MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
FEATURES
MECHANICAL SPECIFICATION
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Data Sheet No. BUDI-3500D-1A
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DIOTEC ELECTRONICS CORP.
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VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
Die Size:
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Round
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