PKF series
General information
The MacroDensTM PKF family of true component
level on-board DC/DC power modules are intended
as distributed power sources in decentralized power
systems. Utilization of thick film technology and a
high degree of silicon integration has made it possible
to achieve a MTTF of more than 10 million hours.
The high reliability and the very low heights of these
DC/DC power modules makes them particularly
suited for Information Technology and Telecom
(IT&T) applications, with board spacing down to
15 mm or 0.6 in. They are optimized for an
operational ambient temperature range in compliance
SMD and through hole versions with
ultra-low component height 8.0 mm
(0.315 in.)
Up to 87% efficiency at full load
Safety requirements in accordance
with EN60950
MTTF >10 million hours at +50C case
temperature (+40C ambient)
Low EMI
PKF series
E
with present and future application needs, including
non temperature controlled environments. The
mechanical design offers surface mount and through-
hole versions, delivered in ready-to-use tubes, trays or
tape & reel packages, and compatibility with semi and
fully aqueous cleaning processes. The PKF series is
manufactured in highly automated production lines
using SMT, laser trimming, 100% burn-in and ATE
final inspection.
Ericsson Microelectronics AB has been an ISO 9001
certified supplier since 1991. For a complete product
program please reference the back cover.
Patents
US: D357901 DE: M94022763
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EN/LZT 146 57 R1A Ericsson Microelectronics AB, March 2001
1)
Applies to through-hole versions
2)
For surfacemount versions please see soldering profile page 4.
Environmental Characteristics
Characteristics
Vibration
(Sinusoidal)
JESD 22-B103
(IEC 68-2-6 F
c)
Test procedure & conditions
MIL-STD-883
Method 2026
(IEC 68-2-34 E
d)
Random
vibration
Temperature
change
JESD 22-A104
(IEC 68-2-14 N
a)
Frequency
Amplitude
Acceleration
Number of cycles
10...500 Hz
0.75 mm
10 g
10 in each axis
Frequency
Acceleration density
spectrum
Duration
Reproducability
10...500 Hz
0.5 g
2
/Hz
10 min in 3 directions
medium (IEC 62-36)
Peak acceleration
Shock duration
200 g
3 ms
Duration
Temperature
96 h
35C
JESD 22-A-A107
(IEC 68-2-11 K
a
)
Aggressive
environment
Resistance to
soldering temp
1) 2)
JESD 22-B106
(IEC 68-2-20 T
b
1A)
Temperature, solder
Duration
260C
10...13 s
High temp
Storage life
JESD22-A10
Temperature
Duration
125C
1000hrs
Lead Integrity
Solderability
JESD22-B105
Number of cycles
2
JESD22-B102
Operational
life test
Temperature
Maximum load
Input voltage on
Input voltage off
Duration
85C
9min
3min
1000hrs
Moisture reflow
Senitive classification
J-STD-020
Level 1
JESD 22-A101
(IEC 68-2-3 C
a
with bias)
Temperature
Humidity
Duration
85C
85% RH
1000 hours
Shock
(Half sinus)
JESD 22-B104
(IEC 68-2-27 E
a)
Temperature
Number of cycles
40C...+125C
500
Accelerated
damp heat
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EN/LZT 146 57 R1A Ericsson Microelectronics AB, March 2001
3.6[0.142]
5.0[0.197]
24.0[0.945]
2
9.6
[
1.16
5]
2.8[0.110]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
40.0[1.575]
Case
The case consists of semiconductor grade
epoxy with embedded pins.
Coefficient of thermal expansion (CTE) is typ.
15 ppm/C.
Weight
Maximum 20 g (0.71 oz).
Connection Pins
Base material is copper (Cu), first plating is
nickel (Ni) and second (outer) plating is
palladium (Pd).
Dimensions in mm (in)
Mechanical Data
Through-hole version
Foot print Component side
Dimensions in mm (in)
Dimensions in mm (in)
Surface-mount version
Foot print Component side
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EN/LZT 146 57 R1A Ericsson Microelectronics AB, March 2001
Thermal Data
Two-parameter model
This model provides a more precise description of the thermal char-
acteristics to be used for thermal calculations.
Thermally the power module can be considered as a component and
the case temperature can be used to characterize the properties. The
thermal data for a power module with the substrate in contact with
the case can be described with two thermal resistances. One from
case to ambient air and one from case to PB (Printed circuit Board).
The thermal characteristics temperature can be calculated from the
following formula:
Palladium plating is used on the terminal pins. A pin temperature (T
p
)
in excess of the solder fusing temperature (+183C for Sn/Pb 63/37)
for more than 25 seconds and a peak temperature above 195C, is
required to guarantee a reliable solder joint.
Both pin 1 and pin 11 must be monitored.
No responsibility is assumed if these recommendations are not
strictly followed.
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in sur-
face mount technology. Extra precautions must therefore be taken
when reflow soldering the surface mount version. Neglecting the
soldering information given below may result in permanent damage
or significant degradation of power module performance.
The PKF series can be reflow soldered using IR, Natural Convection,
Forced Convection or Combined IR/Convection Technologies. The
high thermal mass of the component and its effect on
DT (C) re-
quires that particular attention be paid to other temperature sensi-
tive components.
IR Reflow technology may require the overall profile time to be
extended to approximately 810 minutes to ensure an acceptable
DT. Higher activity flux may be more suitable to overcome the
increase in oxidation and to avoid flux burn-up.
The general profile parameters detailed in the diagram, with this ex-
tended time to reach peak temperatures, would then be suitable.
Note! These are maximum parameters. Depending on process varia-
tions, an appropriate margin must be added.
T
PB
= (T
C
T
A
)(R
th CPB
+R
th CA
)/R
th CA
P
d
R
th CPB
+T
A
Where:
P
d
:
dissipated power, calculated as P
O
(l/h1)
T
C
:
max average case temperature
T
A
:
ambient air temperature at the lower side of the
power module
T
PB
:
temperature in the PB between the PKF connection pins
R
th C-PB
: thermal resistance from case to PB under the
power module
R
th C-A
:
thermal resistance from case to ambient air
v:
velocity of ambient air
R
th C-PB
is constant and R
th
C-A
is dependent on the air velocity.
Free convection is equal to an air velocity of aprox. 0.2 0.3 m/s.
See figure below.
Figure 4
11
11
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EN/LZT 146 57 R1A Ericsson Microelectronics AB, March 2001
Delivery Package Information
Tubes
The PKF-series is delivered in tubes (designated by /A) with a
length of 500 mm (19.69 in), see fig. 2.
Figure 2
Specification
Material:
Antistatic coated PVC
Max surface resistance: 10
11
W/
Color:
Transparent
Capacity:
10 power modules/tube
Weight:
Typ. 60 g
End stops:
Pins
Trays
SMD versions, SI, can be delivered in standard JEDEC trays (desig-
nated by /B) on request, see fig. 3. For more information, please
contact your local Ericsson sales office.
Figure 3
Specification
Material:
Polypropylene (PP)
Max temperature:
125C
Max surface resistance: 10
5
W/
Color:
Black
Tape & Reel
SMD versions, SI, can be delivered in standard tape & reel package
(designated by /C) on request, see fig. 4. For more information, please
contact your local Ericsson sales office.
Figure 4
Capacity:
15 power modules/tray
Stacking pitch:
10.16 mm
Weight:
Typ. 130 g
Min. order quantity:
150 pcs (one box contains 10 full trays)
Specification
Tape material:
Conductive polystyrene (PS)
Tape width:
72 mm
Tape pitch:
36 mm
Max surface resistance:
10
5
W
/
Tape color:
Black
Cover tape color:
Transparent
Reel diameter:
13"
Reel hub diameter:
4"
Reel capacity:
150 power modules/reel
Full reel weight:
Typ. 3.7 kg
Min. order quantity:
300 pcs (one box contains two reels)
9.5
(0.37)
1.1
(0.04)
35
(1.38)
15
(0.59)
11
(0.43)
14.5
(0.57)
24
(0.95)
All dimensions in mm (in)
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