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OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
TISP61089B
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
Device Symbol
Dual Voltage-Programmable Protectors
- Supports Battery Voltages Down to -155 V
- Low 5 mA max. Gate Triggering Current
- High 150 mA min. Holding Current
Rated for LSSGR `1089 Conditions
D Package (Top View)
2/10 Overshoot Voltage Specified
How To Order
Rated for ITU-T K.20, K.21 and K.45
Impulse
Waveshape
`1089 Test
I
TSP
A
Section
Test #
2/10
4.5.7
4.5.8
4
1
120
10/360
4.5.7
2, 5
30
10/1000
4.5.7
1,3
30
Element
I
TM
= 100 A, di/dt = 80 A/
s
V
Diode
10
SCR
12
MD6XANB
NC - No internal connection
Terminal typical application names shown in
parenthesis
1
2
3
4
5
6
7
8
K1
A
A
K2
G
K1
K2
NC
(Tip)
(Ground)
(Ground)
(Ring)
(Gate)
(Tip)
(Ring)
SD6XAEB
K1
K2
A
A
G
K1
K2
Te rminals K1, K2 and A correspond to the alternative
line designators of T, R and G or A, B and C. The
negative protection voltage is controlled by the
voltage, V
GG,
applied to the G terminal.
Waveshape
I
TSP
A
Voltage
Current
10/700
5/310
40
Description
The TISP61089B is a dual forward-conducting buffered p-gate thyristor (SCR) overvoltage protector. It is designed to protect monolithic SLICs
(Subscriber Line Interface Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. The
TISP61089B limits voltages that exceed the SLIC supply rail voltage. The TISP61089B parameters are specified to allow equipment
compliance with Bellcore GR-1089-CORE, Issue 2 and ITU-T recommendations K.20, K.21 and K.45.
60 Hz Power
Fault Times
`1089 Test
I
TSM
A
Section
Test #
0.5
4.5.12
9
6.5
1
4.5.12
3, 4, 8
4.6
2
4.5.12
7
3.4
5
4.5.12
4.5.13
5
2, 3
2.3
30
4.5.12
6
1.3
900
4.5.12
4.5.13
4.5.15/16
1, 2
1, 4, 5
0.73
............................................ UL Recognized Components
Device
Package
Carrier
TISP61089B
D (8-pin Small-Outline)
Embossed Tape Reeled
TISP61089BDR
Tube
TISP61089BD
TISP61089BDR-S
TISP61089BD-S
For Standard
Termination Finish
Order As
For Lead Free
Termination Finish
Order As
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
*R
oH
S C
OM
PL
IA
NT
VE
RS
IO
NS
AV
AIL
AB
LE
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Description (Continued)
The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage in the region of -20 V to -150 V. The protector gate is
connected to this negative supply. This references the protection (clipping) voltage to the negative supply voltage. The protection voltage will
then track the negative supply voltage and the overvoltage stress on the SLIC is minimized.
Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially clipped close to the SLIC negative
supply rail value. If sufficient current is available from the overvoltage, then the protector SCR will switch into a low voltage on-state condition.
As the overvoltage subsides, the high holding current of TISP61089B SCR prevents d.c. latchup.
The TISP61089B is intended to be used with a series combination of a 40 or higher resistance and a suitable overcurrent protector. Power
fault compliance requires the series overcurrent element to open-circuit or become high impedance (see Applications Information). For
equipment compliant to ITU-T recommendations K.20 or K.21 or K.45 only, the series resistor value is set by the coordination requirements.
For coordination with a 400 V limit GDT, a minimum series resistor value of 10 is recommended.
These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high reliability and in normal system
operation they are virtually transparent. The TISP61089B buffered gate design reduces the loading on the SLIC supply during overvoltages
caused by power cross and induction. The TISP61089B is available in a 8-pin plastic small-outline surface mount package.
TISP61089B High Voltage Ringing SLIC Protector
Absolute Maximum Ratings, -40 C TJ 85 C (Unless Otherwise Noted)
Rating
Symbol
Value
Unit
Repetitive peak off-state voltage, V
GK
= 0
V
DRM
-170
V
Repetitive peak gate-cathode voltage, V
KA
= 0
V
GKRM
-167
V
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
I
TSP
A
10/1000
s (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4)
5/320
s (ITU-T K.20, K.21& K.45, K.44 open-circuit voltage wave shape 10/700
s)
10/360
s (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4)
30
40
40
1.2/50
s (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4)
100
2/10
s (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999,
Section 4)
T
J
= 25
C
120
170
Non-repetitive peak on-state current, 60 Hz (see Notes 1, 2 and 3)
I
TSM
A
0.5 s
6.5
1 s
2 s
5 s
30 s
900 s
4.6
3.4
2.3
1.3
0.73
Non-repetitive peak gate current, 1/2
s pulse, cathodes commoned (see Notes 1 and 2)
I
GSM
+40
A
Operating free-air temperature range
T
A
-40 to +85
C
Junction temperature
T
J
-40 to +150
C
Storage temperature range
T
stg
-40 to +150
C
NOTES: 1. Initially, the protector must be in thermal equilibrium with -40
C
T
J
85
C. The surge may be repeated after the device returns
to its initial conditions.
2. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both
terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice
the rated current value of an individual terminal pair). Above 85
C, derate linearly to zero at 150
C lead temperature.
3. Values for V
GG
= -100 V. For values at other voltages see Figure 2.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Recommended Operating Conditions
Electrical Characteristics, TJ = 25 C (Unless Otherwise Noted)
Component
Min
Typ
Max
Unit
C
G
TISP61089B gate decoupling capacitor
100
220
nF
R
S
TISP61089B series resistor for GR-1089-CORE first-level surge survival
25
TISP61089B series resistor for GR-1089-CORE first-level and second-level surge survival
40
TISP61089B series resistor for GR-1089-CORE intra-building port surge survival
8
TISP61089B series resistor for K.20, K.21 and K.45 coordination with a 400 V primary
protector
10
Parameter
Test Conditions
Min
Typ
Max
Unit
I
D
Off-state current
V
D
= V
DRM
, V
GK
= 0
T
J
= 25
C
-5
A
T
J
= 85
C
-50
A
V
(BO)
Breakover voltage
2/10
s, I
TM
= -100 A, di/dt = -80 A/
s, R
S
= 50
,
V
GG
= -100 V -112
V
V
GK(BO)
Gate-cathode impulse
breakover voltage
2/10
s, I
TM
= -100 A, di/dt = -80 A/
s, R
S
= 50
,
V
GG
= -100 V,
(see Note 4)
12
V
V
F
Forward voltage
I
F
= 5 A, t
w
= 200
s
3
V
V
FRM
Peak forward recovery
voltage
2/10
s, I
F
= 100 A, di/dt = 80 A/
s, R
S
= 50
,
(see Note 4)
10
V
I
H
Holding current
I
T
= -1 A, di/dt = 1A/ms, V
GG
= -100 V
-150
mA
I
GKS
Gate reverse current
V
GG
= V
GK
= V
GKRM
, V
KA
= 0
T
J
= 25
C
-5
A
T
J
= 85
C
-50
A
I
GT
Gate trigger current
I
T
= -3 A, t
p(g)
20
s, V
GG
= -100 V
5
mA
V
GT
Gate-cathode trigger
voltage
I
T
= -3 A, t
p(g)
20
s, V
GG
= -100 V
2.5
V
C
KA
Cathode-anode off-
state capacitance
f = 1 MHz, V
d
= 1 V, I
G
= 0, (see Note 5)
V
D
= -3 V
100
pF
V
D
= -48 V
50
pF
NOTES: 4. The diode forward recovery and the thyristor gate impulse breakover (overshoot) are not strongly dependent of the gate supply
voltage value (V
GG
).
5. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
Thermal Characteristics
Parameter
Test Conditions
Min
Typ
Max
Unit
R
JA
Junction to free air thermal resistance
T
A
= 25
C, EIA/JESD51-3 PCB, EIA/
JESD51-2 environment, P
TOT
= 1.7 W
120
C/W
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Parameter Measurement Information
Figure 1. Voltage-Current Characteristic
Unless Otherwise Noted, All Voltages are Referenced to the Anode
-v
I
S
V
S
V
GG
V
D
I
H
I
T
V
T
I
TSM
I
TSP
V
(BO)
I
(BO)
I
D
Quadrant I
Forward
Conduction
Characteristic
+v
+i
I
F
V
F
I
FSM
(=
)
|
TSM
I
FSP
(=
)
|
TSP
-i
Quadrant III
Switching
Characteristic
PM6XAAA
V
GK(BO)
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Thermal Information
Figure 2. Non-Repetitive Peak On-State Current against
Duration
PEAK NON-RECURRING AC
vs
CURRENT DURATION
t -- Current Duration -- s
0.01
0.1
1
10
100
1000
I
TSM
-- P
eak
N
o
n
-
R
ecurr
e
nt
50 H
z
C
u
r
r
en
t
-- A
0.5
0.6
0.7
0.8
1.5
2
3
4
5
6
7
8
15
20
1
10
V
GG
= -60 V
V
GG
= -80 V
V
GG
= -100 V
V
GG
= -120 V
RING AND TIP TERMINALS:
Equal I
TSM
values applied
simultaneously
GROUND TERMINAL:
Current twice I
TSM
value
EIA /JESD51
Environment and
PCB, T
A
= 25
C
TI61AF
Figure 3. Typical Non-Repetitive Peak On-state Current
against Duration
TYPICAL PEAK NON-RECURRING AC
vs
CURRENT DURATION
t -- Current Duration -- s
0.01
0.1
1
10
100
1000
I
TSM
--
P
eak No
n-Recurrent
50 Hz Current
-- A
0.5
0.6
0.7
0.8
1.5
2
3
4
5
6
7
8
15
20
1
10
RING AND TIP TERMINALS:
Equal I
TSM
values applied
simultaneously
GROUND TERMINAL:
Current twice I
TSM
value
V
GG
= -100 V
V
GG
= -120 V
Typical PCB
Mounting,
T
A
= 25
C
V
GG
= -60 V
V
GG
= -80 V
TI61DA
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
APPLICATIONS INFORMATION
Operation of Ringing SLICs using Multiple Negative Voltage Supply Rails
Figure 4 shows a typical powering arrangement for a multi-supply rail SLIC. VBATL is a lower (smaller) voltage supply than VBATH. With supply
switch S1 in the position shown, the line driver amplifiers are powered between 0 V and VBATL. This mode minimizes the power consumption
for short loop transmission. For long loops and to generate ringing, the driver voltage is increased by operating S1 to connect VBATH. These
conditions are shown in Figure 5.
Figure 4. SLIC with Voltage Supply Switching
S1
LINE
DRIVERS
V
BATH
0 V
SLIC
AI6XCC
SUPPLY
SWITCH
LINE
V
BATL
Figure 5. Driver Supply Voltage Levels
0 V
0 V
V
BATL
SHORT LOOP
V
BATH
LONG LOOP
V
DCRING
V
SLICG
V
PKRING
/2
V
SLICH
AI6XCD
V
BATH
V
BATH
RINGING
V
PKRING
/2
V
PKRING
/2
V
PKRING
/2
0 V
Conventional ringing is typically unbalanced ground or battery backed. To minimize the supply voltage required, most multi-rail SLICs use
balanced ringing as shown in Figure 5. The ringing has d.c., V
DCRING
, and a.c., V
PKRING
, components. A 70 V r.m.s. a.c. sinusoidal ring signal
has a peak value, V
PKRING
, of 99 V. If the d.c. component was 20 V, then the total voltage swing needed would be 99 + 20 = 119 V. There are
internal losses in the SLIC from ground, V
SLICG
, and the negative supply, V
SLICH
. The sum of these two losses generally amounts to a total of
10 V. This makes a total, V
BATH
, supply rail value of 119 + 10 = 129 V.
In some cases a trapezoidal a.c. ring signal is used. This would have a peak to r.m.s ratio (crest factor) of about 1.25, increasing the r.m.s. a.c.
ring level by 13 %. The d.c. ring voltage may be lowered for short loop applications.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
SLIC Parameter Values
The table below shows some details of HV SLICs using multiple negative supply rails.
Manufacturer
INFINEON
LEGERITYTM
Unit
SLIC Series
SLIC-P
ISLICTM
SLIC #
PEB 4266
79R241
79R101
79R100
Data Sheet Issue
14/02/2001
-/08/2000
-/07/2000
-/07/2000
Short Circuit Current
110
150
150
150
mA
V
BATH
max.
-155
-104
-104
-104
V
V
BATL
max.
-150
-104
V
BATH
V
BATH
V
AC Ringing for:
85
45
50
55
V rms
Crest Factor
1.4
1.4
1.4
1.25
V
BATH
-70
-90
-99
-99
V
V
BATR
-150
-36
-24
-24
V
R or T Power Max. < 10 ms
10
W
R or T Overshoot < 10 ms
TBD
TBD
-5
5
-10
5
-10
5
V
R or T Overshoot < 1 ms
-10
+10
V
R or T Overshoot < 1
s
-10
+30
-10
10
-15
8
-15
8
V
R or T Overshoot < 250 ns
-15
15
-20
12
-20
12
V
Line Feed Resistance
20 + 30
50
50
50
Assumes -20 V battery voltage during ringing.
Legerity, the Legerity logo and ISLIC are the trademarks of Legerity, Inc. (formerly AMD's Communication Products Division).
Other product names used in this publication are for identification purposes only and may be trademarks of their respective
companies.
From the table, the maximum supply voltage, V
BATH
, is -155 V. In terms of minimum voltage overshoot limits, -10 V and +8 V are needed for
1 s and -15 V, +12 V are needed for 250 ns. To maintain these voltage limits over the temperature range, 25 C values of -12 V, +10 V are
needed for 250 ns.
It is important to define the protector overshoot under the actual circuit current conditions. For example, if the series line feed resistor was
40 , R1 in Figure 12, and Telcordia GR-1089-CORE 2/10 and 10/1000 first-level impulses were applied, the peak protector currents would be
56 A and 20 A. At the second-level, the 2/10 impulse current would be 100 A. Therefore, the protector voltage overshoot should be guaranteed
to not exceed the SLIC voltage ratings at 100 A, 2/10 and 20 A, 10/1000. In practice, as the 2/10 waveshape has the highest current (100 A)
and fastest di/dt (80 A/s) the overshoot level testing can restricted to the be 2/10 waveshape.
Using the table values for maximum battery voltage and minimum overshoot gives a protection device requirement of -170 V and +12 V from
the output to ground. There needs to be temperature guard banding for the change in protector characteristics with temperature. To cover
down to -40 C, the 25 C protector minimum values become -185 V (V
DRM
) on the cathode and -182 V (V
GKS
) on the gate.
This section covers four topics. First, it is explained why gated protectors are needed. Second, the voltage limiting action of the protector is
described. Third, how the withstand voltages of the TISP61089B junctions are set. Fourth, an example application circuit is described.
Purpose of Gated Protectors
Fixed voltage thyristor overvoltage protectors have been used since the early 1980s to protect monolithic SLICs (Subscriber Line Interface
Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. As the SLIC was usually powered
from a fixed voltage negative supply rail, the limiting voltage of the protector could also be a fixed value. The TISP1072F3 is a typical example
of a fixed voltage SLIC protector.
Gated Protectors
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Gated Protectors (Continued)
SLICs have become more sophisticated. To minimize power consumption, some designs automatically adjust the driver supply voltage to a
value that is just sufficient to drive the required line current. For short lines, the supply voltage would be set low, but for long lines, a higher
supply voltage would be generated to drive sufficient line current. The optimum protection for this type of SLIC would be given by a protection
voltage which tracks the SLIC supply voltage. This can be achieved by connecting the protection thyristor gate to the SLIC V
BATH
supply,
Figure 6. This gated (programmable) protection arrangement minimizes the voltage stress on the SLIC, no matter what value of supply voltage.
Figure 6. TISP61089B Buffered Gate Protector (`1089 Section 4.5.12 Testing)
R1
40
RING
WIRE
TIP
WIRE
SLIC
TISP61089B
V
BATH
C1
220 nF
AI6XCC
600
600
A.C.
GENERATOR
0 - 600 V r.m.s.
SWITCHING MODE
POWER SUPPLY
GENERATOR
SOURCE
RESISTANCE
I
G
I
SLIC
C2
D1
Tx
R2
40
V
BATL
I
BATH
Figure 7. Negative Overvoltage Condition
I
G
Th5
SLIC
SLIC
PROTECTOR
I
K
AI6XAHB
V
BATH
TISP
61089B
C1
220 nF
Figure 8. Positive Overvoltage Condition
Th5
SLIC
V
BATH
SLIC
PROTECTOR
TISP
61089B
C1
220 nF
I
F
AI6XAIB
Operation of Gated Protectors
Figure 7 and Figure 8 show how the TISP61089B limits negative and positive overvoltages. Positive overvoltages (Figure 8) are clipped by the
antiparallel diode of Th5 and the resulting current is diverted to ground. Negative overvoltages (Figure 7) are initially clipped close to the SLIC
negative supply rail value (V
BATH
). If sufficient current is available from the overvoltage, then Th5 will switch into a low voltage on-state
condition. As the overvoltage subsides the high holding current of Th5 prevents d.c. latchup. The protection voltage will be the sum of the gate
supply (V
BATH
) and the peak gate-cathode voltage (V
GK(BO)
). The protection voltage will be increased if there is a long connection between the
gate decoupling capacitor, C1, and the gate terminal. During the initial rise of a fast impulse, the gate current (I
G
) is the same as the cathode
current (I
K
). Rates of 80 A/s can cause inductive voltages of 0.8 V in 2.5 cm of printed wiring track. To minimize this inductive voltage increase of
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Gated Protectors (Continued)
protection voltage, the length of the capacitor to gate terminal tracking should be minimized. Inductive voltages in the protector cathode wiring
will also increase the protection voltage. These voltages can be minimized by routing the SLIC connection through the protector as shown in
Figure 6.
Figure 9, which has a 10 A/s rate of impulse current rise, shows a positive gate charge (Q
GS
) of about 0.1 C. With the 0.1 F gate
decoupling capacitor used, the increase in gate supply is about 1 V (= Q
GS
/C1). This change is just visible on the -72 V gate voltage, V
BATH
.
But, the voltage increase does not directly add to the protection voltage as the supply voltage change reaches a maximum at 0.4 s, when the
gate current reverses polarity, and the protection voltage peaks earlier at 0.3 s. In Figure 9, the peak clamping voltage (V
(BO)
) is -77.5 V, an
increase of 5.5 V on the nominal gate supply voltage. This 5.5 V increase is the sum of the supply rail increase at that time, (0.5 V), and the
protection circuit's cathode diode to supply rail breakover voltage (5 V). In practice, use of the recommended 220 nF gate decoupling capacitor
would give a supply rail increase of about 0.3 V and a V
(BO)
value of about -77.3 V.
Figure 9. Protector Fast Impulse Clamping and Switching Waveforms
Time -
s
0.0
0.5
1.0
1.5
Vol
t
a
g
e
-
V
-80
-60
-40
-20
0
VK
Time -
s
0.0
0.5
1.0
1.5
Cu
rre
n
t
- A
-5
-4
-3
-2
-1
0
1
IK
IG
QGS
VBATH
AI6XDE
Voltage Stress Levels on the TISP61089B
Figure 10 shows the protector electrodes. The package terminal designated gate, G, is the transistor base, B, electrode connection and so is
marked as B (G). The following junctions are subject to voltage stress: Transistor EB and CB, SCR AK (off state) and the antiparallel diode
(reverse blocking). This clause covers the necessary testing to ensure the junctions are good.
Testing transistor CB and EB: The maximum voltage stress level for the TISP61089B is V
BATH
with the addition of the short term antiparallel
diode voltage overshoot, V
FRM
. The current flowing out of the G terminal is measured at V
BATH
plus V
FRM
. The SCR K terminal is shorted to
the common (0 V) for this test (see Figure 10). The measured current, I
GKS
, is the sum of the junction currents I
CB
and I
EB
.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Gated Protectors (Continued)
Summary: Two tests are needed to verify the protector junctions. Maximum current values for I
GKS
and I
D
are required at the specified applied
voltage conditions.
Testing transistor CB, SCR AK off state and diode reverse blocking: The highest AK voltage occurs during the overshoot period of the
protector. To make sure that the SCR and diode blocking junctions do not break down during this period, a d.c. test for off-state current, I
D
,
can be applied at the overshoot voltage value. To avoid transistor CB current amplification by the transistor gain, the transistor base-emitter is
shorted during this test (see Figure 11).
Figure 10. Transistor CB and EB Verification
V
BATH
+ V
FRM
TISP
61089B
AI6XCE
0 V
K
B (G)
I
EB
I
CB
I
GKS
Figure 11. Off-State Current Verification
0 V
AI6XCF
0 V
K
B (G)
I
CB
V
(BO)
TISP
61089B
I
D(I)
I
D
A
I
D(I)
is the internal SCR value of I
D
I
R
Figure 12. Typical Application Circuit
TEST
RELAY
RING
RELAY
SLIC
RELAY
TEST
EQUIP-
MENT
RING
GENERATOR
S1a
S1b
R1a
R1b
RING
WIRE
TIP
WIRE
Th1
Th2
Th3
Th4
Th5
SLIC
SLIC
PROTECTOR
RING/TEST
PROTECTION
OVER-
CURRENT
PROTECTION
S2a
S2b
TISP
3xxxF3
OR
7xxxF3
S3a
S3b
AI6XAJB
V
BATH
TISP
61089B
C1
220 nF
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
GR-1089-CORE, "1089", covers electromagnetic compatibility and electrical safety generic criteria for US network telecommunication
equipment. It is a module in Volume 3 of LSSGR (LATA (Local Access Transport Area) Switching Systems Generic Requirements,
FR-NWT-000064). In `1089, surge and power fault immunity tests are done at two levels. After first-level testing, the equipment shall not be
damaged and shall continue to operate correctly. Under second-level testing, the equipment shall not become a safety hazard. The equipment
is permitted to fail as a result of second-level testing. When the equipment is to be located on customer premises, second-level testing
includes a wiring simulator test, which requires the equipment to reduce the power fault current below certain values.
The following clauses reference the `1089 section and calculate the protector stress levels. The TISP61089B needs a 40 series resistor to
survive second-level surge testing. To survive first-level testing and possibly fail under second-level testing allows lower resistor value of 25
to be used. Tabulated current values are given for both 40 and 25 series resistor values.
Figure 12 shows a typical TISP61089B SLIC card protection circuit. The incoming line conductors, Ring (R) and Tip (T), connect to the relay
matrix via the series overcurrent protection. Fusible resistors, fuses and positive temperature coefficient (PTC) resistors can be used for
overcurrent protection. Resistors will reduce the prospective current from the surge generator for both the TISP61089B and the ring/test
protector. The TISP7xxxF3 protector has the same protection voltage for any terminal pair. This protector is used when the ring generator
configuration may be ground or battery-backed. For dedicated ground-backed ringing generators, the TISP3xxxF3 gives better protection as
its inter-conductor protection voltage is twice the conductor to ground value.
Relay contacts 3a and 3b connect the line conductors to the SLIC via the TISP61089B protector. The protector gate reference voltage comes
from the SLIC negative supply (V
BATH
). A 220 nF gate capacitor sources the high gate current pulses caused by fast rising impulses.
TISP61089B High Voltage Ringing SLIC Protector
Application Circuit
LSSGR 1089
`1089 Section 4.5.5 - Test Generators
The generic form of test generator is shown in Figure 13. It emphasises that multiple outputs must be independent, i.e. the loading condition of
one output must not affect the waveforms of the other outputs. It is a requirement that the open-circuit voltage and short circuit current
waveforms be recorded for each generator output used for testing. The fictive impedance of a generator output is defined as the peak open-
circuit voltage divided by the peak short-circuit current. Specified impulse waveshapes are maximum rise and minimum decay times. Thus, the
10/1000 waveshape should be interpreted as <10/>1000 and not the usually defined nominal values which have a tolerance.
Figure 13. `1089 Test Generators
or
Generic Lightning or AC Test Generator
Z is the fictive
current-limiting
impedance in
each output feed
Z
Z
Output 1
Output 2
Return
Z
Z
Output n
Output n + 1
AI6XCJ
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
`1089 Section 4.5.5 - Test Generators (Continued)
The exception to these two conditions of independence and limit waveshape values is the alternative IEEE C.62.41, 1.2/50-8/20 combination
wave generator which may be used for testing in `1089 Sections 4.5.7, 4.5.8 and 4.5.9. Here, the quoted waveshape values are nominal with
defined tolerance. The open-circuit voltage waveshape is 1.2 s0.36 s front time and 50 s10 s duration. The short-circuit current
waveshape is 8 s+1.0 s, -2.5 s front time and 20 s+8 s, -4 s duration. The generator fictive source impedance (peak open-circuit
voltage divided by peak short-circuit current) is 2.0 0.25 .
To get the same peak short-circuit currents as the 2/10 generator, for the same peak open-circuit voltage setting, `1089 specifies that the
1.2/50-8/20 generator be used with external resistors for current limiting and sharing. When working into a finite resistive load, the delivered
1.2/50-8/20 generator current waveshape moves towards the 1.2/50 voltage waveshape. Thus, although the 1.2/50-8/20 delivered peak
current is similar to the 2/10 generator, the much longer current duration means that a much higher stress is imposed on the equipment
protection circuit. This can cause fuses to operate which are perfectly satisfactory on the normal 2/10 generator. Testing with the 1.2/50-8/20
generator gives higher stress levels than the 2/10 generator and, because it is seldom used, will not be covered in this analysis.
Figure 14. Longitudinal (also Called Common Mode) Testing
Test Generator
Output 1
Ring
Return
EUT
(Equipment
Under Test)
Ground
Tip
Output 2
V1
V2
AI6XCK
Figure 15. Transverse (also Called Differential or Metallic) Testing
Test Generator
Output 1
Ring
Return
EUT
(Equipment
Under Test)
Ground
Tip
Output 2
V1
Test Generator
Output 1
Ring
Return
EUT
(Equipment
Under Test)
Ground
Tip
Output 2
V2
AI6XCM
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
`1089 Section 4.5.6 - Test Connections
`1089 Section 4.5.7 - First-Level Lightning Surge Testing
Table 1 shows the tests for this section. The peak TISP61089B current, I
TM
, is calculated by dividing the generator open voltage by the sum of
the generator fictive source and the line feed, R
S
, resistance values. Columns 9 and 10 show the resultant currents for R
S
values of 25 and
40 . The TISP61089B rated current values at the various waveshapes are higher than those listed in Table 1. Used with the specified values
of R
S
, the TISP61089B will survive these tests.
Table 1. First-Level Surge Currents
`1089 Section 4.5.8 - Second-Level Lightning Surge Testing
Table 2 shows the 2/10 test used for this section. Columns 9 and 10 show the resultant currents for R
S
values of 25 and 40 . Used with an
R
S
of 40 , the TISP61089B with survive this test. The 25 value of R
S
is only intended to give first-level (Section 4.5.7) survival. Under
second-level conditions, the peak current will be 2x143 A, which may result in failure of the 2x120 A rated TISP61089B. However, if the testing
is done at or near 25 C, the TISP61089B will survive with an R
S
value of 25 as the 2/10 rating is 170 A at this temperature.
Table 2. Second-Level Surge Current
The telecommunications port R and T terminals may be tested simultaneously or individually. Figure 14 shows connection for simultaneous
(longitudinal) testing. Figure 15 shows the two connections necessary to individually test the R and T terminals during transverse testing.
The values of protector current are calculated by dividing the open-circuit generator voltage by the total circuit resistance. The total circuit
resistance is the sum of the generator fictive source resistance and the TISP61089B series resistor value. The starting point of this analysis is
to calculate the minimum circuit resistance for a test by dividing the generator open-circuit voltage by the TISP61089B rating. Subtracting the
generator fictive resistance from the minimum circuit resistance gives the lowest value of series resistance that can be used. This is repeated
for all test connections. As the series resistance must be a fixed value, the value used has to be the highest value calculated from all the
considered test connections. Where both 10/1000 and 2/10 waveshape testing occurs, the 10/1000 test connection gives the highest value of
minimum series resistance. Unless otherwise stated, the analysis assumes a -40 C to +85 C temperature range.
Surge
#
Waveshape
Open-circuit
Voltage
V
Short-circuit
Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Generator
Fictive
Source
Resistance
TISP61089B I
TM
A
R
s
= 25
R
s
= 40
1
10/1000
600
100
+25, -25
Transverse &
Longitudinal
No
6
19 &
2x19
13 &
2x13
2
10/360
1000
100
+25, -25
Transverse &
Longitudinal
No
10
29 &
2x29
20 &
2x20
3
10/1000
1000
100
+25, -25
Transverse &
Longitudinal
No
10
29 &
2x29
20 &
2x20
4
2/10
2500
500
+10, -10
Longitudinal
No
5
2x83
2x56
5
10/360
1000
25
+5, -5
Longitudinal
No
40
2x15
2x13
NOTES: 1. Surge 3 may be used instead of Surge 1 and Surge 2.
2. Surge 5 is applied to multiple line pairs up to a maximum of 12.
3. If the equipment contains a voltage-limiting secondary protector, each test is repeated at a voltage just below the threshold of
limiting.
Surge
#
Waveshape
Open-circuit
Voltage
V
Short-circuit
Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Generator
Fictive
Source
Resistance
TISP61089B I
TM
A
R
s
= 25
R
s
= 40
1
2/10
5000
500
+1, -1
Longitudinal
No
10
2x143
2x100
NOTE:
1. If the equipment contains a voltage-limiting secondary protector, the test is repeated at a voltage just below the threshold of
limiting.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
`1089 Section 4.5.9 - Intra-Building Lightning Surge Testing
This test is for network equipment ports that do not serve outside lines. Table 3 shows the 2/10 tests used for this section. Dedicated intra-
building ports may use an R
S
value of 8 . The 8 value is set by the intra-building second-level a.c. testing of Section 4.5.16. Columns 9, 10
and 11 show the resultant currents for R
S
values of 8 , 25 and 40 . The listed currents are lower than the TISP61089B current rating of
2x120 A and the TISP61089B will survive these tests.
Table 3. Intra-building Lightning Surge Currents
Surge
#
Waveshape
Open-circuit
Voltage
V
Short-circuit
Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Generator
Fictive
Source
Resistance
TISP61089B I
TM
A
R
s
= 8
R
s
= 25
R
s
= 40
1
2/10
800
100
+1, -1
Transverse
NA
8
50
24
17
2
2/10
1500
100
+1, -1
Longitudinal
NA
15
2x65
2x38
2x27
NOTE:
1. If the equipment contains a voltage-limiting secondary protector, the test is repeated at a voltage just below the threshold of
limiting.
`1089 Section 4.5.11 - Current-Limiting Protector Testing
Equipment that allows unacceptable current to flow during power faults (Figure 16) shall be specified to use an appropriate current-limiting
protector. The equipment performance can be determined by testing with a series fuse, which simulates the safe current levels of a telephone
cable. If this fuse opens, the equipment allows unacceptable current flow and an external current-limiting protector must be specified. For
acceptable currents, the equipment must not allow current flows for times that would operate the simulator. The wiring simulator fuse current-
time characteristic shall match the boundary of Figure 16. A Bussmann MDQ-1
6
/
10
fuse is often specified as meeting this requirement, Figure 17.
Figure 16. Wiring Simulator Current-Time
t - Current Duration - s
001
01
Cu
r
r
e
n
t
--
A
rm
s
2
2.5
3
4
5
6
7
8
15
20
25
30
40
50
60
70
80
10
1
10
100
1000
UNACCEPTABLE
REGION
ACCEPTABLE
REGION
'1089 WIRING SIMULATOR CURRENT
vs
TIME
TI6LAG
Figure 17. MDQ-1
6
/
10
Current-Time
t - Current Duration - s
001
01
1
10
100
1000
Cu
r
r
e
n
t --
A
rm
s
2
2.5
3
4
5
6
7
8
15
20
25
30
40
50
60
70
80
10
TI6LAH
UNACCEPTABLE
REGION
MDQ-1
6
/
10
MDQ-1
6
/
10
OPERATING CURRENT
vs
AVERAGE MELT TIME
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
`1089 Section 4.5.11 - Current-Limiting Protector Testing (Continued)
The test generator has a voltage source that can be varied from zero to 600 V rms and an output resistance of 20 to each conductor. Table 4
shows the range of currents conducted by the TISP61089B.
Table 4. Wiring Simulator Testing
AC Duration
s
Open-Circuit
RMS Voltage
V
Short-Circuit
RMS Current
A
Test
Connections
Primary
Fitted
Source
Resistance
TISP61089B I
TM
A (peak)
R
s
= 25
R
s
= 40
900
0 to 600
0 to 30
Transverse & Longitudinal
No
20
0 to 2x 19
0 to 2x 14
`1089 Section 4.5.12 - First-Level Power Fault Testing
Table 6 shows the five tests used for this section. Columns 9 and 10 show the prospective currents for these tests using R
S
values of 25 and
40 . The two most stressful tests of this section are test 1 and test 2. As shown in Table 6, the peak currents for these tests are 2x17 A and
2x7.7 A respectively. With the exception of test 5, all the other tests require the series overcurrent protection to operate before the TISP61089B
current-time ratings are exceeded. In the case of test 2, with an R
S
of 25 , the overcurrent protection must operate within the initial a.c. half
cycle to prevent damage.
Test
#
AC Duration
s
Open-circuit
RMS Voltage
V
Short-circuit
RMS Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Source
Resistance
TISP61089B I
TM
A (peak)
R
s
= 25
R
s
= 40
1
900
50
0.33
1
Tr ansverse &
Longitudinal
No
150
2x0.40
2x0.37
2
900
100
0.17
1
Tr ansverse &
Longitudinal
No
600
2x0.23
2x0.22
3
1
200
400
600
0.33
0.67
1.00
60
60
60
Tr ansverse &
Longitudinal
No
600
2x0.45
2x0.90
2x1.36
2x0.44
2x0.89
2x1.33
4
1
1000
1
60
Longitudinal
Yes
1000
2x1.38
2x1.30
5
5
600
0.09
60
Differential
No
Capacitive
2x0.12
2x0.12
6
30
600
0.5
1
Tr ansverse &
Longitudinal
No
1200
2x0.69
2x0.68
7
2
600
2.2
1
Tr ansverse &
Longitudinal
No
273
2x2.85
2x2.71
8
1
600
3.0
1
Tr ansverse &
Longitudinal
No
200
2x3.77
2x3.54
9
0.5
1000
5
1
Longitudinal
Yes
200
2x6.28
2x5.89
NOTES: 1. If the equipment contains a voltage-limiting device or a current-limiting device, tests 1, 2 and 3 are repeated at a level just below
the thresholds of the limiting devices.
2. Test 5 uses a special circuit with transformer coupled a.c. and capacitive feed.
3. Tests 1 through 5 are requirements and the equipment shall not be damaged after these tests.
4. Tests 6 through 9 are desirable objectives and the equipment can be damaged after these tests.
`1089 Section 4.5.13 - Second-Level Power Fault Testing for Central Office Equipment
Table 5 shows the nine tests used for this section. The TISP61089B will survive these peak current values as they are lower than the
TISP61089B current-time ratings.
Table 5. First-Level Power Fault Currents
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
`1089 Section 4.5.15 - Second-Level Power Fault Testing for Equipment Located on the Customer Premise
This test, Table 7, is for network equipment located on the customer premises. The purpose is to ensure that the feed wiring does not become
a hazard due to excessive current. This testing is similar to the Section 4.5.11 testing. If the equipment is directly wired, the wiring simulator
described in Section 4.5.11 is replaced by a one-foot section of 26 AWG wrapped in cheesecloth. The equipment fails if an open circuit occurs
or the cheesecloth is damaged.
Table 7 shows the test conditions for this section. Columns 7 and 8 show the prospective currents using R
S
values of 25 and 40 . For the
TISP61089B to survive, the series overcurrent protection to operate before the TISP61089B current-time ratings are exceeded.
Table 7. Customer Premise Wiring Simulator Testing
Table 6. Second-Level Power Fault Currents
AC Duration
s
Open-circuit
RMS Voltage
V
Short-circuit
RMS Current
A
Test
Connections
Primary
Fitted
Source
Resistance
TISP61089B I
TM
A (peak)
R
s
= 25
R
s
= 40
900
0 to 600
0 to 30
Transverse & Longitudinal
No
20
0 to 2x 19
0 to 2x 14
NOTE:
1. If the equipment interrupts the current before the 600 V rms level is reached, a second piece of equipment is tested. The second
piece of equipment shall withstand 600 V rms applied for 900 s without causing a hazard.
`1089 Section 4.5.16 - Second-Level Intra-Building Power Fault Testing for Equipment Located on the Customer Premise
This test, Table 8, is for network equipment ports that do not serve outside lines. For standard plugable premise wiring, the wiring simulator
fuse shall be used for testing. Where direct wiring occurs, the simulator shall consist of a length of the wire used wrapped in cheesecloth. The
equipment fails if a hazard occurs or a wiring simulator open circuit occurs or the cheesecloth is damaged.
Table 8. Second-Level Power Fault Currents
Test
#
AC Duration
s
Open-circuit
RMS Voltage
V
Short-circuit
RMS Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Source
Resistance
TISP61089B I
TM
A (peak)
R
s
= 8
R
s
= 25
R
s
= 40
1
900
120
25
1
Transverse &
Longitudinal
No
5
2x13
2x5.7
2x3.8
NOTE:
1. If the equipment contains a voltage-limiting device or a current-limiting device, these tests are repeated at a level just below the
thresholds of the limiting devices.
`1089 Section 4.5.13 - Second-Level Power Fault Testing for Central Office Equipment (Continued)
Test
#
AC Duration
s
Open-circuit
RMS Voltage
V
Short-circuit
RMS Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Source
Resistance
TISP61089B I
TM
A (peak)
R
s
= 25
R
s
= 40
1
900
120
277
25
1
1
Transverse &
Longitudinal
No
5
11
2x5.7
2x11
2x3.8
2x7.7
2
5
600
60
1
Transverse &
Longitudinal
No
10
2x24
2x17
3
5
600
7
1
Transverse &
Longitudinal
No
86
2x7.7
2x6.8
4
900
100 to
600
0.37 to
2.2
Transverse &
Longitudinal
No
270
2x2.9
2x2.7
5
900
600
0.09
60
Differential
No
Capacitive
2x0.09
2x0.09
NOTES: 1. If the equipment contains a voltage-limiting device or a current-limiting device, these tests are repeated at a level just below the
thresholds of the limiting devices.
2. Test 5 uses a special circuit with transformer coupled a.c. and capacitive feed.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
`1089 Section 4.5.16 (Continued)
Dedicated intra-building ports may use an R
S
value of 8 . The 8 value limits the initial current to 13 A, which is within the TISP61089B
single cycle rating. For the TISP61089B to survive the full 900 s test, the series overcurrent protection to operate before the TISP61089B
current-time ratings are exceeded.
Overcurrent and Overvoltage Protection Coordination
To meet `1089, the overcurrent protection must be coordinated with the requirements of Sections 4.5.7, 4.5.8, 4.5.9, 4.5.12, 4.5.13, 4.5.15 and
the TISP61089B. The overcurrent protection must not fail in the first-level tests of Sections 4.5.7, 4.5.9 and 4.5.12 (tests 1 through 5). Test 6
through 9 of Section 4.5.12 are not requirements. The test current levels and their duration are shown in Figure 18. First-level tests have a high
source resistance and the current levels are not strongly dependent on the TISP61089B series resistor value.
Second-level tests have a low source resistance and the current levels are dependent on the TISP61089B R
S
resistor value. The two stepped
lines at the top of Figure 18 are for the 25 and 40 series resistor cases. The unacceptable current region (Section 4.5.11) is also shown in
Figure 18. If current flows for the full second-level test time, the unacceptable current region will be entered. The series overcurrent protector
must operate before the unacceptable region is reached.
Figure 18. `1089 Test Current Levels
MAXIMUM RMS CURRENT
vs
TIME
Time - s
0.01
0.1
1
10
100
1000
Ma
x
i
m
u
m
R
M
S C
u
r
r
e
n
t
-
A
0.1
0.2
0.3
0.5
0.7
1
2
3
5
7
10
20
30
AI6XAKB
Second Level
Tests, 40
Second Level Tests, 25
First Level
Tests # 1
through 5,
25
& 40
Objective
First Level
Tests # 6
through 9
Unacceptable
Figure 19.
TISP61089B Overlay
PEAK AC
vs
CURRENT DURATION
t -- Current Duration -- s
0.01
0.1
1
10
100
1000
P
eak
50 Hz /
60 Hz Cu
r
r
en
t
--
A
0.15
0.2
0.3
0.4
0.5
0.6
0.8
1.5
2
3
4
5
6
8
15
20
30
40
50
1
10
AI6XDM
Second Level
Tests, 40
Second Level
Tests, 25
Unacceptable
V
GG
= -60 V
First Level
Tests # 1
through 5,
25
& 40
V
GG
= -120 V
Fusible overcurrent protectors cannot operate at first-level current levels. Thus, the permissible low current time-current boundary for fusible
overcurrent protectors is formed by the first-level test currents. Automatically resettable overcurrent protectors (e.g. Positive Temperature
Coefficient Thermistors) may operate during first-level testing, but normal equipment working must be restored after the test has ended.
At system level, the high current boundary is formed by the unacceptable region. However, component and printed wiring, PW, current
limitations will typically lower the high current boundary. Although the series line feed resistance, R
S
, limits the maximum available current in
second-level testing, after about 0.5 s this limitation will exceed the acceptable current flow values.
These three boundaries, first-level, second-level and unacceptable, are replotted in terms of peak current rather than rms current values in
Figure 19. Using a peak current scale allows the TISP61089B longitudinal current rating curves (Figure 3) to be added to Figure 19. Assuming
the PW is sized to adequately carry any currents that may flow, the high current boundary for the overcurrent protector is formed by the
TISP61089B rated current. Note that the TISP61089B rated current curve also depends on the value of gate supply voltage.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Overcurrent and Overvoltage Protection Coordination (Continued)
The overcurrent protector should not allow current-time durations greater than the TISP61089B current ratings, otherwise the TISP61089B
may fail. A satisfactory fusible resistor performance is shown in Figure 20. The line feed resistor (LFR) current-time curve is above the first-level
currents and below the TISP61089B rated current for V
GG
> -100 V. This particular curve is for a Bourns 4B04B-523-400 2 x 40 , 2 %
tolerance, 0.5 % matched resistor module. Fusible resistors are also available with integrated thermal fuses or PTC thermistors. Thermal fuses
will cause a rapid drop in the operating current after about 10 s. Figure 20 shows the fused LFR curve for a Bourns 4B04B-524-400 2 x 40 ,
2 % tolerance, 0.5 % matched resistor module with integrated thermal fuse links. The Bourns 4B04B-524-400 allows the TISP61089B to
operate down to its full rated voltage of V
GG
= -155 V. An LFR with integrated PTC thermistors will give an automatically resettable current
limiting function for all but the highest currents.
Figure 20. Line Feed Resistor - with and without Thermal Fuse
PEAK AC
vs
CURRENT DURATION
t -- Current Duration -- s
0.01
0.1
1
10
100
1000
P
eak
50
Hz /
60 Hz
C
u
rrent
--
A
0.15
0.2
0.3
0.4
0.5
0.6
0.8
1.5
2
3
4
5
6
8
15
20
30
40
50
1
10
AI6XDKA
First Level
Tests # 1
through 5,
25
& 40
Fused LFR
LFR
V
GG
= -60 V
V
GG
= -120 V
Ceramic PTC thermistors are available in suitable ohmic values to be used as the series line feed resistor R
S
. Figure 21 overlays a typical
ceramic PTC thermistor operating characteristic. Some of the first-level tests will cause thermistor operation. Generally, the resistance
matching stability of the two PTC thermistors after power fault switching lightning will meet the required line balance performance.
Ceramic PTC thermistors reduce in resistance value under high voltage conditions. Under high current impulse conditions, the resistance can
be less than 50 % of the d.c. resistance. This means that more current than expected will flow under high voltage impulse conditions. The
manufacturer should be consulted on the 2/10 currents conducted by their product under `1089 conditions. To keep the 2/10 current below
120 A, an increase of the PTC thermistor d.c. resistance value to 50 or more may be needed. In controlled temperature environments, where
the temperature does not drop below freezing, the TISP61089B 2/10 capability is about 170 A, and this would allow a lower value of
resistance.
Generally, polymer PTC thermistors are not available in sufficiently high ohmic values to be used as the only line feed resistance. To meet the
required resistance value, an addition (fixed) series resistance can be used. Figure 22 overlays a typical polymer PTC thermistor operating
characteristic. Compared to ceramic PTC thermistors, the lower thermal mass of the polymer type will generally give a faster current reduction
time than the ceramic type. However, in this case the polymer resistance value is much less than the ceramic value. For the same current level,
the dissipation in the polymer thermistor is much less than the ceramic thermistor. As a result, the polymer thermistor is slower to operate than
the ceramic one.
The resistance stability of polymer PTC thermistors is not as good as ceramic ones. However, the thermistor resistance change will be diluted
by additional series resistance. If an SLIC with adaptive line balance is used, thermistor resistance stability may not be a problem. Polymer
PTC thermistors do not have a resistance decrease under high voltage conditions.
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
Overcurrent and Overvoltage Protection Coordination (Continued)
Figure 21. Ceramic PTC Thermistor
PEAK AC
vs
CURRENT DURATION
t -- Current Duration -- s
0.01
0.1
1
10
100
1000
P
eak
50 Hz /
60 Hz
C
u
rrent
--
A
0.15
0.2
0.3
0.4
0.5
0.6
0.8
1.5
2
3
4
5
6
8
15
20
30
40
50
1
10
AI6XDIA
Ceramic PTC
Thermistor
First Level
Tests # 1
through 5,
25
& 40
V
GG
= -60 V
V
GG
= -120 V
Figure 22. Polymer PTC Thermistor
PEAK AC
vs
CURRENT DURATION
t -- Current Duration -- s
0.01
0.1
1
10
100
1000
P
eak
50 Hz /
60 Hz
C
u
rrent
--
A
0.15
0.2
0.3
0.4
0.5
0.6
0.8
1.5
2
3
4
5
6
8
15
20
30
40
50
1
10
AI6XDJA
Polymer PTC
Thermistor
First Level
Tests # 1
through 5,
25
& 40
V
GG
= -60 V
V
= -120 V
GG
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as below.
Device
Symbolization
Code
TISP61089B
61089B
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
D008 Plastic Small-Outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0.15 (0.006).
D. Lead tips to be planar within
0.051 (0.002).
MDXXAAE
5. 80 - 6. 20
(0.228 - 0.244)
4. 80 - 5. 00
(0.189 - 0. 19 7)
D008
8
7
6
5
4
3
2
1
3. 81 - 4. 00
(0.150 - 0.157)
7
NOM
3 Places
7 NOM
4 P laces
4 4
0. 28 - 0.79
(0.011 - 0. 03 1)
0. 10 2 - 0.203
(0.004 - 0.008)
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
x 45 NOM
0. 19 0 - 0.229
(0.0075 - 0. 00 90)
INDEX
Pin Spacing
1. 27
(0.050)
(see Note A)
6 P la ces
1. 35 - 1.75
(0.053 - 0.069)
0. 36 - 0.51
(0.014 - 0.020)
8 Places
0. 51 - 1.12
(0.020 - 0.044)
0. 25 - 0.50
(0.010 - 0.020)
4. 60 - 5.21
(0.181 - 0.205)
DIMENSIONS ARE:
MILLIMETERS
(INCHES)
OCTOBER 2000 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089B High Voltage Ringing SLIC Protector
D008 - Tape Dimensions
D008 Package (8-pin Small Outline) Single-Sprocket Tape
7. 90 - 8.10
(.311 - .319)
3. 90 - 4.10
(.154 - .161 )
1. 95 - 2.05
(.077 - .081)
1. 50 - 1.60
(.059 - .063 )
5. 40 - 5.60
(.213 - .220 )
11 .70 - 12.30
(.461 - .484 )
0 MIN .
6. 30 - 6. 50
(.248 - .256)
0. 40
(.016)
2. 0 - 2.2
(.079 - .087 )
Direction of Feed
Carrier Tape
Embossment
Cover
Tape
NOTES: A. Ta ped devices are supplied on a reel of the following dimensions:
Reel diameter:
Reel hub diameter:
Reel axial hole:
B. 2500 devices are on a reel.
MDXXATC
MIN .
1. 5
(.059)
MIN .
0. 8
(.0 3)
33 0 +0. 0/-4.0
(12.99 + 0.0 /-.1 57)
13.0 0.2
(.512 .008)
10 0 2.0
(3.937 .079)
DIMENSIONS ARE:
MILLIMETERS
(INCHES)
"TISP" is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
"Bourns" is a registered trademark of Bourns, Inc. in the U.S. and other countries.
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