and quad framers. Section 19.2 covers the circuitry
and operation of this legacy functionality. In new applications, it is recommended that the
HDLC controller and BOC controller described in Section 19.1 be used. On the receive
side, it is possible to have both the new HDLC/BOC controller and the legacy hardware
working at the same time. However this is not possible on the transmit side since their can
be only one source the of the FDL data internal to the device.
19.2.2
Receive Section
In the receive section, the recovered FDL bits or Fs bits are shifted bitbybit into the
Receive FDL register (RFDL). Since the RFDL is 8 bits in length, it will fill up every 2 ms
(8 times 250 us). The framer will signal an external microcontroller that the buffer has filled
via the SR2.4 bit. If enabled via IMR2.4, the INT* pin will toggle low indicating that the
buffer has filled and needs to be read. The user has 2 ms to read this data before it is lost. If
the byte in the RFDL matches either of the bytes programmed into the RMTCH1 or
RMTCH2 registers, then the SR2.2 bit will be set to a one and the INT* pin will toggled
low if enabled via IMR2.2. This feature allows an external microcontroller to ignore the
FDL or Fs pattern until an important event occurs.
The framer also contains a zero destuffer, which is controlled via the CCR2.0 bit. In both
ANSI T1.403 and TR54016, communications on the FDL follows a subset of a LAPD
protocol. The LAPD protocol states that no more than 5 ones should be transmitted in a
row so that the data does not resemble an opening or closing flag (01111110) or an abort
signal (11111111). If enabled via CCR2.0, the DS21Q42 will automatically look for 5 ones
in a row, followed by a zero. If it finds such a pattern, it will automatically remove the zero.
If the zero destuffer sees six or more ones in a row followed by a zero, the zero is not
removed. The CCR2.0 bit should always be set to a one when the DS21Q42 is extracting
the FDL. More on how to use the DS21Q42 in FDL applications in this legacy support
mode is covered in a separate Application Note.
RFDL: RECEIVE FDL REGISTER (Address = 28 Hex)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
87
(MSB)
(LSB)
RFDL7
RFDL6
RFDL5
RFDL4
RFDL3
RFDL2
RFDL1
RFDL0
SYMBOL
POSITION
NAME AND DESCRIPTION
RFDL7
RFDL.7
MSB of the Received FDL Code
RFDL0
RFDL.0
LSB of the Received FDL Code
The Receive FDL Register (RFDL) reports the incoming Facility Data Link (FDL) or the incoming Fs bits. The
LSB is received first.
RMTCH1: RECEIVE FDL MATCH REGISTER 1 (Address = 29 Hex)
RMTCH2: RECEIVE FDL MATCH REGISTER 2 (Address = 2A Hex)
(MSB)
(LSB)
RMFDL7
RMFDL6
RMFDL5
RMFDL4
RMFDL3
RMFDL2
RMFDL1
RMFDL0
SYMBOL
POSITION
NAME AND DESCRIPTION
RMFDL7
RMTCH1.7
RMTCH2.7
MSB of the FDL Match Code
RMFDL0
RMTCH1.0
RMTCH2.0
LSB of the FDL Match Code
When the byte in the Receive FDL Register matches either of the two Receive FDL Match Registers
(RMTCH1/RMTCH2), SR2.2 will be set to a one and the INT* will go active if enabled via IMR2.2.
19.2.3
Transmit Section
The transmit section will shift out into the T1 data stream, either the FDL (in the ESF
framing mode) or the Fs bits (in the D4 framing mode) contained in the Transmit FDL
register (TFDL). When a new value is written to the TFDL, it will be multiplexed serially
(LSB first) into the proper position in the outgoing T1 data stream. After the full eight bits
has been shifted out, the framer will signal the host microcontroller that the buffer is empty
and that more data is needed by setting the SR2.3 bit to a one. The INT* will also toggle
low if enabled via IMR2.3. The user has 2 ms to update the TFDL with a new value. If the
TFDL is not updated, the old value in the TFDL will be transmitted once again. The framer
also contains a zero stuffer, which is controlled via the CCR2.4 bit. In both ANSI T1.403
and TR54016, communications on the FDL follows a subset of a LAPD protocol. The
LAPD protocol states that no more than 5 ones should be transmitted in a row so that the
data does not resemble an opening or closing flag (01111110) or an abort signal (11111111).
If enabled via CCR2.4, the framer will automatically look for 5 ones in a row. If it finds
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
88
such a pattern, it will automatically insert a zero after the five ones. The CCR2.0 bit should
always be set to a one when the framer is inserting the FDL. More on how to use the
DS21Q42 in FDL applications is covered in a separate Application Note.
TFDL: TRANSMIT FDL REGISTER (Address = 7E Hex)
[Also used to insert Fs framing pattern in D4 framing mode; see Section 19.3]
(MSB)
(LSB)
TFDL7
TFDL6
TFDL5
TFDL4
TFDL3
TFDL2
TFDL1
TFDL0
SYMBOL
POSITION
NAME AND DESCRIPTION
TFDL7
TFDL.7
MSB of the FDL code to be transmitted
TFDL0
TFDL.0
LSB of the FDL code to be transmitted
The Transmit FDL Register (TFDL) contains the Facility Data Link (FDL) information that is to be inserted on a
byte basis into the outgoing T1 data stream. The LSB is transmitted first.
19.3
D4/SLC96 OPERATION
In the D4 framing mode, the framer uses the TFDL register to insert the Fs framing pattern.
To allow the device to properly insert the Fs framing pattern, the TFDL register at address
7Eh must be programmed to 1Ch and the following bits must be programmed as shown:
TCR1.2=0 (source Fs data from the TFDL register) CCR2.5=1 (allow the TFDL register to
load on multiframe boundaries)
Since the SLC96 message fields share the Fsbit position, the user can access the these
message fields via the TFDL and RFDL registers. Please see the separate Application Note
for a detailed description of how to implement a SLC96
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
89
20. PROGRAMMABLE INBAND CODE GENERATION AND DETECTION
Each framer in the DS21Q42 has the ability to generate and detect a repeating bit pattern that
is from one to eight bits in length. To transmit a pattern, the user will load the pattern to be
sent into the Transmit Code Definition (TCD) register and select the proper length of the
pattern by setting the TC0 and TC1 bits in the InBand Code Control (IBCC) register.
Once this is accomplished, the pattern will be transmitted as long as the TLOOP control bit
(CCR3.1) is enabled. Normally (unless the transmit formatter is programmed to not insert
the Fbit position) the framer will overwrite the repeating pattern once every 193 bits to
allow the Fbit position to be sent. See Figure 24-15 for more details. As an example, if the
user wished to transmit the standard "loop up" code for Channel Service Units which is a
repeating pattern of ...10000100001... then 80h would be loaded into TDR and the length
would set to 5 bits.
Each framer can detect two separate repeating patterns to allow for both a "loop up" code and
a "loop down" code to be detected. The user will program the codes to be detected in the
Receive Up Code Definition (RUPCD) register and the Receive Down Code Definition
(RDNCD) register and the length of each pattern will be selected via the IBCC register. The
framer will detect repeating pattern codes in both framed and unframed circumstances with
bit error rates as high as 10**2. The code detector has a nominal integration period of 48
ms. Hence, after about 48 ms of receiving either code, the proper status bit (LUP at SR1.7
and LDN at SR1.6) will be set to a one. Normally codes are sent for a period of 5 seconds.
it is recommend that the software poll the framer every 100 ms to 1000 ms until 5 seconds
has elapsed to insure that the code is continuously present.
IBCC: INBAND CODE CONTROL REGISTER (Address=12 Hex)
(MSB)
(LSB)
TC1
TC0
RUP2
RUP1
RUP0
RDN2
RDN1
RDN0
SYMBOL
POSITION
NAME AND DESCRIPTION
TC1
IBCC.7
Transmit Code Length Definition Bit 1. See Table 201
TC0
IBCC.6
Transmit Code Length Definition Bit 0. See Table 201
RUP2
IBCC.5
Receive Up Code Length Definition Bit 2. See Table 202
RUP1
IBCC.4
Receive Up Code Length Definition Bit 1. See Table 202
RUP0
IBCC.3
Receive Up Code Length Definition Bit 0. See Table 202
RDN2
IBCC.2
Receive Down Code Length Definition Bit 2. See Table 202
RDN1
IBCC.1
Receive Down Code Length Definition Bit 1. See Table 202
RDN0
IBCC.0
Receive Down Code Length Definition Bit 0. See Table 202
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
90
Table 20-1
TC1
TC0
LENGTH SELECTED
0
0
5 bits
0
1
6 bits / 3 bits
1
0
7 bits
1
1
8 bits / 4 bits / 2 bits / 1 bits
RECEIVE CODE LENGTH Table 20-2
RUP2/ RDN2
RUP1/ RDN1
RUP0/ RDN0
LENGTH
SELECTED
0
0
0
1 bits
0
0
1
2 bits
0
1
0
3 bits
0
1
1
4 bits
1
0
0
5 bits
1
0
1
6 bits
1
1
0
7 bits
1
1
1
8 bits
TCD: TRANSMIT CODE DEFINITION REGISTER (Address=13 Hex)
(MSB)
(LSB)
C7
C6
C5
C4
C3
C2
C1
C0
SYMBOL
POSITION
NAME AND DESCRIPTION
C7
TCD.7
Transmit Code Definition Bit 7. First bit of the repeating pattern.
C6
TCD.6
Transmit Code Definition Bit 6.
C5
TCD.5
Transmit Code Definition Bit 5.
C4
TCD.4
Transmit Code Definition Bit 4.
C3
TCD.3
Transmit Code Definition Bit 3.
C2
TCD.2
Transmit Code Definition Bit 2. A Don't Care if a 5 bit length is
selected.
C1
TCD.1
Transmit Code Definition Bit 1. A Don't Care if a 5 or 6 bit length is
selected.
C0
TCD.0
Transmit Code Definition Bit 0. A Don't Care if a 5, 6 or 7 bit length
is selected.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
91
RUPCD: RECEIVE UP CODE DEFINITION REGISTER (Address=14 Hex)
(MSB)
(LSB)
C7
C6
C5
C4
C3
C2
C1
C0
SYMBOL
POSITION
NAME AND DESCRIPTION
C7
RUPCD.7
Receive Up Code Definition Bit 7. First bit of the repeating pattern.
C6
RUPCD.6
Receive Up Code Definition Bit 6. A Don't Care if a 1 bit length is
selected.
C5
RUPCD.5
Receive Up Code Definition Bit 5. A Don't Care if a 1 or 2 bit length
is selected.
C4
RUPCD.4
Receive Up Code Definition Bit 4. A Don't Care if a 1 to 3 bit length
is selected.
C3
RUPCD.3
Receive Up Code Definition Bit 3. A Don't Care if a 1 to 4 bit length
is selected.
C2
RUPCD.2
Receive Up Code Definition Bit 2. A Don't Care if a 1 to 5 bit length
is selected.
C1
RUPCD.1
Receive Up Code Definition Bit 1. A Don't Care if a 1 to 6 bit length
is selected.
C0
RUPCD.0
Receive Up Code Definition Bit 0. A Don't Care if a 1 to 7 bit length
is selected.
RDNCD: RECEIVE DOWN CODE DEFINITION REGISTER (Address=15 Hex)
(MSB)
(LSB)
C7
C6
C5
C4
C3
C2
C1
C0
SYMBOL
POSITION
NAME AND DESCRIPTION
C7
RDNCD.7
Receive Down Code Definition Bit 7. First bit of the repeating
pattern.
C6
RDNCD.6
Receive Down Code Definition Bit 6. A Don't Care if a 1 bit length is
selected.
C5
RDNCD.5
Receive Down Code Definition Bit 5. A Don't Care if a 1 or 2 bit
length is selected.
C4
RDNCD.4
Receive Down Code Definition Bit 4. A Don't Care if a 1 to 3 bit
length is selected.
C3
RDNCD.3
Receive Down Code Definition Bit 3. A Don't Care if a 1 to 4 bit
length is selected.
C2
RDNCD.2
Receive Down Code Definition Bit 2. A Don't Care if a 1 to 5 bit
length is selected.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
92
C1
RDNCD.1
Receive Down Code Definition Bit 1. A Don't Care if a 1 to 6 bit
length is selected.
C0
RDNCD.0
Receive Down Code Definition Bit 0. A Don't Care if a 1 to 7 bit
length is selected.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
93
21. TRANSMIT TRANSPARENCY
Each of the 24 T1 channels in the transmit direction of the framer can be either
forced to be transparent or in other words, can be forced to stop Bit 7 Stuffing
and/or Robbed Signaling from overwriting the data in the channels.
Transparency can be invoked on a channel by channel basis by properly setting
the TTR1, TTR2, and TTR3 registers.
TTR1/TTR2/TTR3: TRANSMIT TRANSPARENCY REGISTER (Address=39 to 3B Hex)
(MSB)
(LSB)
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
TTR1 (39)
CH16
CH15
CH14
CH13
CH12
CH11
CH10
CH9
TTR2 (3A)
CH24
CH23
CH22
CH21
CH20
CH19
CH18
CH17
TTR3 (3B)
SYMBOLS
POSITIONS
NAME AND DESCRIPTION
CH1-24
TTR1.0-3.7
Transmit Transparency Registers.
0 = this DS0 channel is not transparent
1 = this DS0 channel is transparent
Each of the bit position in the Transmit Transparency Registers (TTR1/TTR2/TTR3)
represent a DS0 channel in the outgoing frame. When these bits are set to a one, the
corresponding channel is transparent (or clear). If a DS0 is programmed to be clear, no
robbed bit signaling will be inserted nor will the channel have Bit 7 stuffing performed.
However, in the D4 framing mode, bit 2 will be overwritten by a zero when a Yellow Alarm
is transmitted. Also the user has the option to prevent the TTR registers from determining
which channels are to have Bit 7 stuffing performed. If the TCR2.0 and TCR1.3 bits are set
to one, then all 24 T1 channels will have Bit 7 stuffing performed on them regardless of how
the TTR registers are programmed. In this manner, the TTR registers are only affecting
which channels are to have robbed bit signaling inserted into them. Please see Figure 24-15
for more details.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
94
22. INTERLEAVED PCM BUS OPERATION
In many architectures, the outputs of individual framers are combined into higher speed
serial buses to simplify transport across the system. The DS21Q42 can be configured to
allow each framer's data and signaling busses to be multiplexed into higher speed data and
signaling busses eliminating external hardware saving board space and cost.
The interleaved PCM bus option supports two bus speeds and interleave modes. The 4.096
MHz bus speed allows two framers to share a common bus. The 8.192 MHz bus speed
allows all four of the DS21Q42's framers to share a common bus. Framers can interleave
their data either on byte or frame boundaries. Framers that share a common bus must be
configured through software and require several device pins to be connected together
externally (see figures 22-1 & 22-2). Each framer's elastic stores must be enabled and
configured for 2.048 MHz operation. The signal RSYNC must be configured as an input on
each framer.
For all bus configurations, one framer will be configured as the master device and the
remaining framers on the shared bus will be configured as slave devices. Refer to the IBO
register description below for more detail. In the 4.096 MHz bus configuration there is one
master and one slave per bus. Figure 22-1 shows the DS21Q42 configured to support two
4.096 MHz buses. Bus 1 consists of framers 0 and 1. Bus 2 consists of framers 2 and 3.
Framers 0 and 2 are programmed as master devices. Framers 1 and 3 are programmed as
slave devices. In the 8.192 MHz bus configuration there is one master and three slaves.
Figure 22-2 shows the DS21Q42 configured to support a 8.192 MHz bus. Framers 0 is
programmed as the master device. Framers 1, 2 and 3 are programmed as slave devices.
Consult timing diagrams in section 24 for additional information.
When using the frame interleave mode, all framers that share an interleaved bus must have
receive signals (RPOS & RNEG) that are synchronous with each other. The received
signals must originate from the same clock reference. This restriction does not apply in the
byte interleave mode.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
95
IBO: INTERLEAVE BUS OPERATION REGISTER (Address = 94 Hex)
(MSB)
(LSB)
-
-
-
-
IBOEN
INTSEL
MSEL0
MSEL1
SYMBOL
POSITION
NAME AND DESCRIPTION
-
IBO.6
Not Assigned. Should be set to 0.
-
IBO.6
Not Assigned. Should be set to 0.
-
IBO.5
Not Assigned. Should be set to 0.
-
IBO.4
Not Assigned. Should be set to 0.
IBOEN
IBO.3
Interleave Bus Operation Enable
0 = Interleave Bus Operation disabled.
1 = Interleave Bus Operation enabled.
INTSEL
IBO.2
Interleave Type Select
0 = Byte interleave.
1 = Frame interleave.
MSEL0
IBO.1
Master Device Bus Select Bit 0 See table 22-1.
MSEL1
IBO.0
Master Device Bus Select Bit 1 See table 22-1.
Master Device Bus Select Table 22-1
MSEL1
MSEL0
Function
0
0
Slave device.
0
1
Master device with 1 slave device (4.096 MHz bus rate)
1
0
Master device with 3 slave devices (8.192 MHz bus rate)
1
1
Reserved
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
96
4.096 MHz Interleaved Bus External Pin Connection Example Figure
22-1
8.192 MHz Interleaved Bus External Pin Connection Example Figure
22-2
RSYSCLK0
TSYSCLK0
RSER0
TSER0
RSYNC0
TSSYNC0
RSIG0
TSIG0
FRAMER 0
RSYSCLK1
TSYSCLK1
RSER1
TSER1
RSYNC1
TSSYNC1
RSIG1
TSIG1
FRAMER 1
RSYSCLK2
TSYSCLK2
RSER2
TSER2
RSYNC2
TSSYNC2
RSIG2
TSIG2
FRAMER 2
RSYSCLK3
TSYSCLK3
RSER3
TSER3
RSYNC3
TSSYNC3
RSIG3
TSIG3
FRAMER 3
SYSCLK
SYNC INPUT
RSER
TSER
RSIG
TSIG
RSYSCLK0
TSYSCLK0
RSER0
TSER0
RSYNC0
TSSYNC0
RSIG0
TSIG0
FRAMER 0
RSYSCLK1
TSYSCLK1
RSER1
TSER1
RSYNC1
TSSYNC1
RSIG1
TSIG1
FRAMER 1
SYSCLK
SYNC INPUT
RSER
TSER
RSIG
TSIG
Bus 1
Bus 2
RSYSCLK2
TSYSCLK2
RSER2
TSER2
RSYNC2
TSSYNC2
RSIG2
TSIG2
FRAMER 2
RSYSCLK3
TSYSCLK3
RSER3
TSER3
RSYNC3
TSSYNC3
RSIG3
TSIG3
FRAMER 3
SYSCLK
SYNC INPUT
RSER
TSER
RSIG
TSIG
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
97
23. JTAG-BOUNDARY SCAN ARCHITECTURE AND TEST ACCESS PORT
23.1
Description
The DS21Q42 IEEE 1149.1 design supports the standard instruction codes
SAMPLE/PRELOAD, BYPASS, and EXTEST. Optional public instructions included
with this design are HIGHZ, CLAMP, and IDCODE. See Figure 23-1 for a block diagram.
The DS21Q42 contains the following items, which meet the requirements, set by the IEEE
1149.1 Standard Test Access Port and Boundary Scan Architecture. The DS21FT42 should
be considered as 3 individual DS21Q42 devices. The DS21FF42 should be considered as 4
individual DS21Q42 devices.
Test Access Port (TAP)
TAP Controller
Instruction Register
Bypass Register
Boundary Scan Register
Device Identification Register
The JTAG feature is only available when the DS21Q42 feature set is selected (FMS = 0).
The JTAG feature is disabled when the DS21Q42 is configured for emulation of the
DS21Q41B (FMS = 1). FMS is tied to ground for the DS21FF42/DS21FT42. Details on
Boundary Scan Architecture and the Test Access Port can be found in IEEE 1149.1-1990,
IEEE 1149.1a-1993, and IEEE 1149.1b-1994.
The Test Access Port has the necessary interface pins; JTRST*, JTCLK, JTMS, JTDI, and
JTDO. See the pin descriptions for details.
Boundary Scan Architecture Figure 23-1
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
98
23.2
TAP Controller State Machine
This section covers the details on the operation of the Test Access Port (TAP) Controller State Machine. Please
see Figure 23.2 for details on each of the states described below.
TAP Controller
The TAP controller is a finite state machine that responds to the logic level at JTMS on the rising edge of JTCLK.
Test-Logic-Reset
Upon power up of the DS21Q42, the TAP Controller will be in the Test-Logic-Reset state. The Instruction
register will contain the IDCODE instruction. All system logic of the DS21Q42 will operate normally.
Run-Test-Idle
The Run-Test-Idle is used between scan operations or during specific tests. The Instruction register and Test
registers will remain idle.
Select-DR-Scan
All test registers retain their previous state. With JTMS low, a rising edge of JTCLK moves the controller into the
Capture-DR state and will initiate a scan sequence. JTMS HIGH during a rising edge on JTCLK moves the
controller to the Select-IR
Capture-DR
+V
Boundary Scan
Register
Identification
Register
Bypass
Register
Instruction
Register
JTDI
JTMS
JTCLK
JTRST
JTDO
+V
+V
Test Access Port
Controller
MUX
10K
10K
10K
Select
Output Enable
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
99
Data may be parallel-loaded into the Test Data registers selected by the current instruction. If the instruction
does not call for a parallel load or the selected register does not allow parallel loads, the Test register will remain
at its current value. On the rising edge of JTCLK, the controller will go to the Shift-DR state if JTMS is low or it
will go to the Exit1-DR state if JTMS is high.
Shift-DR
The Test Data register selected by the current instruction will be connected between JTDI and JTDO and will
shift data one stage towards its serial output on each rising edge of JTCLK. If a Test Register selected by the
current instruction is not placed in the serial path, it will maintain its previous state.
Exit1-DR
While in this state, a rising edge on JTCLK with JTMS high will put the controller in the Update-DR state, and
terminate the scanning process. A rising edge on JTCLK with JTMS low will put the controller in the Pause-DR
state.
Pause-DR
Shifting of the test registers is halted while in this state. All Test registers selected by the current instruction will
retain their previous state. The controller will remain in this state while JTMS is low. A rising edge on JTCLK
with JTMS high will put the controller in the Exit2-DR state.
Exit2-DR
While in this state, a rising edge on JTCLK with JTMS high will put the controller in the Update-DR state and
terminate the scanning process. A rising edge on JTCLK with JTMS low will enter the Shift-DR state.
Update-DR
A falling edge on JTCLK while in the Update-DR state will latch the data from the shift register path of the Test
registers into the data output latches. This prevents changes at the parallel output due to changes in the shift
register. A rising edge on JTCLK with JTMS low, will put the controller in the Run-Test-Idle state. With JTMS
high, the controller will enter the Select-DR-Scan state.
Select-IR-Scan
All test registers retain their previous state. The instruction register will remain unchanged during this state. With
JTMS low, a rising edge of JTCLK moves the controller into the Capture-IR state and will initiate a scan
sequence for the Instruction register. JTMS high during a rising edge on JTCLK puts the controller back into the
Test-Logic-Reset state.
Capture-IR
The Capture-IR state is used to load the shift register in the instruction register with a fixed value. This value is
loaded on the rising edge of JTCLK. If JTMS is high on the rising edge of JTCLK, the controller will enter the
Exit1-IR state. If JTMS is low on the rising edge of JTCLK, the controller will enter the Shift-IR state.
Shift-IR
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
100
In this state, the shift register in the instruction register is connected between JTDI and JTDO and shifts data one
stage for every rising edge of JTCLK towards the serial output. The parallel registers, as well as all Test registers
remain at their previous states. A rising edge on JTCLK with JTMS high will move the controller to the Exit1-IR
state. A rising edge on JTCLK with JTMS low will keep the controller in the Shift-IR state while moving data one
stage thorough the instruction shift register.
Exit1-IR
A rising edge on JTCLK with JTMS low will put the controller in the Pause-IR state. If JTMS is high on the rising
edge of JTCLK, the controller will enter the Update-IR state and terminate the scanning process.
Pause-IR
Shifting of the instruction shift register is halted temporarily. With JTMS high, a rising edge on JTCLK will put
the controller in the Exit2-IR state. The controller will remain in the Pause-IR state if JTMS is low during a rising
edge on JTCLK.
Exit2-IR
A rising edge on JTCLK with JTMS low will put the controller in the Update-IR state. The controller will loop
back to Shift-IR if JTMS is high during a rising edge of JTCLK in this state.
Update-IR
The instruction code shifted into the instruction shift register is latched into the parallel output on the falling edge
of JTCLK as the controller enters this state. Once latched, this instruction becomes the current instruction. A
rising edge on JTCLK with JTMS low, will put the controller in the Run-Test-Idle state. With JTMS high, the
controller will enter the Select-DR-Scan state.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
101
TAP Controller State Machine Figure 23-2
23.3
Instruction Register and Instructions
The instruction register contains a shift register as well as a latched parallel output and is 3
bits in length. When the TAP controller enters the Shift-IR state, the instruction shift
register will be connected between JTDI and JTDO. While in the Shift-IR state, a rising
edge on JTCLK with JTMS low will shift the data one stage towards the serial output at
JTDO. A rising edge on JTCLK in the Exit1-IR state or the Exit2-IR state with JTMS
high will move the controller to the Update-IR state The falling edge of that same JTCLK
will latch the data in the instruction shift register to the instruction parallel output.
Instructions supported by the DS21Q42 with their respective operational binary codes are
shown in Table 23-1.
1
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
0
0
0
0
1
1
0
0
0
0
Select
DR-Scan
Capture DR
Shift DR
Exit DR
Pause DR
Exit2 DR
Update DR
Select
IR-Scan
Capture IR
Shift IR
Exit IR
Pause IR
Exit2 IR
Update IR
Test Logic
Reset
Run Test/
Idle
0
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
102
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
103
Instruction Codes For The DS21352/552 IEEE 1149.1 Architecture
Table 23-1
Instruction
Selected Register
Instruction Codes
SAMPLE/PRELOAD
Boundary Scan
010
BYPASS
Bypass
111
EXTEST
Boundary Scan
000
CLAMP
Boundary Scan
011
HIGHZ
Boundary Scan
100
IDCODE
Device Identification
001
SAMPLE/PRELOAD
A mandatory instruction for the IEEE 1149.1 specification. This instruction supports two
functions. The digital I/Os of the DS21Q42 can be sampled at the boundary scan register
without interfering with the normal operation of the device by using the Capture-DR state.
SAMPLE/PRELOAD also allows the DS21Q42 to shift data into the boundary scan register
via JTDI using the Shift-DR state.
EXTEST
EXTEST allows testing of all interconnections to the DS21Q42. When the EXTEST
instruction is latched in the instruction register, the following actions occur. Once enabled
via the Update-IR state, the parallel outputs of all digital output pins will be driven. The
boundary scan register will be connected between JTDI and JTDO. The Capture-DR will
sample all digital inputs into the boundary scan register.
BYPASS
When the BYPASS instruction is latched into the parallel instruction register, JTDI
connects to JTDO through the one-bit bypass test register. This allows data to pass from
JTDI to JTDO not affecting the device's normal operation.
IDCODE
When the IDCODE instruction is latched into the parallel instruction register, the
Identification Test register is selected. The device identification code will be loaded into the
Identification register on the rising edge of JTCLK following entry into the Capture-DR
state. Shift-DR can be used to shift the identification code out serially via JTDO. During
Test-Logic-Reset, the identification code is forced into the instruction register's parallel
output. The ID code will always have a `1' in the LSB position. The next 11 bits identify
the manufacturer's JEDEC number and number of continuation bytes followed by 16 bits for
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
104
the device and 4 bits for the version. See Table 23-2. Table 23-3 lists the device ID codes
for the DS21Q42 and DS21Q44 devices.
ID Code Structure Table 23-2
MSB
LSB
Contents
Version
(Contact Factory)
Device ID
(See Table 23-3)
JEDEC
"00010100001"
"1"
Length
4 bits
16bits
11bits
1bit
Device ID Codes Table 23-3
DEVICE
16-BIT NUMBER
DS21Q42
0000h
DS21Q44
0001h
HIGHZ
All digital outputs of the DS21Q42 will be placed in a high impedance state. The
BYPASS register will be connected between JTDI and JTDO.
CLAMP
All digital outputs of the DS21Q42 will output data from the boundary scan parallel output
while connecting the bypass register between JTDI and JTDO. The outputs will not change
during the CLAMP instruction.
23.4
Test Registers
IEEE 1149.1 requires a minimum of two test registers; the bypass register and the
boundary scan register. An optional test register has been included with the
DS21Q42 design. This test register is the identification register and is used in
conjunction with the IDCODE instruction and the Test-Logic-Reset state of the TAP
controller.
Boundary Scan Register
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
105
This register contains both a shift register path and a latched parallel output for all control
cells and digital I/O cells and is 126 bits in length. Table 23-4 shows all of the cell bit
locations and definitions.
Bypass Register
This is a single one-bit shift register used in conjunction with the BYPASS, CLAMP, and
HIGHZ instructions, which provides a short path between JTDI and JTDO.
Identification Register
The identification register contains a 32-bit shift register and a 32-bit latched parallel output.
This register is selected during the IDCODE instruction and when the TAP controller is in
the Test-Logic-Reset state.
Boundary Scan Register Description Table 23-4
MCM
LEAD
(DIE1)
MCM
LEAD
(DIE2)
MCM
LEAD
(DIE3)
MCM
LEAD
(DIE4)
SCAN
REGISTER
BIT
DS21Q42
DIE
SYMBOL
TYPE
CONTROL BIT
DESCRIPTION
B7
102
8MCLK
O
G20
G20
G20
G20
60
A0
I
H20
H20
H20
H20
59
A1
I
G19
G19
G19
G19
58
A2
I
H19
H19
H19
H19
57
A3
I
G18
G18
G18
G18
56
A4
I
H18
H18
H18
H18
55
A5
I
G17
G17
G17
G17
54
A6/ALE (AS)
I
H17
H17
H17
H17
37
A7
I
W15
W15
W15
W15
22
BTS
I
-
94
BUS.cntl
-
0 = D0-D7 or AD0-
AD7 are inputs
1 = D0-D7 or AD0-
AD7 are outputs
B6
100
CLKSI
I
T8
Y4
Y15
E19
23
CS*
I
L20
L20
L20
L20
93
D0 or AD0
I/O
M20
M20
M20
M20
92
D1 or AD1
I/O
L19
L19
L19
L19
91
D2 or AD2
I/O
M19
M19
M19
M19
90
D3 or AD3
I/O
L18
L18
L18
L18
89
D4 or AD4
I/O
M18
M18
M18
M18
88
D5 or AD5
I/O
L17
L17
L17
L17
87
D6 or AD6
I/O
M17
M17
M17
M17
86
D7 or AD7
I/O
Y14
Y14
Y14
Y14
25
FS0
I
W14
W14
W14
W14
24
FS1
I
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
106
G16
G16
G16
G16
53
INT*
O
V14
V14
V14
V14
-
JTCLK
I
E10
E10
E10
E10
-
JTDI
I
A19
-
JTDOF
O
T17
JTDOT
O
H16
H16
H16
H16
-
JTMS
I
K17
K17
K17
K17
-
JTRST*
I
P17
P17
P17
P17
19
MUX
I
C2
N1
Y8
D16
72
RCHBLK0
O
G3
Y1
W12
K20
39
RCHBLK1
O
E6
U6
V17
B18
5
RCHBLK2
O
A8
N5
U17
B16
107
RCHBLK3
O
A2
M3
T9
D14
76
RCLK0
I
K1
V1
W10
P20
43
RCLK1
I
D10
W6
Y18
C18
9
RCLK2
I
B9
J3
N17
C12
111
RCLK3
I
E18
E18
E18
E18
21
RD*/(DS*)
I
B2
M2
U9
E14
75
RNEG0
I
H2
V3
W11
N20
42
RNEG1
I
D9
V7
W17
C20
8
RNEG2
I
A9
P3
T20
B13
110
RNEG3
I
A1
M1
T10
D15
74
RPOS0
I
H1
W2
V11
J18
41
RPOS1
I
H4
V5
Y19
A20
7
RPOS2
I
C9
P4
R19
A14
109
RPOS3
I
C1
P1
U11
E16
68
RSER0
O
H3
W4
Y12
F20
33
RSER1
O
C6
T7
V16
C16
1
RSER2
O
C8
N4
T16
A12
103
RSER3
O
D3
N2
U10
E15
73
RSIG0
O
G2
V4
Y11
K19
40
RSIG1
O
D4
V6
W19
C17
6
RSIG2
O
D8
K5
U20
A15
108
RSIG3
O
B1
N3
T11
J17
69
RSYNC0
I/O
-
70
RSYNC0.cntl
-
0 = RSYNC0 an input
1 = RSYNC0 an output
G1
Y2
V13
J19
34
RSYNC1
I/O
-
35
RSYNC1.cntl
-
0 = RSYNC1 an input
1 = RSYNC1 an output
D6
U5
V15
B17
2
RSYNC2
I/O
-
3
RSYNC2.cntl
-
0 = RSYNC2 an input
1 = RSYNC2 an output
A7
J4
P18
B12
104
RSYNC3
I/O
-
105
RSYNC3.cntl
-
0 = RSYNC3 an input
1 = RSYNC3 an output
B5
M4
T4
E13
71
*RSYSCLK0
I
E2
T2
Y9
N18
38
*RSYSCLK1
I
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
107
E5
Y5
U12
E20
4
*RSYSCLK2
I
B8
W3
R17
C14
106
*RSYSCLK3
I
D1
R1
U13
K16
65
TCLK0
I
H5
Y3
Y13
F19
31
TCLK1
I
C5
T6
T18
E17
125
TCLK2
I
A5
K2
P16
C11
99
TCLK3
I
A13
A13
A13
A13
26
TEST
I
C3
L1
U14
D11
79
TNEG0
O
J1
V2
V12
K18
46
TNEG1
O
F5
V8
W18
C19
12
TNEG2
O
A10
P5
T19
B15
114
TNEG3
O
B3
L2
T14
E12
80
TPOS0
O
J2
W1
Y10
N19
47
TPOS1
O
J5
W7
V18
B19
13
TPOS2
O
B10
R3
V20
B14
115
TPOS3
O
B4
L5
M16
D13
84
TSER0
I
E1
T1
W9
F17
51
TSER1
I
F3
Y6
W16
D18
17
TSER2
I
D7
T3
W20
A18
119
TSER3
I
C4
L3
U15
E11
82
TSIG0
I
F1
U2
V10
P19
49
TSIG1
I
G4
V9
U18
B20
15
TSIG2
I
C10
R5
R18
A16
117
TSIG3
I
A3
L4
T15
C13
83
TSSYNC0
I
F2
U1
W8
R20
50
TSSYNC1
I
G5
Y7
Y17
D20
16
TSSYNC2
I
E8
R4
U19
A17
118
TSSYNC3
I
E3
R2
T13
J16
62
TSYNC0
I/O
-
63
TSYNC0.cntl
-
0 = TSYNC0 an input
1 = TSYNC0 an output
F4
W5
W13
F18
28
TSYNC1
I/O
-
29
TSYNC1.cntl
-
0 = TSYNC1 an input
1 = TSYNC1 an output
E7
T5
U16
C15
122
TSYNC2
I/O
-
123
TSYNC2.cntl
-
0 = TSYNC2 an input
1 = TSYNC2 an output
A4
M5
N16
D12
96
TSYNC3
I/O
-
97
TSYNC3.cntl
-
0 = TSYNC3 an input
1 = TSYNC3 an output
B5
M4
T4
E13
85
*TSYSCLK0
I
E2
T2
Y9
N18
52
*TSYSCLK1
I
E5
Y5
U12
E20
18
*TSYSCLK2
I
B8
W3
R17
C14
120
*TSYSCLK3
I
C7
K3
V19
D17
-
VDD
-
E4
U7
T12
F16
-
VDD
-
D2
P2
L16
B11
-
VDD
-
E9
U3
U4
J20
-
VSS
-
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
108
A6
K4
R16
A11
-
VSS
-
D5
U8
Y20
D19
-
VSS
-
Y16
Y16
Y16
Y16
20
WR*/(R/W*)
I
* NOTE: RSYSCLKn and TSYSCLKn are tied together.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
109
24. TIMING DIAGRAMS
RECEIVE SIDE D4 TIMING Figure 24-1
FRAME#
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
RSYNC /
RFSYNC
1
RSYNC
RSYNC2
3
RLCLK
RLINK4
Notes:
1. RSYNC in the frame mode (RCR2.4 = 0) and double-wide frame sync is not enabled (RCR2.5 = 0)
2. RSYNC in the frame mode (RCR2.4 = 0) and double-wide frame sync is enabled (RCR2.5 = 1)
3. RSYNC in the multiframe mode (RCR2.4 = 1)
4. RLINK data (Fs - bits) is updated one bit prior to even frames and held for two frames
5. RLINK and RLCLK are not synchronous with RSYNC when the receive side elastic store is enabled
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
110
RECEIVE SIDE ESF TIMING Figure 24-2
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
FRAME#
RSYNC /
RFSYNC
RSYNC
1
2
RSYNC
3
RLCLK
RLINK
4
5
RLCLK
RLINK
6
7
Notes:
1. RSYNC in the frame mode (RCR2.4 = 0) and double-wide frame sync is not enabled (RCR2.5 = 0)
2. RSYNC in the frame mode (RCR2.4 = 0) and double-wide frame sync is enabled (RCR2.5 = 1)
3. RSYNC in the multiframe mode (RCR2.4 = 1)
4. ZBTSI mode disabled (RCR2.6 = 0)
5. RLINK data (FDL bits) is updated one bit time before odd frames and held for two frames
6. ZBTSI mode is enabled (RCR2.6 = 1)
7. RLINK data (Z bits) is updated one bit time before odd frames and held for four frames
8. RLINK and RLCLK are not synchronous with RSYNC when the receive side elastic store is enabled
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
111
RECEIVE SIDE BOUNDARY TIMING (with elastic store disabled) Figure
24-3
RCLK
RCHCLK
RFSYNC
RCHBLK
2
Notes:
1. There is a 13 RCLK delay from RPOS/RNEG to RSER.
2. RCHBLK is programmed to block channel 24.
3. Shown is RLINK/RLCLK in the ESF framing mode.
RLCLK
RLINK
RSER
LSB MSB
F
MSB
CHANNEL 23
CHANNEL 24
LSB
CHANNEL 1
RSYNC
RSIG
D/B
CHANNEL 23
CHANNEL 24
D/B
CHANNEL 1
C/A
B
A
C/A
B
A
A
3
RPOS
LSB
MSB
MSB
CHANNEL 1
CHANNEL 2
LSB
F
LSB MSB
RNEG
1
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
112
RECEIVE SIDE 1.544 MHz BOUNDARY TIMING (with elastic store
enabled) Figure 24-4
RSER
LSB MSB
F
MSB
CHANNEL 23
CHANNEL 24
LSB
CHANNEL 1
RCHCLK
RCHBLK
RSYSCLK
RSYNC
2
3
Notes:
1. RSYNC is in the output mode (RCR2.3 = 0)
2. RSYNC is in the input mode (RCR2.3 = 1)
3. RCHBLK is programmed to block channel 24
RSYNC
1
RMSYNC
RSIG
D/B
CHANNEL 23
CHANNEL 24
D/B
CHANNEL 1
C/A
B
A
A
B
C/A
A
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
113
RECEIVE SIDE 2.048 MHz BOUNDARY TIMING (with elastic store
enabled) Figure 24-5
RSER
LSB MSB
LSB
CHANNEL 1
RCHCLK
RCHBLK
RSYSCLK
RSYNC
CHANNEL 31
CHANNEL 32
1
3
4
Notes:
1. RSER data in channels 1, 5, 9, 13, 17, 21, 25, and 29 are forced to one
2. RSYNC is in the output mode (RCR2.3 = 0)
3. RSYNC is in the input mode (RCR2.3 = 1)
4. RCHBLK is forced to one in the same channels as RSER (see Note 1)
5. The F-Bit position is passed through the receive side elastic store and occupies the MSB position of
channel 1.
RSYNC
2
RMSYNC
RSIG
D/B
D/B
CHANNEL 1
CHANNEL 31
CHANNEL 32
A
B
C/A
A
B
C/A
F5
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
114
RECEIVE SIDE INTERLEAVED BUS OPERATION BYTE MODE TIMING Figure
24-6
RSER
LSB
SYSCLK
RSYNC
FRAMER 3, CHANNEL 32
MSB
LSB
FRAMER 0, CHANNEL 1
RSIG
D/B
D/B
C/D
B
A
C/A
B
FRAMER 3, CHANNEL 32
A
FRAMER 0, CHANNEL 1
MSB
LSB
FRAMER 1, CHANNEL 1
D/B
C/D
B
A
FRAMER 1, CHANNEL 1
Notes:
1. 4.096 MHz bus configuration.
2. 8.192 MHz bus configuration.
3. RSYNC is in the input mode (RCR2.3 = 1).
3
RSER
RSYNC
RSIG
FR1 CH32
FR0 CH1
FR1 CH1
FR0 CH2
FR1 CH2
RSER
RSIG
FR2 CH32 FR3 CH32 FR0 CH1
FR1 CH1
FR2 CH1
FR3 CH1
FR0 CH2
FR1 CH2
FR2 CH2
FR3 CH2
FR2 CH32 FR3 CH32 FR0 CH1
FR1 CH1
FR2 CH1
FR3 CH1
FR0 CH2
FR1 CH2
FR2 CH2
FR3 CH2
FR1 CH32
FR0 CH1
FR1 CH1
FR0 CH2
FR1 CH2
1
1
2
2
BIT DETAIL
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
115
RECEIVE SIDE INTERLEAVED BUS OPERATION FRAME MODE TIMING
Figure 24-7
RSER
LSB
SYSCLK
RSYNC
FRAMER 3, CHANNEL 32
MSB
LSB
FRAMER 0, CHANNEL 1
RSIG
D/B
D/B
C/D
B
A
C/A
B
FRAMER 3, CHANNEL 32
A
FRAMER 0, CHANNEL 1
MSB
LSB
FRAMER 0, CHANNEL 2
D/B
C/D
B
A
FRAMER 0, CHANNEL 2
Notes:
1. 4.096 MHz bus configuration.
2. 8.192 MHz bus configuration.
3. RSYNC is in the input mode (RCR2.3 = 1).
3
RSER
RSYNC
RSIG
FR1 CH1-32
FR0 CH1-32
FR1 CH1-32
RSER
RSIG
FR2 CH1-32 FR3 CH1-32 FR0 CH1-32 FR1 CH1-32 FR2 CH1-32 FR3 CH1-32 FR0 CH1-32 FR1 CH1-32 FR2 CH1-32 FR3 CH1-32
FR2 CH1-32 FR3 CH1-32 FR0 CH1-32 FR1 CH1-32 FR2 CH1-32 FR3 CH1-32 FR0 CH1-32 FR1 CH1-32 FR2 CH1-32 FR3 CH1-32
FR0 CH1-32
FR1 CH1-32
FR1 CH1-32
FR0 CH1-32
FR1 CH1-32
FR0 CH1-32
FR1 CH1-32
1
1
2
2
BIT DETAIL
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
116
TRANSMIT SIDE D4 TIMING Figure 24-8
FRAME#
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
1
2
3
4
TSYNC
TSYNC
TSYNC
TLCLK
TLINK
Notes:
1. TSYNC in the frame mode (TCR2.3 = 0) and double-wide frame sync is not enabled (TCR2.4 = 0)
2. TSYNC in the frame mode (TCR2.3 = 0) and double-wide frame sync is enabled (TCR2.4 = 1)
3. TSYNC in the multiframe mode (TCR2.3 = 1)
4. TLINK data (Fs - bits) is sampled during the F-bit position of even frames for insertion into the
outgoing T1 stream when enabled via TCR1.2
5. TLINK and TLCLK are not synchronous with TFSYNC
TRANSMIT SIDE D4 TIMING Figure 15.6
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
117
TRANSMIT SIDE ESF TIMING Figure 24-9
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
FRAME#
1
2
3
4
6
7
TSYNC
TSYNC
TSYNC
TLCLK
TLINK
TLCLK
TLINK
Notes:
1. TSYNC in the frame mode (TCR2.3 = 0) and double-wide frame sync is not enabled (TCR2.4 = 0)
2. TSYNC in the frame mode (TCR2.3 = 0) and double-wide frame sync is enabled (TCR2.4 = 1)
3. TSYNC in the multiframe mode (TCR2.3 = 1)
4. ZBTSI mode disabled (TCR2.5 = 0)
5. TLINK data (FDL bits) is sampled during the F-bit time of odd frame and inserted into the outgoing
T1 stream if enabled via TCR1.2
6. ZBTSI mode is enabled (TCR2.5 = 1)
7. TLINK data (Z bits) is sampled during the F-bit time of frames 1, 5, 9, 13, 17, and 21 and inserted
into the outgoing stream if enabled via TCR1.2
8. TLINK and TLCLK are not synchronous with TFSYNC
TRANSMIT SIDE ESF TIMING Figure 15.7
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
118
TRANSMIT SIDE BOUNDARY TIMING (with elastic store disabled)
Figure 24-10
TCLK
TNEG
LSB
MSB
F
MSB
LSB
TCHCLK
TSYNC
TCHBLK
Notes:
1. There is a 10 TCLK delay from TSER to TPOS/TNEG.
2. TSYNC is in the output mode (TCR2.2 = 1)
3. TSYNC is in the input mode (TCR2.2 = 0)
4. TCHBLK is programmed to block channel 2
5. Shown is TLINK/TLCLK in the ESF framing mode
TLCLK
TLINK
LSB
CHANNEL 1
TSYNC
Don't Care
3
TSIG
CHANNEL 1
CHANNEL 2
A
B
C/A
D/B
A
B
C/A
D/B
2
5
4
TSER
LSB
MSB
F
MSB
CHANNEL 1
LSB
LSB MSB
CHANNEL 2
TPOS
CHANNEL 24
1
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
119
TRANSMIT SIDE 1.544 MHz BOUNDARY TIMING (with elastic store
enabled) Figure 24-11
TSER
LSB MSB
F
MSB
CHANNEL 23
CHANNEL 24
LSB
CHANNEL 1
TCHCLK
TCHBLK
TSYSCLK
TSSYNC
1
Notes:
1. TCHBLK is programmed to block channel 24 (if the TPCSI bit is set, then the signaling data at
TSIG will be ignored during channel 24).
TSIG
A
CHANNEL 23
CHANNEL 24
D/B
CHANNEL 1
C/A
B
A
A
B
C/A
D/B
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
120
TRANSMIT SIDE 2.048 MHz BOUNDARY TIMING (with elastic store
enabled) Figure 24-12
TSER
LSB MSB
LSB
CHANNEL 1
TCHCLK
TCHBLK
TSYSCLK
TSSYNC
CHANNEL 31
CHANNEL 32
1
Notes:
1. TSER data in channels 1, 5, 9, 13, 17, 21, 25, and 29 is ignored
2. TCHBLK is programmed to block channel 31 (if the TPCSI bit is set, then the signaling data at TSIG
will be ignored).
3. TCHBLK is forced to one in the same channels as TSER is ignored (see Note 1)
4. The F-bit position (MSB position of channel 1) for the T1 frame is sampled and passed through the
transmit side elastic store (normally the transmit side formatter overwrites the F-bit position unless the
formatter is programmed to pass-through the F-bit position)
TSIG
D/B
D/B
CHANNEL 1
CHANNEL 31
CHANNEL 32
C/D
B
A
C/A
B
A
2,3
F4
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
121
TRANSMIT SIDE INTERLEAVED BUS OPERATION BYTE MODE TIMING
Figure 24-13
TSER
LSB
SYSCLK
TSSYNC
FRAMER 3, CHANNEL 32
MSB
LSB
FRAMER 0, CHANNEL 1
TSIG
D/B
D/B
C/D
B
A
C/A
B
FRAMER 3, CHANNEL 32
A
FRAMER 0, CHANNEL 1
MSB
LSB
FRAMER 1, CHANNEL 1
D/B
C/D
B
A
FRAMER 1, CHANNEL 1
Notes:
1. 4.096 MHz bus configuration.
2. 8.192 MHz bus configuration.
TSER
TSSYNC
TSIG
TSER
TSIG
FR2 CH32 FR3 CH32 FR0 CH1
FR1 CH1
FR2 CH1
FR3 CH1
FR0 CH2
FR1 CH2
FR2 CH2
FR3 CH2
FR2 CH32 FR3 CH32 FR0 CH1
FR1 CH1
FR2 CH1
FR3 CH1
FR0 CH2
FR1 CH2
FR2 CH2
FR3 CH2
1
1
2
2
BIT DETAIL
FR1 CH32
FR0 CH1
FR1 CH1
FR0 CH2
FR1 CH2
FR1 CH32
FR0 CH1
FR1 CH1
FR0 CH2
FR1 CH2
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
122
TRANSMIT SIDE INTERLEAVED BUS OPERATION FRAME MODE TIMING
Figure 24-14
TSER
LSB
SYSCLK
TSSYNC
FRAMER 3, CHANNEL 32
MSB
LSB
FRAMER 0, CHANNEL 1
TSIG
D/B
D/B
C/D
B
A
C/A
B
FRAMER 3, CHANNEL 32
A
FRAMER 0, CHANNEL 1
MSB
LSB
FRAMER 0, CHANNEL 2
D/B
C/D
B
A
FRAMER 0, CHANNEL 2
Notes:
1. 4.096 MHz bus configuration.
2. 8.192 MHz bus configuration.
TSER
TSSYNC
TSIG
FR1 CH1-32
FR0 CH1-32
FR1 CH1-32
TSER
TSIG
FR2 CH1-32 FR3 CH1-32 FR0 CH1-32
FR1 CH1-32
FR2 CH1-32
FR3 CH1-32
FR0 CH1-32
FR1 CH1-32
FR2 CH1-32
FR3 CH1-32
FR2 CH1-32 FR3 CH1-32 FR0 CH1-32
FR1 CH1-32
FR2 CH1-32
FR3 CH1-32
FR0 CH1-32
FR1 CH1-32
FR2 CH1-32
FR3 CH1-32
FR0 CH1-32
FR1 CH1-32
FR1 CH1-32
FR0 CH1-32
FR1 CH1-32
FR0 CH1-32
FR1 CH1-32
1
1
2
2
BIT DETAIL
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
123
DS21Q42 TRANSMIT DATA FLOW Figure 24-15
Idle Code / Per
Channel LB
TIR1 to TIR3
Software Signaling
Insertion
TS1 to TS12
Bit 7 Stuffing
One's Density Monitor
F-Bit Mux
CRC Mux
AMI or B8ZS Converter /
Blue Alarm Gen.
Software Signaling Enable (TCR1.4)
TPOS TNEG
Transmit Blue (TCR1.1)
B8ZS Enable (CCR2.6)
TFDL Select (TCR1.2)
TFDL
TLINK
CRC Calculation
Pulse Density Enforcer Enable (CCR3.3)
Pulse Density Violation (RIR2.0)
Frame Mode Select (CCR2.7)
D4 Yellow Alarm Select (TCR2.1)
Transmit Yellow (TCR1.0)
TTR1 to TTR3
Bit 7 Zero Suppression Enable (TCR2.0)
Global Bit 7 Stuffing (TCR1.3)
F-Bit Pass Through (TCR1.6)
Frame Mode Select (CCR2.7)
CRC Pass Through (TCR1.5)
Frame Mode Select (CCR2.7)
= Register
= Device Pin
= Selector
KEY:
D4 Bit 2 Yellow
Alarm Insertion
D4 12th Fs Bit
Yellow Alarm Gen.
Frame Mode Select (CCR2.7)
D4 Yellow Alarm Select (TCR2.1)
Transmit Yellow (TCR1.0)
ESF Yellow Alarm Gen.
(00FF Hex in the FDL)
Frame Mode Select (CCR2.7)
Transmit Yellow (TCR1.0)
1
0
1
0
1
0
0
1
1
0
DS2152 TRANSMIT DATA FLOW Figure 15.11
FPS or Ft Bit Insertion
1
0
FDL HDLC & BOC Controller
HDLC/BOC Enable (TBOC.6)
TIR Function Select (CCR4.0)
TIDR
1
0
RSER
In-Band Loop
Code Generator
Per-Channel Code
Generation
1
0
IBCC
TCD
TCC1 to TCC3
TC1 to TC24
CCR3.1
(note#1)
N O T E S :
1. TCLK should be tied to RCLK and TSYNC should be tied to
RFSYNC for data to be properly sourced from RSER.
1
0
TCD2
DS0 insertion enable (TDC1.7)
1
0
TDC1.5
TCD1 4:0
TCHBLK
DS0 Monitor
FDL Mux
1
0
0
Source Mux
HDLC
ENGINE
TSER
&
TDATA
TSIG
Hardware
Signaling
Insertion
0
1
TCBR1/2/3
CCR4.1
CCR4.2
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
124
25. OPERATING PARAMETERS
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Non-Supply Pin Relative to
Ground
1.0V to +5.5V
Supply Voltage
-0.3V to +3.63V
Operating Temperature for DS21Q42T
0
C to 70
C
Operating Temperature for DS21Q42TN
40
C to +85
C
Storage Temperature
55
C to +125
C
Soldering Temperature
260C for 10 seconds
* This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operation sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods of time may
affect reliability.
RECOMMENDED DC OPERATING
CONDITIONS
(0
C to 70
C for DS21FF42/DS21FT42);
-40
C to +85
C for DS21FF42N/DS21FT42N)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
Logic 1
V
IH
2.0
5.5
V
Logic 0
V
IL
0.3
+0.8
V
Supply
V
DD
2.97
3.63
V
CAPACITANCE
(t
A
=25
C)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
Input Capacitance
C
IN
5
pF
Output Capacitance
C
OUT
7
pF
DC
CHARACTERISTICS
(0
C to 70
C; V
DD
= 2.97 to 3.63V for DS21FF42/DS21FT42;
-40
C to +85
C; V
DD
= 2.97 to 3.63V for DS21FF42N/DS21FT42N)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
Supply Current @
3.3V
I
DD
75
mA
1
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
125
Input Leakage
I
IL
1.0
+1.0
A
2
Output Leakage
I
LO
1.0
A
3
Output Current (2.4V)
I
OH
1.0
mA
Output Current (0.4V)
I
OL
+4.0
mA
NOTES:
1. TCLK=RCLK=TSYSCLK=RSYSCLK=1.544 MHz; outputs open circuited.
2. 0.0V < V IN < V DD .
3. Applied to INT* when 3stated.
AC CHARACTERISTICS MULTIPLEXED
PARALLEL PORT
(MUX=1)
(0C to 70C; V
DD
= 2.97 to 3.63V for DS21FF42/DS21FT42
40C to +85C; V
DD
= 2.97 to 3.63V for DS21FF42N/DS21FT42N)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
Cycle Time
t
CYC
200
ns
Pulse Width, DS low
or RD* high
PW
EL
100
ns
Pulse Width, DS high
or RD* low
PW
EH
100
ns
Input Rise/Fall times
t
R
, t
F
20
ns
R/W* Hold Time
t
RWH
10
ns
R/W* Set Up time
before DS high
t
RWS
50
ns
CS*, FSO or FS1 Set
Up time before DS,
WR* or RD* active
t
CS
20
ns
CS*, FSO or FS1
Hold time
t
CH
0
ns
Read Data Hold time
t
DHR
10
50
ns
Write Data Hold time
t
DHW
0
ns
Muxed Address valid
to AS or ALE fall
t
ASL
15
ns
Muxed Address Hold
time
t
AHL
10
ns
Delay time DS, WR*
or RD* to AS or ALE
rise
t
ASD
20
ns
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
126
Pulse Width AS or
ALE high
PW
ASH
30
ns
Delay time, AS or ALE
to DS, WR* or RD*
t
ASED
10
ns
Output Data Delay time
from DS or RD*
t
DDR
20
80
ns
Data Set Up time
t
DSW
50
ns
(see Figures 25-1 to 25-3 for details)
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
127
AC CHARACTERISTICS NONMULTIPLEXED
PARALLEL PORT
(MUX=0 )
(0C to 70C; V
DD
= 2.97 to 3.63V for DS21FF42/DS21FT42;
40C to +85C; V
DD
= 2.97 to 3.63V for DS21FF42N/DS21FT42N)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
Set Up Time for A0 to
A7, FS0 or FS1 Valid
to CS* Active
t
1
0
ns
Set Up Time for CS*
Active to either RD*,
WR*, or DS* Active
t
2
0
ns
Delay Time from either
RD* or DS* Active to
Data Valid
t
3
75
ns
Hold Time from either
RD*, WR*, or DS*
Inactive to CS*
Inactive
t
4
0
ns
Hold Time from CS*
Inactive to Data Bus 3
state
t
5
5
20
ns
Wait Time from either
WR* or DS* Active to
Latch Data
t
6
75
ns
Data Set Up Time to
either WR* or DS*
Inactive
t
7
10
ns
Data Hold Time from
either WR* or DS*
Inactive
t
8
10
ns
Address Hold from
either WR* or DS*
inactive
t
9
10
ns
See Figures 254 to 257 for details.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
128
AC CHARACTERISTICS RECEIVE SIDE
(0C to 70C; V
DD
= 2.97 to 3.63V for DS21FF42/DS21FT42;
40C to +85C; V
DD
= 2.97 to 3.63V for DS21FF42N/DS21FT42N)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
RCLK Period
t
CP
648
ns
RCLK Pulse Width
t
CH
t
CL
75
75
ns
ns
RSYSCLK Period
t
SP
t
SP
122
122
648
488
ns
ns
1
2
RSYSCLK Pulse Width
t
SH
t
SL
50
50
ns
ns
RSYNC Set Up to
RSYSCLK Falling
t
SU
20
t
SH
5
ns
RSYNC Pulse Width
t
PW
50
ns
RPOS/RNEG Set UP to
RCLK Falling
t
SU
20
ns
RPOS/RNEG Hold From
RCLK Falling
t
HD
20
ns
RSYSCLK/RCLK Rise
and Fall Times
t
R
, t
F
25
ns
Delay RCLK to RSER,
RSIG, RLINK Valid
t
D1
50
ns
Delay RCLK to
RCHCLK, RSYNC,
RCHBLK, RFSYNC,
RLCLK
t
D2
50
ns
Delay RSYSCLK to
RSER, RSIG Valid
t
D3
50
ns
Delay RSYSCLK to
RCHCLK, RCHBLK,
RMSYNC, RSYNC
t
D4
50
ns
See Figures 25-8 to 25-10 for details.
NOTES:
1. RSYSCLK = 1.544 MHz.
2. RSYSCLK = 2.048 MHz.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
129
AC CHARACTERISTICS TRANSMIT
SIDE
(0C to 70C; V
DD
= 2.97 to 3.63V for DS21FF42/DS21FT42;
40C to +85C; V
DD
= 2.97 to 3.63V for DS21FF42N/DS21FT42N)
PARAMETER
SYMBO
L
MIN
TYP
MAX
UNITS
NOTES
TCLK Period
t
CP
648
ns
TCLK Pulse Width
t
CH
t
CL
75
75
ns
ns
TCLKI Pulse Width
t
LH
t
LL
75
75
ns
ns
TSYSCLK Period
t
SP
t
SP
122
122
648
448
ns
ns
1
2
TSYSCLK Pulse Width
t
SH
t
SL
50
50
ns
ns
TSYNC or TSSYNC Set
Up to TCLK or
TSYSCLK falling
t
SU
20
t
CH
5
or
t
SH
5
ns
TSYNC or TSSYNC
Pulse Width
t
PW
50
ns
TSER, TSIG, TLINK Set
Up to TCLK, TSYSCLK
Falling
t
SU
20
ns
TSER, TSIG, TLINK
Hold from TCLK,
TSYSCLK Falling
t
HD
20
ns
TCLK or TSYSCLK
Rise and Fall Times
t
R
, t
F
25
ns
Delay TCLK to TPOS,
TNEG Valid
t
DD
50
ns
Delay TCLK to
TCHBLK, TCHBLK,
TSYNC, TLCLK
t
D2
50
ns
Delay TSYSCLK to
TCHCLK, TCHBLK
t
D3
75
ns
See Figures 2511 to 2513 for details.
NOTES:
1. TSYSCLK = 1.544 MHz.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
130
2. TSYSCLK = 2.048 MHz.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
131
INTEL BUS READ AC TIMING (BTS=0 / MUX = 1) Figure 25-1
ASH
PW
t CYC
t ASD
t ASD
PW
PW
EH
EL
t
t
t
t
t
t
AHL
CH
CS
ASL
ASED
CS*
AD0-AD7
DHR
t DDR
ALE
RD*
WR*
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
132
INTEL BUS WRITE TIMING (BTS=0 / MUX=1) Figure 25-2
ASH
PW
t CYC
t ASD
t ASD
PW
PW
EH
EL
t
t
t
t
t
t
t
AHL
DSW
DHW
CH
CS
ASL
ASED
CS*
AD0-AD7
RD*
WR*
ALE
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
133
MOTOROLA BUS AC TIMING (BTS = 1 / MUX = 1) Figure 25-3
t ASD
ASH
PW
t
t
ASL
AHL
t CS
t ASL
t
t
t
DSW
DHW
t CH
t
t
t
DDR
DHR
RWH
t ASED
PWEH
t RWS
AHL
PWEL
t CYC
AS
DS
AD0-AD7
(write)
AD0-AD7
(read)
R/W*
CS*
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
134
INTEL BUS READ AC TIMING (BTS=0 / MUX=0) Figure 25-4
Address Valid
Data Valid
A0 to A7,
FS0, FS1
D0 to D7
WR*
CS*
RD*
0ns min.
0ns min.
75ns max.
0ns min.
5ns min. / 20ns max.
INTEL BUS READ AC TIMING (BTS = 0 / MUX = 0 ) Figure 16.10
t1
t2
t3
t4
t5
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
135
INTEL BUS WRITE AC TIMING (BTS=0 / MUX=0) Figure 25-5
Address Valid
A0 to A7,
FS0, FS1
D0 to D7
RD*
CS*
WR*
0ns min.
0ns min.
75ns min.
0ns min.
INTEL BUS WRITE AC TIMING (BTS = 0 / MUX = 0) Figure 16.11
10ns
min.
10ns
min.
t1
t2
t6
t4
t7
t8
t9 10ns min.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
136
MOTOROLA BUS READ AC TIMING (BTS=1 / MUX=0) Figure 25-6
Address Valid
Data Valid
A0 to A7,
FS0, FS1
D0 to D7
R/W*
CS*
DS*
0ns min.
0ns min.
75ns max.
0ns min.
5ns min. / 20ns max.
t1
t2
t3
t4
t5
DS
0ns min.
75ns max.
0ns min.
t2
t3
t4
1
Notes:
1. The signal DS is active high when emulating the DS21Q41 (FMS = 1).
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
137
MOTOROLA BUS WRITE AC TIMING (BTS=1 / MUX=0) Figure 25-7
Address Valid
A0 to A7,
FS0, FS1
D0 to D7
R/W*
CS*
DS
0ns min.
0ns min.
75ns min.
0ns min.
MOTOROLA BUS WRITE AC TIMING (BTS = 1 / MUX = 0 ) Figure 16.13
10ns
min.
10ns
min.
t1
t2
t6
t4
t7
t8
DS
0ns min.
75ns max.
0ns min.
1
Notes:
1. The signal DS is active high when emulating the DS21Q41 (FMS = 1).
t2
t6
t4
t9 10ns min.
*
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
138
RECEIVE SIDE AC TIMING Figure 25-8
t D1
1
t D2
t D2
t D2
t D2
RSER / RSIG
RCHCLK
RCHBLK
RSYNC
RLCLK
RLINK
t D1
Notes:
1. RSYNC is in the output mode (RCR2.3 = 0).
2. Shown is RLINK/RLCLK in the ESF framing mode.
3. No relationship between RCHCLK and RCHBLK and the other signals is implied.
RCLK
t
D2
RFSYNC / RMSYNC
2
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
139
RECEIVE SYSTEM SIDE AC TIMING Figure 25-9
t
F
t
R
t D3
1
t D4
t D4
t
D4
t
t SU
HD
2
RSER / RSIG
RCHCLK
RCHBLK
RSYNC
RSYNC
Notes:
1. RSYNC is in the output mode (RCR2.3 = 0)
2. RSYNC is in the input mode (RCR2.3 = 1)
RSYSCLK
SL
t
tSP
RECEIVE SYSTEM SIDE AC TIMING Figure 16.5
SH
t
t
D4
RMSYNC
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
140
RECEIVE LINE INTERFACE AC TIMING Figure 25-10
t
F
t
R
RPOS, RNEG
RCLK
CL
t
t CP
CH
t
t SU
t HD
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
141
TRANSMIT SIDE AC TIMING Figure 25-11
t
F
t
R
1
TCLK
TSER / TSIG
TCHCLK
t
t
C L
t
CH
CP
TSYNC
TSYNC
TLINK
TLCLK
TCHBLK
t D2
t D2
tD2
t
t
t
t
t
HD
SU
D2
SU
HD
tHD
2
Notes:
1. TSYNC is in the output mode (TCR2.2 = 1).
2. TSYNC is in the input mode (TCR2.2 = 0).
3. TSER is sampled on the falling edge of TCLK when the transmit side elastic store is disabled.
4. TCHCLK and TCHBLK are synchronous with TCLK when the transmit side elastic store is disabled.
5. TLINK is only sampled during F-bit locations.
6. No relationship between TCHCLK and TCHBLK and the other signals is implied.
5
t SU
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
142
TRANSMIT SYSTEM SIDE AC TIMING Figure 25-12
t
F
t
R
TSYSCLK
TSER
TCHCLK
t
t
SL
t
SH
SP
TSSYNC
TCHBLK
tD3
t D3
t
t
t SU
H D
SU
t HD
Notes:
1. TSER is only sampled on the falling edge of TSYSCLK when the transmit side elastic store is enabled.
2. TCHCLK and TCHBLK are synchronous with TSYSCLK when the transmit side elastic store is enabled.
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
143
TRANSMIT LINE INTERFACE SIDE AC TIMING Figure 25-13
TPOS, TNEG
t
D D
t
F
t
R
TCLK
t
t
CL
t
CH
C P
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
101899
/123
144
26. MCM PACKAGE DIMENSIONS
DS21FF42 / DS21FT42 Mechanical Dimensions
DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
October 18, 1999
145
POWER SUPPLY DE-COUPLING
In a typical PCB layout for the MCM, all of the VDD pins will connect to a common power plane
and all the VSS lines will connect to a common ground plane. The recommended method for de-
coupling is shown below in both schematic and pictorial form. As shown in the pictorial, the
capacitors should be symmetrically located about the device. Figure 25-1 uses standard capacitors,
two .47 uf ceramics and two .01uf ceramics. Since VDD and VSS signals will typically pass
vertically to the power and ground planes of a PCB, the de-coupling caps must be placed as close to
the DS21Fx4y as possible and routed vertically to power and ground planes.
De-coupling scheme using standard tantalum caps . Figure 25-1
.01
.01
VDD
VDD
DS21Fx4y
.47
.47
.01
.01
.47
.47
DS21Fx4y