FEATURES
MECHANICAL SPECIFICATION
Case: Transfer molded plastic
Finish: All external surfaces are corrosion resistant
and the contact areas are readily solderable
Soldering Temperature: 250 C maximum
Mounting Position: Any
Polarity: Color band denotes cathode
Weight: 0.6 Ounces (1.8 Grams)
o
MECHANICAL DATA
INCHES
MILLIMETERS
MIN
6.05
4.19
5.54
9.78
DIM
A
B
D
M
F
5 NOM
MAX
MAX
6.20
6.60
4.45
10.29
0.165
MIN
0.385
0.238
0.218
0.405
0.244
0.220
5 NOM
0.175
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
Compact molded design
High surge current, 720 A @ T = 175 C
Low cost
Peak performance at elevated temperatures: 50 A
J
o
@ T = 175 C
J
o
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Data Sheet No. BUDI-5000-1A
K11
M
A
F
D
B
Color Ring
Denotes Cathode
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
Repetitive Peak Reverse Surge Current (Half wave, single phase,
60 Hz applied to rated load)
I
RSM
120
Non-repetitive Peak Reverse Voltage (Half wave, single phase,
60 Hz peak)
Average Forward Rectified Current @ T =125 C
C
o
I
O
50
Peak Forward Surge Current (8.3mS single half sine wave
superimposed on rated load)
AMPS
I
FSM
600
Maximum Forward Voltage Drop at 50 Amp DC
VOLTS
V
FM
1.1 (Typical 1.05)
Maximum Thermal Resistance, Junction to Case (Note 1)
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
I
RM
R
JC
C/W
A
@ T = 25 C
A
o
@ T = 100 C
A
o
1
50
0.8
Junction Operating and Storage Temperature Range
T
J
,T
STG
C
-65 to +175
BAR50
V
RSM
60
120
240
480
1200
720
960
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
V
RWM
V
DC
V
RRM
SYMBOL
RATINGS
UNITS
VOLTS
BAR
BAR
BAR
BAR
BAR
BAR
BAR
50
100
200
400
1000
600
800
5000
5001
5002
5004
5006
5008
5010
1.15
Notes: 1) Single Side Cooled
Die Size:
0.180" x 0.180"
Square
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
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