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Электронный компонент: S1C8F360

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MF1349-02
Technical Manual
CMOS 8-BIT SINGLE CHIP MICROCOMPUTER
S1C8F360 Technical Hardware
S1C8F360
NOTICE
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko
Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any
liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or
circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such
as medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there
is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright
infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic
products under the control of the Foreign Exchange and Foreign Trade Law of Japan and may require an export license from
the Ministry of International Trade and Industry or other approval from another government agency.
MS-DOS, Windows, Windows 95, Windows 98 and Windows NT are registered trademarks of Microsoft Corporation, U.S.A.
PC-DOS, PC/AT, PS/2, VGA, EGA and IBM are registered trademarks of International Business Machines Corporation, U.S.A.
NEC PC-9800 Series and NEC are registered trademarks of NEC Corporation.
The flash technology in this product is licensed from Silicon Storage Technology Inc. in the U.S.A.
All other product names mentioned herein are trademarks and/or registered trademarks of their respective owners.
SEIKO EPSON CORPORATION 2001 All rights reserved.

The information of the product number change
Configuration of product number
Devices
Comparison table between new and previous number
S1C88 Family processors
Starting April 1, 2001, the product number will be changed as listed below. To order from April 1,
2001 please use the new product number. For further information, please contact Epson sales
representative.
S1
C
88104
F
0A01
Packing specification
Package (D: die form; F: QFP)
Model number
Model name (C: microcomputer, digital products)
Product classification (S1: semiconductor)
Development tools
S5U1
C
88348
D1
1
Packing specification
Version (1: Version 1
2
)
Tool type (D1: Development Tool
1
)
Corresponding model number (88348: for S1C88348)
Tool classification (C: microcomputer use)
Product classification
(S5U1: development tool for semiconductor products)
1: For details about tool types, see the tables below. (In some manuals, tool types are represented by one digit.)
2: Actual versions are not written in the manuals.
Previous No.
E0C88104
E0C88112
E0C88308
E0C88316
E0C88317
E0C88348
E0C88P348
E0C88349
New No.
S1C88104
S1C88112
S1C88308
S1C88316
S1C88317
S1C88348
S1C8P348
S1C88349
Previous No.
E0C88365
E0C88F360
E0C88408
E0C88409
E0C88816
E0C88832
E0C88862
E0C88F816
New No.
S1C88365
S1C8F360
S1C88408
S1C88409
S1C88816
S1C88832
S1C88862
S1C8F816
Comparison table between new and previous number of development tools
Development tools for the S1C88 Family
Development tools for the S1C63/88 Family
Previous No.
88ISAIF
ADP88348
ADP88360
DEV88104
DEV88112
DEV88308
DEV88316
DEV88317
DEV88348
DEV88365
DEV88408
DEV88409
New No.
S5U1C88000H4
S5U1C88348X
S5U1C88360X
S5U1C88104D
S5U1C88112D
S5U1C88308D
S5U1C88316D
S5U1C88317D
S5U1C88348D
S5U1C88365D
S5U1C88408D
S5U1C88409D
Previous No.
DEV88816
DEV88832
DEV88862
DMT88348-DB
ICE88UR
PRC88316
PRC88348
PRC88365
PRC88409
PRC88816
SAP88
URS88348
New No.
S5U1C88816D
S5U1C88832D
S5U1C88862D
S5U1C88348T
S5U1C88000H5
S5U1C88316P
S5U1C88348P
S5U1C88365P
S5U1C88409P
S5U1C88816P
S5U1C88000S
S5U1C88348Y
Previous No.
ADS00002
GWH00002
URM00002
New No.
S5U1C88000X1
S5U1C88000W2
S5U1C88000W1
00
00
S1C8F360 TECHNICAL MANUAL
EPSON
i
CONTENTS
Preface
The S1C8F360 is a development tool/preprocessor IC for the S1C88862, S1C88861, S1C88832, S1C88348,
S1C88317 and S1C88316. The ROM has been changed to a Flash EEPROM (described as PROM in this
manual) and a 10-bit A/D converter with four analog inputs is included. Almost all other circuits are
compatible with the S1C883xx/888xx mask ROM models.
Furthermore, an exclusive PROM writer should be used for PROM programming. Refer to Appendix,
"PROM Programming", for how to program the PROM.
Refer to the following manuals in addition to this manual. (Note that the pin assignment of the S1C8F360 is
different from that of the S1C883xx/888xx.)
S1C88348/317/316/308 Technical Manual
S1C88832/88862 Technical Manual
Contents
1
INTRODUCTION .............................................................................................. 1
1.1
Features ............................................................................................................................. 1
1.2
Block Diagram ................................................................................................................... 2
1.3
Pin Layout Diagram .......................................................................................................... 3
1.4
Pin Description .................................................................................................................. 4
1.5
Mask Option ....................................................................................................................... 5
2
POWER SUPPLY ............................................................................................... 6
2.1
Operating Voltage .............................................................................................................. 6
2.2
Internal Power Supply Circuit ........................................................................................... 6
2.3
Heavy Load Protection Mode ............................................................................................ 7
3
CPU AND BUS CONFIGURATION ................................................................ 8
3.1
CPU ...................................................................................................................................8
3.2
Internal Memory ................................................................................................................ 8
3.2.1 PROM ....................................................................................................................................... 8
3.2.2 RAM .......................................................................................................................................... 8
3.2.3 I/O memory ............................................................................................................................... 8
3.2.4 Display memory ........................................................................................................................ 8
3.3
Exception Processing Vectors ........................................................................................... 8
3.4
CC (Customized Condition Flag) ...................................................................................... 9
3.5
Chip Mode .......................................................................................................................... 9
3.5.1 MCU mode and MPU mode ..................................................................................................... 9
3.5.2 Bus mode ................................................................................................................................. 10
3.6
External Bus ......................................................................................................................12
3.6.1 Data bus .................................................................................................................................. 12
3.6.2 Address bus ............................................................................................................................. 12
______
_______
3.6.3 Read (RD)/write (WR) signals ................................................................................................. 12
______
3.6.4 Chip enable (CE) signal .......................................................................................................... 13
3.6.5 WAIT control ........................................................................................................................... 14
3.6.6 Bus authority release state ...................................................................................................... 15
4
INITIAL RESET ............................................................................................... 16
4.1
Initial Reset Factor ........................................................................................................... 16
4.2
Initial Settings After Initial Reset ...................................................................................... 17