ChipFind - документация

Электронный компонент: BAR6002S

Скачать:  PDF   ZIP
FEATURES
MECHANICAL SPECIFICATION
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
!"$#%
&''
&"$(&')
0%)
&10%%2
&3 4&')
5
&6%(&7
8
&9@
Data Sheet No. BUDI-6000-1A
60 AMP BUTTON DIODES
A%BDC
E
FHGPIDQRTSVU%WTUX QRTYT`baTc'deFHGPIDQRTSVU%WTUXPUTf%YTg
DIOTEC ELECTRONICS CORP
hpiDqsrDtuiDv'w6xy%T'b
6
x
TT%!eDde6f
gDhei
jHk6lVm
e
nVopqPr
s%tsuv
uv
ws1x%sy'z{sws'r
|s}%o~
u
y'sdy'~
'6yws|%v
p~
spt%y|s
pDtsy'z
%
'p
6'PV
p%
'% %
%
ä
ʤ
ͤΩ
ϤЩ
ҤӤ
'pHV
V$6
e
%
$'V
%'
T
'
%

'
!
"#%$'&(

#)#
02134
565780%9@'AB
C
1#D#E
FHGIQP
G!RTSVUWYXGI
`8acbed
fhgpi
q8r!r!s
tVuwvyx
VeV
w%
hwcd
ef2g
hHi%j
kHl%monp2qsrHt2uwvHx%y{z|2}
~
!
!#!# !!#
K19
%hHQH''He8
'
'
hT
#'HƴǶy'8QH
ʯ'
HHñ'8ʯhH'ȯ˴'h
Ȱ8
HQHͺ
θh
HϹмHQƴh''ҥԮշyſ
Ʃ
8Ƶ'׿
HhH
88ڵ'
hh
8h
8eͯɻHyHH
h'ܲ'H
YƵHQ
YQyH
MECHANICAL DATA
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
wh#V8
H
8
hQH'''

'H'
'Q8h

'yH' '
!
"
#%$&'()10
2
3
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
4
5
6
7
8
9A@CB
@CDEGF
HI
PQ
H@R
QTS
9GUTRWV@X
Q
Y
`badcfehg
iqp
rrp
itshuAswvbx
yq
C
h
C
C
dfe
g
h
i
j
k
l
m nfobprq
sutfv
wuxfy
z{
|}
~
h
C
C
C
C
C
C
fbr
0.216" Flat to Flat
Hex
Die Size:
f
f
fʧ̧
T
fTק
ruTT
ޥڧ
CfThu
fT
rh
uh hT

bW


h

!"
#
$%
&('0)21
30465
7
89
@BADCFEGIH
P
Q
RBSUTWVYX`ba
c
d
e
fg
hpi
q
rstpuYvxw
y"t
v0w
tptp!vy"
ppp
vxs
tp
p(
degfih
jxk
l
mnoprqsYtn
u
v
w
x
y
z
{6|p}
~( Y6
p"
~
~ ||"
~p
!
"rp"
!"
" " r
RoHS CO
MPLIANT