MP02 XX 175 Series
1/9
Symbol
Parameter
Max.
Units
152
A
A
Conditions
A
T
case
= 75
o
C
I
F(RMS)
RMS value
A
133
A
267
Mean forward current
Halfwave, resistive load
Code
Circuit
HB
G
GN
Repetitive
Peak
Voltages
V
RRM
Type
Number
Conditions
MP02/175 - 12
MP02/175 - 10
MP02/175 - 08
Lower voltage grades available. For full description of part
number see "Ordering Instructions" on page 3.
1200
1000
800
T
vj
= 150
o
C
I
RM
= 30mA
V
RSM
= V
RRM
+ 100V
Module outline type code: MP02.
See Package Details for further information
170
149
T
heatsink
= 85
o
C
T
heatsink
= 75
o
C
T
case
= 85
o
C
T
case
= 75
o
C
I
F(AV)
FEATURES
s
Dual Device Module
s
Electrically Isolated Package
s
Pressure Contact Construction
s
International Standard Footprint
s
Alumina (non-toxic) Isolation Medium
APPLICATIONS
s
Rectifier Bridges
s
DC Power Supplies
s
Plating Rectifiers
s
Traction Systems
CIRCUIT OPTIONS
KEY PARAMETERS
V
RRM
1200V
I
FSM
5625A
I
F(AV)
(per arm)
170A
V
isol
2500V
VOLTAGE RATINGS
PACKAGE OUTLINE
CURRENT RATINGS - PER ARM
MP02 XX 175 Series
Dual Diode Modules
Replaces December 1998 version, DS5101-3.0
DS5101-4.0 January 2000
2/9
MP02 XX 175 Series
Symbol
Parameter
Conditions
Max.
Units
A
V
R
= 0
V
R
= 50% V
RRM
V
R
= 0
V
R
= 50% V
RRM
A
2
s
A
2
s
A
10ms half sine;
T
j
= 150
o
C
10ms half sine;
T
j
= 150
o
C
Surge (non-repetitive) on-state current
I
FSM
I
2
t for fusing
I
2
t
Symbol
Parameter
Conditions
o
C/W
Thermal resistance - junction to case
per Diode
R
th(j-c)
Virtual junction temperature
T
vj
o
C
o
C
T
sto
Storage temperature range
Mounting torque = 6Nm
with mounting compound
3 phase
halfwave
dc
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Max.
0.38
150
R
th(c-hs)
Isolation voltage
Symbol
Parameter
Conditions
Forward voltage
30
V
FM
I
RM
Peak reverse current
At V
RRM
, T
j
= 150
o
C
At 450A , T
case
= 25
o
C
V
TO
Threshold voltage
V
0.81
m
0.84
At T
vj
= 150
o
C
At T
vj
= 150
o
C
r
T
On-state slope resistance
V
isol
kV
o
C/W
Thermal resistance - case to heatsink
per Diode
5625
4500
158000
100000
Units
0.37
o
C/W
o
C/W
0.39
0.07
-40 to 150
2.5
mA
Units
Max.
V
1.30
SURGE RATINGS - PER ARM
CHARACTERISTICS
THERMAL & MECHANICAL RATINGS
MP02 XX 175 Series
3/9
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
Adequate heatsinking is required to maintain the base
temperature at 75
o
C if full rated current is to be achieved.
Power dissipation may be calculated by use of V
(TO)
and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32
in) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should be
taken to ensure no foreign particles remain.
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP02 HB 175 - 12
MP
= Pressure contact module
02
= Outline type
HB
= Circuit configuration code (see "circuit options" - front page)
175
= Nominal average current rating at T
case
= 75
o
C
12
= V
RRM
/100
Examples:
MP02HB175 - 12
MP02G175 - 08
MP02GN175 - 10
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
4/9
MP02 XX 175 Series
100
10
1.0
0.1
0.01
0.001
Time - (s)
0.4
0.3
0.2
0.1
0
Thermal impedance - (C/W)
d.c.
CURVES
0.5
1.0
1.5
2.0
2.5
Instantaneous forward voltage V
F
- (V)
2000
1500
1000
500
0
Instantaneous forward current I
F
- (A)
T
j
= 150C
Measured under pulse conditions
Fig. 1 Maximum (limit) forward characteristics (Per diode)
Fig. 2 Transient thermal impedance (DC) - (Per diode)
MP02 XX 175 Series
5/9
0
2000
1000
3000
4000
5000
6000
Peak half sine wave forward current - (A)
1
10
1
2 3
5
50
10
20 30
ms
cycles at 50Hz
Duration
5
6
7
8
9
10
I
2
t value - A
2
s x 10
4
I
2
t
7000
8000
9000
10000
I
2
t =
2
x t
2
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% V
RRM
, T
case
= 150C)
6/9
MP02 XX 175 Series
0
50
100
150
200
250
300
Mean forward current - (A)
350
300
250
200
150
100
50
0
On-state power loss per device - (W)
d.c.
120 Rectangular
180 Sine
60 Rectangular
180 Rectangular
0
50
100
150
200
250
300
Mean forward current - (A)
120
100
80
60
40
20
0
Maximum permissible case temperature - (C)
d.c.
180 Rectangular
120 Rectangular
60 Rectangular
140
160
180 Sine
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
MP02 XX 175 Series
7/9
40
80
120
0
100
200
300
1200
1000
800
600
400
200
0
Total power - (W)
140
100
60
Maximum ambient temperature - (C)
D.C. output current - (A)
400
R - Load
L - Load
R
th(hs-a)
C/W
0.02
0.04
0.08
0.10
0.12
0.15
0.20
0.40
0.30
0
20
40
80
120
0
100
200
300
1200
1000
800
600
400
200
0
Total power - (W)
140
100
60
Maximum ambient temperature - (C)
D.C. output current - (A)
400
R & L - Load
R
th(hs-a)
C/W
0.02
0.04
0.08
0.10
0.12
0.15
0.20
0.40
0.30
0
20
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: R
th(hs-a)
values given above are true heatsink thermal resistances to ambient and already account for R
th(c-hs)
module contact thermal).
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: R
th(hs-a)
values given above are true heatsink thermal resistances to ambient and already account for R
th(c-hs)
module contact thermal).
8/9
MP02 XX 175 Series
G
1
2
3
1
2
3
HB
GN
1
2
3
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
CIRCUIT CONFIGURATIONS
23
23
24
13
80
34
30
94
2x M6
12.8
6.5
1
2
3
Nominal weight: 350g
Recommended fixings for mounting: M6 socket head cap screws
Recommended mounting torque: 6Nm (55lb.ins)
Recommended torque for electrical connections: 5Nm (44lb.ins)
Maximum torque for electrical connections: 8Nm (70lb.ins)
Module outline type code: MP02
MP02 XX 175 Series
9/9
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
Dynex Semiconductor 2000 Publication No. DS5101-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
PDF 
ZIP