DS30024 Rev. C-2
1 of 3
ZMM5221B-ZMM5267B
ZMM5221B - ZMM5267B
500mW SURFACE MOUNT ZENER DIODE
Features
Maximum Ratings and Electrical Characteristics
@ T
A
= 25
C unless otherwise specified
Characteristic
Symbol
Value
Unit
Power Dissipation
(Note 1)
P
d
500
mW
Thermal Resistance, Junction to Ambient Air
(Note 1)
R
qJA
300
C /W
Forward Voltage
@ I
F
= 200mA
V
F
1.5
V
Operating and Storage Temperature Range
T
j,
T
STG
-65 to +175
o
C
Case: MiniMELF
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Marking: Cathode Band Only
Weight: 0.034 grams (approx.)
500mW Power Dissipation
Outline Similar to JEDEC DO-213AA
Hemetic Glass Package
Mechanical Data
A
C
B
MiniMELF
Dim
Min
Max
A
3.30
3.70
B
1.30
1.60
C
0.28
0.50
All Dimensions in mm
Notes:
1. Valid provided that electrodes are kept at ambient temperature.
2. Tested with pulses, T
p
100ms.
SPICE MODEL: ZMM5235B
DS30024 Rev. C-2
3 of 3
ZMM5221B-ZMM5267B
0
50
100
150
200
0
5
10
15
20
25
C
,
JUNCTION
CAP
A
CIT
A
NCE
(
pF)
j
V , ZENER VOLTAGE (V)
Z
Fig. 2 Junction Capacitance vs Zener Voltage
V = 2.0V
R
T = 25
C
j
1
10
100
1000
0
5
10
15
20
25
DIFFERENTIAL
ZENER
RESIST
ANCE
(
)
W
V , ZENER VOLTAGE (V)
Z
Fig. 3 Differential Zener Impedance
I = 1.0mA
Z
5.0mA
10mA
T = 25
C
j
1.0
10
100
1000
0.1
1.0
10
100
r(t),
NORMALIZED
EFFECTIVE
o
TRANSIENT
T
HERMAL
RESIST
ANCE
(
C
/W)
t , SQUARE WAVE PULSE DURATION (seconds)
1
Fig. 4 Typical Normalized Transient Thermal Impedance Curves
1000
D = 0.5
0.2
0.1
0.05
0.02
0.01
t
1
t
2
P
(pk)
0
100
200
300
400
500
0
40
80
120
160
200
P
,
POWER
D
ISSIP
A
TION
(mW)
d
T , AMBIENT TEMPERATURE
A
Fig.1 Power Dissipation vs Ambient Temperature