FEATURES
MECHANICAL SPECIFICATION
MECHANICAL DATA
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Data Sheet No. B50PF-1A
50 AMP PRESS FIT HIGH VOLTAGE DIODES
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VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 5% of Die Area)
PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE
HEAT HANDLING CAPABILITY
PROPRIETARY HIGH TEMPERATURE JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
LOW THERMAL STRESS STRUCTURE - PASS
5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST
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ALL DIMENSIONS IN INCHES
B5004A
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0.052
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0.401
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