Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 1 of 5 April 2005
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
Product Features
x
60 2500 MHz
x
+20 dBm P1dB
x
+36 dBm Output IP3
x
14 dB Gain @ 900 MHz
x
12.5 dB Gain @ 1900 MHz
x
Single Positive Supply (+3V)
x
Available in a lead-free / green
SOT-89 Package Style
Applications
x
Final stage amplifiers for Repeaters
x
Mobile Infrastructure
x
CATV / DBS
x
Defense / Homeland Security
Product Description
The ECG012 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance across a broad
range with +36 dBm OIP3 and +20 dBm of compressed
1dB power. It is housed in a lead-free/green/RoHS-
compliant SOT-89 SMT package. All devices are 100%
RF and DC tested.
The ECG012 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECG012 to maintain high linearity over temperature and
operate directly off a single +3 V supply. This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
Functional Diagram
RF IN
GND
RF OUT
GND
1
2
3
4
Function
Pin No.
Input
1
Output/Bias
3
Ground
2, 4
Specifications
(1)
Parameters
Units Min Typ Max
Operational Bandwidth
MHz
60
2500
Test Frequency
MHz
1900
Gain
dB
11
12.5
Input Return Loss
dB
15
Output Return Loss
dB
10
Output P1dB
dBm
+20
Output IP3
(2)
dBm
+36
IS-95A Channel Power
@ -45 dBc ACPR
dBm
+13
Noise Figure
dB
4.9
Operating Current Range
mA
65
100
145
Device Voltage
V
+3
1. Test conditions unless otherwise noted: 25C, Vsupply = +3 V, in a tuned application circuit.
2. 3OIP measured with two tones at an output power of +6 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Rating
Operating Case Temperature
-40 to +85
qC
Storage Temperature
-65 to +150
qC
RF Input Power (continuous)
+15 dBm
Device Voltage
+6 V
Device Current
220 mA
Junction Temperature
+250
qC
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance
(3)
Parameters
Units
Typical
Frequency
MHz
900
1900
2140
S21 - Gain
dB
14
12.5
11.5
S11 - Input R.L.
dB
-14
-15
-15
S22 - Output R.L.
dB
-10
-10
-10
Output P1dB
dBm
+20
+20
+20
Output IP3
dBm
+35
+36
+36
Noise Figure
dB
4.7
4.9
5.4
Supply Bias
+3 V @ 100 mA
3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +3 V, I =
100 mA, +25
C
Ordering Information
Part No.
Description
ECG012B
0.1 Watt, High Linearity InGaP HBT Amplifier
(lead-tin SOT-89 Pkg)
ECG012B-G
0.1 Watt, High Linearity InGaP HBT Amplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG012B-PCB900 900 MHz Evaluation Board
ECG012B-PCB1900 1900 MHz Evaluation Board
ECG012B-PCB2140 2140 MHz Evaluation Board
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 2 of 5 April 2005
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
Typical Device Data
S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25
C, unmatched 50 ohm system)
0
1000
2000
3000
Frequency (MHz)
Gain / Maximum Stable Gain
0
5
10
15
20
25
30
G
a
i
n
(
d
B
)
DB(|S(2,1)|)
DB(GMax())
0
1
.
0
1
.
0
-
1
.
0
1
0
.
0
10.0
-10
.0
5
.
0
5.0
-5
.0
2
.
0
2.
0
-2
.0
3
.
0
3.
0
-3
.0
4
.
0
4.
0
-4
.0
0
.
2
0.
2
-0.
2
0
.
4
0.
4
-0
.4
0
.
6
0
.
6
-
0
.
6
0
.
8
0
.
8
-
0
.
8
S11
Swp Max
3000MHz
Swp Min
50MHz
0
1
.
0
1
.
0
-
1
.
0
1
0
.
0
10.0
-1
0.
0
5
.
0
5.0
-5
.0
2
.
0
2.
0
-2
.0
3
.
0
3.
0
-3
.0
4
.
0
4.
0
-4
.0
0
.
2
0.
2
-0.
2
0
.
4
0.
4
-0
.4
0
.
6
0
.6
-0
.
6
0
.
8
0
.
8
-
0
.
8
S22
Swp Max
3000MHz
Swp Min
50MHz
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The impedance plots are shown from 50 3000 MHz, with markers placed at 0.5 3.0 GHz in 0.5 GHz increments.
S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25
C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
-6.10
-155.37
20.62
150.95
-25.48
18.56
-8.19
-109.32
250
-3.49
-176.62
14.94
140.53
-23.11
6.69
-5.84
-166.90
500
-3.10
174.48
13.45
129.49
-22.77
5.89
-5.64
178.74
750
-2.96
167.11
12.26
115.68
-22.45
3.33
-5.43
170.66
1000
-2.79
160.22
11.17
102.37
-22.24
1.71
-5.27
162.86
1250
-2.64
153.20
10.12
89.48
-21.89
-0.69
-5.06
156.23
1500
-2.55
146.05
9.07
78.22
-21.32
-2.91
-5.01
149.29
1750
-2.44
138.76
8.18
67.48
-21.09
-5.27
-4.84
142.22
2000
-2.49
132.13
7.30
57.62
-20.45
-7.61
-4.77
135.81
2250
-2.39
125.66
6.45
48.01
-20.33
-11.25
-4.69
128.87
2500
-2.35
119.11
5.69
39.53
-19.88
-16.63
-4.68
122.52
2750
-2.28
111.83
4.98
30.50
-19.58
-18.56
-4.70
115.41
3000
-2.29
104.87
4.30
21.43
-18.98
-24.51
-4.54
108.72
Device S-parameters are available for download off of the website at: http://www.wj.com
Application Circuit PC Board Layout
Circuit Board Material: .014" Getek, 4 layers (other layers added for rigidity), .062" total thickness, 1 oz copper
Microstrip line details: width = .026", spacing = .026"
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 3 of 5 April 2005
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
900 MHz Application Circuit (ECG012B-PCB900)
Typical RF Performance
Frequency
900 MHz
S21 Gain
14 dB
S11 Input Return Loss
-14 dB
S22 Output Return Loss
-10 dB
Output IP3
(+6 dBm / tone, 1 MHz spacing)
+35 dBm
Output P1dB
+20 dBm
Noise Figure
4.7 dB
Supply Voltage
+3 V
Supply Current
100 mA
Measured parameters were taken at 25
C.
CAP
ID=C4
C=56 pF
CAP
ID=C5
C=56 pF
CAP
ID=C9
C=1 pF
DIODE1
ID=D1
CAP
ID=C3
C=1000 pF
CAP
ID=C2
C=56 pF
CAP
ID=C1
C=100000 pF
IND
ID=L1
L=33 nH
RES
ID=L2
R=0 Ohm
CAP
ID=C7
C=5.6 pF
RES
ID=L3
R=0 Ohm
RES
ID=R1
R=820 Ohm
SUBCKT
ID=U1
NET="ECG012"
PORT
P=1
Z=50 Ohm
PORT
P=2
Z=50 Ohm
Vcc = +3 V
5.6 V
C7 should be placed at the silk screen
marker 'F' on the WJ evaluation board.
All passive components are of size 0603 unless otherwise noted.
C9 should be placed between
on the WJ evaluation board.
size 1206
size 0805
The capacitor should be placed
19 @ 0.9GHz from pin 3
The capacitor should be placed
13.7 @ 0.9GHz from pin 1 of the ECG012
silk screen markers '8' and '9'
size 0603
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
of the ECG012.
L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
1900 MHz Application Circuit (ECG012B-PCB1900)
Typical RF Performance
Frequency
1900 MHz
S21 Gain
12.5 dB
S11 Input Return Loss
-15 dB
S22 Output Return Loss
-10 dB
Output IP3
(+6 dBm / tone, 1 MHz spacing)
+36 dBm
Output P1dB
+20 dBm
Noise Figure
4.9 dB
Supply Voltage
+3 V
Supply Current
100 mA
Measured parameters were taken at 25
C.
CAP
ID=C4
C=56 pF
CAP
ID=C5
C=56 pF
CAP
ID=C9
C=1.2 pF
DIODE1
ID=D1
CAP
ID=C3
C=1000 pF
CAP
ID=C2
C=56 pF
CAP
ID=C1
C=100000 pF
CAP
ID=C7
C=2.4 pF
IND
ID=L1
L=18 nH
RES
ID=L3
R=0 Ohm
RES
ID=L2
R=0 Ohm
RES
ID=R1
R=820 Ohm
SUBCKT
ID=U1
NET="ECG012"
PORT
P=1
Z=50 Ohm
PORT
P=2
Z=50 Ohm
Vcc = +3 V
5.6 V
C7 should be placed at the silk screen
marker 'A' on the WJ evaluation board.
All passive components are of size 0603 unless otherwise noted.
C9 should be placed at
on the WJ evaluation board.
size 1206
size 0805
The capacitor should be placed
34 @ 1.9GHz from pin 3
The capacitor should be placed
4.6 @ 1.9GHz from pin 1 of the ECG012
silk screen marker '7'
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
of the ECG012.
L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
2140 MHz Application Circuit (ECG012B-PCB2140)
Typical RF Performance
Frequency
2140 MHz
S21 Gain
11.5 dB
S11 Input Return Loss
-15 dB
S22 Output Return Loss
-10 dB
Output IP3
(+6 dBm / tone, 1 MHz spacing)
+34 dBm
Output P1dB
+20 dBm
Noise Figure
5.4 dB
Supply Voltage
+3 V
Supply Current
100 mA
Measured parameters were taken at 25
C.
CAP
ID=C4
C=56 pF
CAP
ID=C5
C=56 pF
CAP
ID=C9
C=.8 pF
DIODE1
ID=D1
CAP
ID=C3
C=1000 pF
CAP
ID=C2
C=56 pF
CAP
ID=C1
C=100000 pF
IND
ID=L1
L=18 nH
RES
ID=L3
R=0 Ohm
CAP
ID=C6
C=1.5 pF
CAP
ID=L2
C=2 pF
RES
ID=R1
R=820 Ohm
SUBCKT
ID=U1
NET="ECG012"
PORT
P=1
Z=50 Ohm
PORT
P=2
Z=50 Ohm
Vcc = +3 V
5.6 V
C6 should be placed between silk screen
markers 'E' & 'F' on the WJ evaluation board.
All passive components are of size 0603 unless otherwise noted.
C9 should be placed at
on the WJ evaluation board.
size 1206
size 0805
The capacitor should be placed
14.2 @ 2.14GHz from pin 3
The capacitor should be placed
28.9 @ 2.14GHz from pin 1 of the ECG012
silk screen marker '3'
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
of the ECG012.
L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
configuration.
Component R1 is shown in the silkscreen but is not used for this
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 5 April 2005
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
ECG012B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
q C
Thermal Resistance, Rth
(1)
149
q C / W
Junction Temperature, Tjc
(2)
130
q C
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
C.
2. This corresponds to the typical biasing condition of
+3V, 100 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
C.
Product Marking
The component will be marked with an
"E012" designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the "Application
Notes" section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135" ) diameter drill and have a final plated
thru diameter of .25 mm (.010" ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
10000
60
70
80
90
100
110
120
Tab Temperature (C)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 5 April 2005
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
ECG012B (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
qC reflow temperature) and leaded
(maximum 245
qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
q C
Thermal Resistance, Rth
(1)
149
q C / W
Junction Temperature, Tjc
(2)
130
q C
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
C.
2. This corresponds to the typical biasing condition of
+3V, 100 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
C.
Product Marking
The component will be marked with an
" E012G" designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the " Application
Notes" section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135" ) diameter drill and have a final plated
thru diameter of .25 mm (.010" ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
10000
60
70
80
90
100
110
120
Tab Temperature (C)
PDF 
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