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Электронный компонент: TC1NxxxxTR

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March 2002 / A
Page
1
SEMICONDUCTOR
TAK CHEONG
500 mW DO-35 Hermetically
Sealed Glass Fast Switching
Diodes
Absolute Maximum Ratings
T
A
= 25C unless otherwise noted
Symbol Parameter Value
Units
P
D
Power Dissipation
500
mW
T
STG
Storage Temperature Range
-65 to +200
C
T
J
Operating Junction Temperature
+175
C
W
IV
Working Inverse Voltage
75
V
I
O
Average Rectified Current
150
mA
I
FM
Non-repetitive Peak Forward Current
450
mA
I
FSURGE
Peak Forward Surge Current
2
A

These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Fast Switching Device (T
RR
<4.0 nS)
DO-35 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band

Electrical Characteristics
T
A
= 25C unless otherwise noted
Limits
Symbol
Parameter Test
Condition
Min Max
Unit
B
V
Breakdown Voltage
I
R
=100A
I
R
=5A
100
75
Volts
I
R
Reverse Leakage Current
V
R
=20V
V
R
=75V
25
5
nA
A
V
F
Forward Voltage
TC1N4448, TC1N914B
TC1N4148,
TC1N4148
TC1N4448,
TC1N914B
I
F
=5mA
I
F
=10mA
I
F
=100mA
0.62 0.72
1.0
1.0
Volts
T
RR
Reverse Recovery Time
I
F
=I
R
=10mA
R
L
=100
I
RR
=1mA
4 nS
C
Capacitance V
R
=0V, f=1M
HZ
4
pF



Cathode
Anode
ELECTRICAL SYMBOL
TC
1N
4148/TC
1N
4448/TC
1N
914B
L
xx
xx
DEVICE MARKING DIAGRAM
L :
Logo
TC1Nxxxx : Device Code
AXIAL LEAD
DO35
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March 2002 / A
Page
2
SEMICONDUCTOR
TAK CHEONG
Electrical Symbol Definition
Typical Characteristics
Symbol Parameter
B
V
Breakdown Voltage @ I
R
I
R
Reverse Leakage Current @ V
R
V
R
Reverse Voltage
I
F
Forward Current
V
F
Forward Voltage @ I
F
Ordering Information
Device Package
Quantity
TC1Nxxxx Bulk
10,000
TC1Nxxxx.TB Tape and Ammo
5,000
TC1Nxxxx.TR Tape and Reel
10,000
TC1Nxxxx
Others (...contact Tak Cheong sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component's packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the requirements of EIA Standard RS-296-D "Lead-taping of Components on Axial
Lead Configuration for Automatic Insertion".




























V
I
(mV)
(V)
(mA)
(A)
V
F
I
F
B
V
I
R
I
R
V
R
(nA)
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March 2002 / A
Page
3
SEMICONDUCTOR
TAK CHEONG
Tape & Reel Packaging Information
Tape & Reel Outline
Reel Dimensions
DIM
Millimeters
D1
356
D2
30
D3
84
W1
77.5
Quantity Per Reel
PKG Type
Quantity Per Reel
DO-35
10,000
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March 2002 / A
Page
4
SEMICONDUCTOR
TAK CHEONG
Tape & Ammo Packaging Information
Tape & Ammo
Outline
Quantity Per Ammo
Box
PKG Type
Quantity Per Box
DO-35
5,000

Taping Dimensions
Description
Millimeters
Standard Width
52
26
Tape Spacing (B)
52 0.69
26 +0.5 / -0
Component Pitch (C)
5.08 0.4
5.08 0.4
Untaped Lead (L1 L2)
0.69
0.69
Glass Offset (F)
0.69
0.69
Bent (D)
1.2 Max
1.2 Max
Tape Width (G)
6.138 0.576
6.138 0.576
Tape Mismatch (E)
0.55 Max
0.55 Max
Taped Lead (G)
3.2 Min
3.2 Min
Lead Beyond Tape (H)
0
0
250mm x 80mm x 80mm
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March 2002 / A
Page
5
SEMICONDUCTOR
TAK CHEONG
Bulk Packaging Information
Bulk Outline







Quantity Per Box
PKG Type
Quantity Per Box
DO-35
10,000







Plastic Bag
250mm x 80mm x 80mm
DO-35
1000 x 10 Plastic Bag
Quantity Per Plastic Bag