GDU 90 20422
1/4
V
1
= +5V
V
2
= +15V
V
3
= -15V
Test circuit GTO
GDU connection to GTO
Test circuit emitter and gate drive emitter
Test circuit emitter current
Test circuit receiver and gate drive receiver
Honeywell sweetspot HFD 3029 - 002
30mA
DG646BH
500mm CO - AX cable type RC5327230
Honeywell sweetspot HFE 4020 - 013
s
Used with Gate Turn-Off Thyristors in high current switching
applications
I
FGM
30A
I
G(ON)
7A
dI
GQ
/dt
40A/
s
APPLICATIONS
CONDITIONS - (UNLESS STATED OTHERWISE)
KEY PARAMETERS
This datasheet should be used in conjunction with the application note AN4571, GDU9X-XXXXX Series, Gate Drive Unit.
Units
Max.
Typ.
Min.
Conditions
Symbol
I
V1
-
3.80
A
I
V2
+15V PSU current
700Hz, 50% duty cycle
700Hz
Parameter
-
0.73
A
V
2(Min)
On-state gate current
dI
FG
/dt
dI
GQ
/dt
Rate of rise of negative gate current
Rate of rise of positive gate current
-
-
-
-
-
Measured 10 - 75% I
FGM
I
T
= 2000A, 90% I
G(ON)
- 50% I
GQM
3.8
-
-
V
14.0
-
-
V
14.0
-
-
V
-
-
-
-
-
30
-
A/
s
-
40
-
A/
s
+5V PSU current
700Hz, I
T
= 2000A
GTO T
j
= 125C
-15V PSU current
I
V3
-
-
-
9.20
A
-
V
1(Min)
+5V PSU minimum
+15V PSU minimum
V
3(Min)
-15V PSU minimum
I
FGM
Peak forward gate current
I
G(ON)
30
7
A
A
ELECTRICAL CHARACTERISTICS
GDU 90-20422
Gate Drive Unit
Replaces March 1998 version, DS4566-2.1
DS4566-3.0 January 2000
GDU 90 20422
2/4
Units
Max.
Typ.
Min.
Conditions
Symbol
Parameter
t
1
*
Adjustable by R81 + R82
-
Delay time emitter
current to receiver o/p
t
2
-
-
I
FGM
pulse width
Minimum on time
10%
I
FGM
to 90% I
G(ON)
t
5
*
t
6
Receiver storage time
t
7
-
-
0.4
-
0.8
s
5.2
-
6.2
s
-
25
-
s
80
-
110
s
0.5
-
0.9
s
1.5
-
2.3
s
Adjustable by R38
80
-
110
s
No response pulse width of
input signal
2
3
s
Turn-on delay emitter
current to 10% I
FGM
Turn-off delay.
Emitter current to 90% I
G(ON)
Minimum off time
90% I
G(ON)
to 10% I
FGM
t
8
*
Delay time
Gate volts to o/p emitter current
t
9
Turn-off delay
Gate volts to test receiver o/p
t
10
Storage time
Gate volts to o/p emitter current
Turn-on delay
Gate volts to test receiver o/p
-
0.8
1
-
s
-
0.1
1
-
s
-
0.7
-
s
-
0.1
-
s
-
Measured at low I
GQM
Measured at low I
GQM
-
Adjustable by R37
-
t
4
t
3
*
t
12
t
11
* t
1
,t
3
,t
5
,t
8
are factory settings.
Adjustment of t
1
alters t
3
. 1. Varies with I
GQM
due to gate lead impedance.
Test circuit
emitter current
Control card
receiver output
t
1
t
2
10s
t
6
10%
t
3
t
4
0V
-8V
Min. ON time
t
5
t
7
90% I
G(ON)
t
8
I
GQM
Q
GQT
Min. OFF
dI
GQ
/dt
t
11
t
12
t
9
t
10
Gate voltage
Control card emitter current
Test circuit receiver output
-8V
Gate Drive Unit Waveforms
dI
FG
/dt
I
FGM
Gate current
TIMING CHARACTERISTICS
GDU 90 20422
4/4
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-
loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
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These offices are supported by Representatives and Distributors in many countries world-wide.
Dynex Semiconductor 2000 Publication No. DS4566-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
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Tel: 613.723.7035
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Toll Free: 1.888.33.DYNEX (39639)
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