MP02TT800
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FEATURES
s
Dual Device Module
s
Electrically Isolated Package
s
Pressure Contact Construction
s
International Standard Footprint
s
Alumina (Non Toxic) Isolation Medium
s
Integral Water Cooled Heatsink
APPLICATIONS
s
Welding
VOLTAGE RATINGS
ORDERING INFORMATION
Order As:
MP02TT800-XX W12
1/4 - 18NPT
MP02TT800-XX W13
1/4 BSP connection
XX shown in the part number about represents V
DRM
/100
selection required, e.g. MP02TT800-14-W12
Note: When ordering, please use the whole part number.
Auxiliary gate and cathode leads can be ordered separately.
KEY PARAMETERS
V
DRM
1600V
I
LINE(cont.)
510A
I
LINE(20cy./50%)
805A
I
TSM(per arm)
6800A
V
isol
3000V
MP02TT800
Dual Thyristor Water Cooled Welding Module
Preliminary Information
DS5435-1.1 June 2001
Fig. 1 Circuit diagram
Fig. 2 Electrical connections - (not to scale)
Outline type code: MP02 W12/W13
(See package details for further information)
1600
1500
1400
1300
MP02TT800-16
MP02TT800-15
MP02TT800-14
MP02TT800-13
Conditions
T
vj
= 0 to 125C,
I
DRM
= I
RRM
= 30mA
V
DSM
= V
RSM
=
V
DRM
= V
RRM
+ 100V
respectively
Lower voltage grades available
Type Number
Repetitive Peak
Voltages
V
DRM
V
RRM
V
G
1
K
1
K
2
G
2
1
2
3
K1 G1
K2 G2
1
2
3
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Parameter
Max. controllable RMS line
current - single phase
Surge (non-repetitive) on-current
I
2
t for fusing
Surge (non-repetitive) on-current
I
2
t for fusing
Isolation voltage
Test Conditions
Continuous 50/60Hz
T
water (in)
= 25C
4.5 Ltr/min
T
water (in)
= 40C
20 cycles, 50% duty cycle
T
water (in)
= 25C
4.5 Ltr/min
T
water (in)
= 40C
10ms half sine, T
j
= 125C
V
R
= 0
10ms half sine, T
j
= 125C
V
R
= 50% V
DRM
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Symbol
I
LINE
I
TSM
I
2
t
I
TSM
I
2
t
V
isol
Units
A
A
A
A
kA
A
2
s
kA
A
2
s
V
Max.
510
450
920
805
6.8
0.231 x 10
6
5.5
0.15 x 10
6
3000
Test Conditions
dc, 4.5 Ltr/min
Half wave, 4.5 Ltr/min
3 Phase, 4.5 Ltr/min
Reverse (blocking)
-
Mounting - M6
Electrical connections - M6
-
Parameter
Thermal resistance - junction to water
(per thyristor)
Virtual junction temperature
Storage temperature range
Screw torque
Weight (nominal)
THERMAL AND MECHANICAL RATINGS
ABSOLUTE MAXIMUM CURRENT RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
R
th(j-c)
T
vj
T
stg
-
-
Units
C/kW
C/kW
C/kW
C
C
Nm (lb.ins)
Nm (lb.ins)
g
Max.
0.3
0.32
0.33
125
125
-
5 (44)
1200
Min.
-
-
-
-
40
5 (44)
-
-
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Units
mA
V/
s
A/
s
V
m
Test Conditions
At V
RRM
/V
DRM
, T
j
= 125C
To 67% V
DRM
, T
j
= 125C
From 67% V
DRM
to 200A, gate source 10V, 5
t
r
= 0.5
s, T
j
= 125C
At T
vj
= 125C
At T
vj
= 125C
Parameter
Peak reverse and off-state current
Linear rate of rise of off-state voltage
Rate of rise of on-state current
Threshold voltage
On-state slope resistance
DYNAMIC CHARACTERISTICS
Symbol
I
RRM
/I
DRM
dV/dt
dI/dt
V
T(TO)
r
T
Max.
30
1000
500
0.98
0.75
Min.
-
-
-
-
-
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Test Conditions
V
DRM
= 5V, T
case
= 25
o
C
V
DRM
= 5V, T
case
= 25
o
C
At V
DRM
T
case
= 125
o
C
Anode positive with respect to cathode
Anode negative with respect to cathode
-
Anode positive with respect to cathode
See table fig. 5
-
Symbol
V
GT
I
GT
V
GD
V
FGM
V
FGN
V
RGM
I
FGM
P
GM
P
G(AV)
GATE TRIGGER CHARACTERISTICS AND RATINGS
Max.
3
150
0.25
30
0.25
5
10
100
5
Units
V
mA
V
V
V
V
A
W
W
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
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Fig. 3 Maximum (limit) on-state characteristics
1
10
1
2
3 4 5
50
0
5
10
15
Duration
60
100
140
Peak half sine wave on-state current - (kA)
ms
cycles at 50Hz
I
2
t value - A
2
s x 10
3
180
I
2
t
20
10
20 30
Fig. 6 Transient thermal impedance - dc
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% V
RSM
at T
case
= 125C)
Fig. 5 Gate characteristics
0.5
1.0
2.0
Instantaneous on-state voltage, V
T
- (V)
0
500
1000
1500
2000
Instantaneous on-state current, I
T
- (A)
Measured under pulse conditions
T
j
= 125C
1.5
2.5
100
10
1.0
0.1
0.001
0.01
0.1
1.0
10
Gate trigger current, I
GT
- (A)
Gate trigger voltage, V
GT
- (V)
T
j
= 125C
T
j
= 25C
T
j
= -40
C
Upper limit 99%
Lower li
mit 1%
V
FGM
V
GD
I
FGM
5W
10W
50W
75W
100W
Pulse
Width
s
20
25
100
500
1ms
10ms
50
100
100
100
100
100
10
100
100
100
100
100
50
-
400
100
100
100
25
-
-
Pulse Frequency
Hz
Table gives pulse power P
GM
in watts
10
1
0.1
1000
100
0.01
0.001
Time - (s)
1.0
0.1
0.01
0.001
Thermal resistance (junction to water). R
th(j-w)
- (
C/W)
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Fig. 7 Single phase welding rating @T
water
= 25C
Fig. 10 Single phase welding rating @T
water
= 50C
Fig. 8 Single phase welding rating @T
water
= 30C
Fig. 9 Single phase welding rating @T
water
= 40C
1
500
1500
1000
2000
2500
3000
1
10
100
Duty cycles - (%)
RMS current, I
T(RMS)
- (A)
T
water
= 25
C
Number of cycles
1
3
5
10
20
30
50
100
1
500
1500
1000
2000
2500
3000
1
10
100
Duty cycles - (%)
RMS current, I
T(RMS)
- (A)
T
water
= 30
C
Number of cycles
1
3
5
10
20
30
50
100
1
500
1500
1000
2000
2500
3000
1
10
100
Duty cycles - (%)
RMS current, I
T(RMS)
- (A)
T
water
= 40
C
Number of cycles
1
3
5
10
20
30
50
100
1
500
1500
1000
2000
2500
3000
1
10
100
Duty cycles - (%)
RMS current, I
T(RMS)
- (A)
T
water
= 50C
Number of cycles
1
3
5
10
20
30
50
100
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws.
Auxiliary gate and cathode leads can be ordered separately.
Nominal weight: 1200g
Module outline type code: MP02-W12
80
13
24
5
34
23
15
23
24
12.8
6.5
K1
G1
K2
G2
M6
2.8 X 0.8
49
94
21.6
1
2
3
10.5
50.8
2 Off water connectors
1/4 - 18 NTP (W12)
Water-way plug
23.8
9.5
2 Off Holes M3 x 0.5
10 deep
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws.
Auxiliary gate and cathode leads can be ordered separately.
Nominal weight: 1200g
Module outline type code: MP02-W13
80
13
24
5
34
23
15
23
24
12.8
fl6.5
K1
G1
K2
G2
M6
2.8 X 0.8
49
94
21.6
1
2
3
10.5
50.8
2 Off water connectors
1/4 BSP (W13)
Water-way plug
23.8
9.5
2 Off Holes M3 x 0.5
10 deep
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POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
Dynex Semiconductor 2001 Publication No. DS5435-1 Issue No. 1.2 June 2001
TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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