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Электронный компонент: S1M1V085

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Rev.1.2
Rev.1.0
s
DESCRIPTION
The S1M1V085B0J7 is a 524,288 words x 16-bit (Word-mode) / 1,048,576 words x 8-bit (Byte-mode)
asynchronous, random access memory on a monolithic CMOS chip. It is possible to select Word-mode or Byte-
mode by CIO-pin: CIO=V
DD
for Word-mode and CIO=V
SS
for Byte-mode. Its very low standby power requirement
makes it ideal for applications requiring non-volatile storage with back-up batteries. The asynchronous and
static nature of the memory requires no external clock and no refreshing circuit. It is possible to control the data
width by the data byte control for Word-mode. 3-state output allows easy expansion of memory capacity. The
temperature range of the S1M1V085B0J7 is from 40 to 85
C, and it is suitable for the industrial products.
s
FEATURES
q
Fast Access time ........................ 70ns (2.4V)
q
Low supply current ..................... LL Version
q
Completely static ........................ No clock required
q
Supply voltage ............................ 2.4V to 3.0V
q
3-state output with wired-OR capability
q
Non-volatile storage with back-up batteries
q
Package ..................................... S1M1V085B0J
TFBGA-48 pin (Tape CSP)
s
BLOCK DIAGRAM
I/O Buffer
( ): in case of Byte-mode
16(8)
I/O1
I/O16
CS1
OE
WE
LB,UB
OE , WE
Control
Logic
CS1,CS2,CIO
Control
Logic
UB
LB
10
9
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
SA
Address Buffer
Memory Cell Array
1024 x 8192
Column Gate
1024
(10)
(1024)
512
(10)
(1024)
512 x 16(1024 x 8)
X Decoder
Y Decoder
CS2
CIO
8M-bit Static RAM
PF1200-01
S1M1V085B0J7
q
Super Low Voltage Operation and Low Current Consumption
q
Access Time 70ns (2.4V)
q
524,288 Words x 16-bit / 1,048,576 Words x 8-bit Asynchronous
q
Wide Temperature Range
Super Low Voltage
Operation
Products
Rev.1.0
2
S1M1V085B0J7
s
PIN CONFIGURATION
A
B
C
D
E
F
G
H
2
1
3
4
5
6
V
SS
I/O8
I/O14
I/O5
V
DD
I/O11
I/O2
OE
CIO
I/O16
I/O7
I/O13
I/O4
I/O10
I/O1
V
SS
A16
I/O15
I/O6
I/O12
I/O3
I/O9
CS1
A0
A15
A12
A9
NC
NC
A6
A3
A1
A14
A10
WE
CS2
A18
A17
A5
A2
A13
A11
A8
UB
LB
SA
A7
A4
TFBGA-48 pin
Top view (Looking through part)
S1M1V085B0J
s
PIN DESCRIPTION
A0 to A18
SA
WE
OE
CS1
CS2
LB
UB
I/O1 to 16
CIO
V
DD
V
SS
NC
Address Input
Address Input (Byte-mode use)
Write Enable
Output Enable
Chip Select1
Chip Select2
LOWER Byte Enable (Word-mode use)
UPPER Byte Enable (Word-mode use)
Data I/O
Word-mode/Byte-mode Selection
Power Supply (2.4V to 3.0V)
Power Supply (0V)
No connection
Rev.1.0
3
S1M1V085B0J7
s
ABSOLUTE MAXIMUM RATINGS
Supply voltage
Input voltage
Input/Output voltage
Power dissipation
Operating temperature
Storage temperature
Soldering temperature and time
Parameter
V
DD
V
I
V
I/O
P
D
T
opr
T
stg
T
sol
Symbol
Ratings
Unit
0.5 to 3.6
0.5
*
to V
DD
+ 0.3
0.5
*
to V
DD
+ 0.3
0.5
40 to 85
65 to 150
260
C, 10s (at lead)
(V
SS
=0V)
*
V
I
,V
I/O
(Min.) = 2.0V (when pulse width is less than 50ns)
V
V
V
W
C
C
s
DC RECOMMENDED OPERATING CONDITIONS
(Ta = 40 to 85
C)
Parameter
Supply voltage
Input voltege
Symbol
V
DD
V
SS
V
IH
V
IL
V
V
V
V
*
if pulse width is less than 50ns it is 2.0V
Min.
2.4
0.0
0.75V
DD
0.3
*
Typ.
2.7
0.0

Max.
3.0
0.0
V
DD
+0.3
0.3
Unit
V
DD
= 2.4 to 3.0V
s
ELECTRICAL CHARACTERISTICS
q
DC Electrical Characteristics
Parameter
Symbol
Conditions
Unit
Input leakage current
Standby supply current
Average operating current
Operating Supply Current
High level output voltage
I
LI
I
LO
V
OH
I
OH
Low level output voltage
V
OL
I
DDS
I
DDS1
I
DDA
I
DDA1
I
DDO
I
OL
A
(V
SS
=0V, Ta = 40 to 85
C)
V
DD
= 2.4 to 3.0V
V
I
= 0 to V
DD
LB and UB = V
IH
or
CS1 = V
IH
or CS2 = V
IL or
WE=V
IL
or OE = V
IH
,V
I/O
= 0 to V
DD
CS1 = V
IH or
CS2= V
IL
Output leakage current
1.0
Min.
Typ.
*1
Max.
1.0
A
1.0
1.0
mA
1.0
15
A


mA
25
35
mA
3.0
5.0
mA
3.0
5.0
V
V
1.8
V
DD
0.2
0.4
0.2
*1 : Typical values are measured at Ta = 25
C and V
DD
= 2.85V
V
I
= V
IL
or V
IH
I
I/O
= 0mA, t
cyc
= Min.
V
I
= V
IL
or V
IH
I
I/O
= 0mA, t
cyc
= 1
s
V
I
= V
IL
or V
IH
I
I/O
= 0mA
0.5mA
100
A
0.5mA
100
A
0.5
CS1 = CS2
V
DD
0.2V or CS2
0.2V
q
Terminal Capacitance
(Ta = 25
C, f = 1MHz)
Parameter
Symbol
Unit
Conditions
Address Capacitance
Input Capacitance
I/O Capacitance
C
ADD
C
I
C
I/O
V
ADD
= 0V
V
I
= 0V
V
I/O
= 0V
Max.
Min.
Typ.
Note : This parameter is made by the inspection data of sample, not of all products


8
8
10
pF
pF
pF
Rev.1.0
4
S1M1V085B0J7
1TTL
I/O
C
L
*1 Test Conditions
1. Input pulse level : 0.3V to 0.8V
DD
(2.4V to 3.0V)
2. t
r
= t
f
= 5ns
3. Input and output timing reference levels :1/2V
DD
(2.4V to 3.0V)
4. Output load : C
L
=100pF (Includes Jig Capacitance)
*2 Test Conditions
1. Input pulse level : 0.3V to 0.8V
DD
(2.4V to 3.0V)
2. t
r
= t
f
= 5ns
3. Input timing reference levels :1/2V
DD
(2.4V to 3.0V)
4. Output timing reference levels :
200mV (The level changed from stable
output voltage level)
5. Output load :C
L
= 5pF (Includes Jig Capacitance)
q
AC Electrical Characteristics
r
Read Cycle
1TTL
I/O
C
L
Unit
S1M1V085B0J7
2.4 to 3.0V
Min.
Max.
70
5
5
0
0
5
70
70
70
40
40
30
30
30
30
Parameter
Symbol
Test
Conditions
(V
SS
= 0V, Ta = 40 to 85
C)
Read cycle time
Address access time
CS1 access time
CS2 access time
OE access time
LB, UB access time*
CS1 output set time
CS2 output set time
CS1 output floating
CS2 output floating
LB, UB output set time*
LB, UB output floating*
OE output set time
OE output floating
Output hold time
t
RC
t
ACC
t
ACS1
t
ACS2
t
OE
t
AB
t
CLZ1
t
CLZ2
t
CHZ1
t
CHZ2
t
BLZ
t
BHZ
t
OLZ
t
OHZ
t
OH
1
1
1
1
1
1
2
2
2
2
2
2
2
2
1
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
*Word-mode only
r
Write Cycle
Unit
S1M1V085B0J7
2.4 to 3.0V
Min.
Max.
70
60
60
60
0
55
60
0
35
0
5
30
Parameter
Symbol
Test
Conditions
Write cycle time
Chip select time (CS1)
Chip select time (CS2)
Address enable time
Address setup time
Write pulse width
LB, UB select time *
Address hold time
Data setup time
Data hold time
WE output floating
WE output set time
(V
SS
= 0V, Ta = 40 to 85
C)
t
WC
t
CW1
t
CW2
t
AW
t
AS
t
WP
t
BW
t
WR
t
DW
t
DH
t
WHZ
t
OW
1
1
1
1
1
1
1
1
1
1
2
2
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
*Word-mode only
Rev.1.0
5
S1M1V085B0J7
q
Timing Chart (Word-mode)
Note :
*
1
During read cycle time, W
E
is to be "High" level.
*
2
In write cycle time that is controlled by C
S
1
or CS2, output buffer is to be "Hi-Z" state even if O
E
is "Low" level.
*
3
When output buffer is in output state, be careful that do not input the opposite signals to the output data.
t
CHZ2
CS1
Read Cycle
*1
A0 to 18
LB, UB
OE
I/O1 to 16
(Dout)
t
RC
t
ACC
t
BLZ
t
OE
t
OHZ
t
OLZ
Write Cycle 1 (CS1 Control)
*2, *3
t
AW
t
DW
t
WR
t
AS
t
DH
Write Cycle 3 (WE Control)
*3
Write Cycle 4 (UB, LB Control)
A0 to 18
CS1
LB, UB
WE
I/O1 to 16
(Dout)
(Din)
t
OH
High-Z
t
BW
t
CHZ1
t
CLZ1
CS2
CS2
t
WC
t
CW1
t
WP
t
DW
t
WR
t
AS
t
DH
A0 to 18
CS1
LB, UB
WE
I/O1 to 16
(Dout)
(Din)
High-Z
CS2
t
WC
t
CW1
t
WP
t
DW
t
BW
t
WR
t
AS
t
WHZ
t
OW
t
DH
A0 to 18
CS1
LB, UB
WE
I/O1 to 16
(Dout)
(Din)
t
CW2
Write Cycle 2 (CS2 Control)
*2, *3
t
AW
t
DW
t
WR
t
AS
t
DH
A0 to 18
CS1
LB, UB
WE
I/O1 to 16
(Dout)
(Din)
High-Z
t
BW
CS2
*3
CS2
t
CW2
t
WP
t
CW2
t
BW
t
CW1
t
WC
t
ACS1
t
WP
t
AB
t
ACS2
t
CLZ2
t
CW2
t
WC
t
CW1
t
BHZ