DL 300 DL1200
ELECTRICAL CHARACTERISTICS (at T
A
=25 C Unless Otherwise Specified)
NOTES:
o
FAST RECOVERY HIGH VOLTAGE 25mA
MINIATURE SILICON RECTIFIERS
SMALL SIZE MOLDED PACKAGE
PRV 3,000 TO 12,000 VOLTS
1.0 INCH MIN. LEADS
LOW LEAKAGE
Average Rectified Forward Current @ 50
o
C, I
O
Max. Peak Surge Current, I
FSM
Max. Forward Voltage Drop @ 25 m
A,
V
F
Max. DC Reverse Current @ PRV and 25
o
C, I
R
Max. DC Reverse Current @ PRV and 100
o
C, I
R
Ambient Operating Temperature Range, T
A
Storage Temperature Range, T
STG
25 mA
3 Amp
26Volts
1
25
-55
o
C to +125
o
C
-55
o
C to +150
o
C
A
A
(8.3ms)
rr
150nanosec
EDI
Type
PRV
Volts
DL300
3,000
DL500
5,000
DL800
8,000
DL1000
10,000
DL1200
12,000
Max. Reverse Recovery T (Fig.4)
1.It is recommended that a proper heat sink be used on the terminals of this device between the body and
soldering point to prevent damage from excess heat.
2.If operated over 10,000v/inch in length, devices should be immersed in oil or ree - ncapsulated.
EDI reserves the right to change these specifications at any time without notice.
100
75
50
25
0
0
25
50
75
100
125
150
FIG.1
OUTPUT CURRENT vs AMBIENT TEMPERATURE
FIG.2
NON- REPETITIVE SURGE CURRENT
0.1SEC
1.0SEC
100
75
50
25
0
1
2
3
4
5
6
7
9 10
20
30
40 50 60
8
CYCLES(60 Hz)
DL300 DL 1200
21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828
ELECTRONIC DEVICES, INC.
DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
AMBIENT TEMPERATURE
O
C
%
M
A
X
I
M
U
M
S
U
R
G
E
REVERSE RECOVERY TEST METHOD
FIG.4
RECOVERY WAVE FORM
RECOVERY WA VE FORM
I
F
=2MA
D.U.T.
SCOPE
50
N I
N I
I
R
=5MA
I
RR
=1MA
WAVE FORMS
PULSE
GENERATOR
CIRCUIT
1000
0.1
T
rr
E
e-mail:sales@edidiodes.com
W
website: http://www.edidiodes.com
*
FIG.3
LEAD-SOLDER DIPPED COPPER
MARKING:CATHODE BAND
AND DEVICE TYPE
MECHANICAL
.125 Dia.
.400
.021 Dia.
1.0Min Both Ends
%
R
A
T
E
D
F
W
D
C
U
R
R
E
N
T
+
-
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