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Электронный компонент: FZ1200R33KF2-B5

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Technische Information / Technical Information
IGBT-Module
IGBT-Modules
FZ 1200 R 33 KF2_B5
vorlufige Daten
preliminary data
Hchstzulssige Werte / Maximum rated values
Elektrische Eigenschaften / Electrical properties
Kollektor-Emitter-Sperrspannung
T
vj
= 25C
V
CES
3300
V
collector-emitter voltage
T
vj
= -25C
V
CES
3300
V
Kollektor-Dauergleichstrom
T
C
= 80C
I
C,nom.
1200
A
DC-collector current
T
C
= 25 C
I
C
2000
A
Periodischer Kollektor Spitzenstrom
repetitive peak collector current
t
P
= 1 ms, T
C
= 80C
I
CRM
2400
A
Gesamt-Verlustleistung
total power dissipation
T
C
=25C, Transistor
P
tot
14,7
kW
Gate-Emitter-Spitzenspannung
gate-emitter peak voltage
V
GES
+/- 20V
V
Dauergleichstrom
DC forward current
I
F
1200
A
Periodischer Spitzenstrom
repetitive peak forw. current
t
P
= 1 ms
I
FRM
2400
A
Grenzlastintegral der Diode
I
2
t - value, Diode
V
R
= 0V, t
p
= 10ms, T
vj
= 125C
I
2
t
k A
2
s
Spitzenverlustleistung der Diode
maximum power dissipation diode
T
vj
= 125C
P
RQM
1200
kW
Isolations-Prfspannung
insulation test voltage
RMS, f = 50 Hz, t = 1 min.
V
ISOL
10,2
kV
Teilentladungs-Aussetzspannung
partial discharge extinction voltage
RMS, f = 50 Hz, Q
PD
typ. 10pC (acc. To IEC 1287)
V
ISOL
5,1
kV
Charakteristische Werte / Characteristic values
Transistor / Transistor
min.
typ.
max.
Kollektor-Emitter Sttigungsspannung
I
C
= 1200A, V
GE
= 15V, T
vj
= 25C
V
CE sat
-
3,40
4,25
V
collector-emitter saturation voltage
I
C
= 1200A, V
GE
= 15V, T
vj
= 125C
-
4,30
5,00
V
Gate-Schwellenspannung
gate threshold voltage
I
C
= 120 mA, V
CE
= V
GE
, T
vj
= 25C
V
GE(th)
4,2
5,1
6,0
V
Eingangskapazitt
input capacitance
f = 1MHz, T
vj
= 25C, V
CE
= 25V, V
GE
= 0V
C
ies
-
150
-
nF
Rckwirkungskapazitt
reverse transfer capacitance
f = 1MHz, T
vj
= 25C, V
CE
= 25V, V
GE
= 0V
C
res
-
8
-
nF
Gateladung
gate charge
V
GE
= -15V ... + 15V
Q
G
-
22
-
C
Kollektor-Emitter Reststrom
collector-emitter cut-off current
Gate-Emitter Reststrom
gate-emitter leakage current
V
CE
= 0V, V
GE
= 20V, T
vj
= 25C
I
GES
-
-
400
nA
prepared by: Alfons Wiesenthal
date of publication : 2002-10-31
approved by: Christoph Lbke
revision: 2.0
444
5
mA
V
CE
= 3300V, V
GE
= 0V, T
vj
= 25C
I
CES
-
-
1 (9)
DB_FZ1200R33KF2 B5_2.0.xls
background image
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
FZ 1200 R 33 KF2_B5
vorlufige Daten
preliminary data
Charakteristische Werte / Characteristic values
Transistor / Transistor
min.
typ.
max.
Einschaltverzgerungszeit (ind. Last)
I
C
= 1200 A, V
CE
= 1800V
turn on delay time (inductive load)
V
GE
= 15V, R
G
= 2,7
, C
GE
= 220nF, T
vj
= 25C
t
d,on
-
0,70
-
s
V
GE
= 15V, R
G
= 2,7
, C
GE
= 220nF, T
vj
= 125C
-
0,65
-
s
Anstiegszeit (induktive Last)
I
C
= 1200 A, V
CE
= 1800V
rise time (inductive load)
V
GE
= 15V, R
G
= 2,7
, C
GE
= 220nF, T
vj
= 25C
t
r
-
0,45
-
s
V
GE
= 15V, R
G
= 2,7
, C
GE
= 220nF, T
vj
= 125C
-
0,48
-
s
Abschaltverzgerungszeit (ind. Last)
I
C
= 1200 A, V
CE
= 1800V
turn off delay time (inductive load)
V
GE
= 15V, R
G
= 1,8
, C
GE
= 220nF, T
vj
= 25C
t
d,off
-
1,90
-
s
V
GE
= 15V, R
G
= 1,8
, C
GE
= 220nF, T
vj
= 125C
-
2,10
-
s
Fallzeit (induktive Last)
I
C
= 1200 A, V
CE
= 1800V
fall time (inductive load)
V
GE
= 15V, R
G
= 1,8
, C
GE
= 220nF, T
vj
= 25C
t
f
-
0,20
-
s
V
GE
= 15V, R
G
= 1,8
, C
GE
= 220nF, T
vj
= 125C
-
0,20
-
s
Einschaltverlustenergie pro Puls
I
C
= 1200 A, V
CE
= 1800V, V
GE
= 15V
turn-on energy loss per pulse
R
G
= 1,5
, C
GE
= 220 nF, T
vj
= 125C, L
S
= 40nH
E
on
-
2900
-
mWs
Abschaltverlustenergie pro Puls
I
C
= 1200 A, V
CE
= 1800V, V
GE
= 15V
turn-off energy loss per pulse
R
G
= 1,8
, C
GE
= 220 nF, T
vj
= 125C, L
S
= 40nH
E
off
-
1600
-
mWs
Kurzschluverhalten
t
P
10sec, V
GE
15V
SC Data
T
Vj
125C, V
CC
=2500V, V
CEmax
=V
CES
-L
sCE
dI/dt
I
SC
-
6000
-
A
Modulinduktivitt
stray inductance module
L
sCE
-
18
-
nH
Modul-Leitungswiderstand, Anschlsse - Chip
lead resistance, terminals - chip
T
C
= 25C
R
CC'+EE'
-
0,12
-
m
Charakteristische Werte / Characteristic values
Diode / Diode
min.
typ.
max.
Durchlaspannung
I
F
= 1200 A, V
GE
= 0V, T
vj
= 25C
V
F
-
2,80
3,50
V
forward voltage
I
F
= 1200 A, V
GE
= 0V, T
vj
= 125C
-
2,80
3,50
V
Rckstromspitze
I
F
= 1200 A, - di
F
/dt = 4600 A/sec
peak reverse recovery current
V
R
= 1800V, V
GE
= -10V, T
vj
= 25C
I
RM
-
1250
-
A
V
R
= 1800V, V
GE
= -10V, T
vj
= 125C
-
1350
-
A
Sperrverzgerungsladung
I
F
= 1200 A, - di
F
/dt = 4600 A/sec
recovered charge
V
R
= 1800V, V
GE
= -10V, T
vj
= 25C
Q
r
-
710
-
As
V
R
= 1800V, V
GE
= -10V, T
vj
= 125C
-
1320
-
As
Abschaltenergie pro Puls
I
F
= 1200 A, - di
F
/dt = 4600 A/sec
reverse recovery energy
V
R
= 1800V, V
GE
= -10V, T
vj
= 25C
E
rec
-
680
-
mWs
V
R
= 1800V, V
GE
= -10V, T
vj
= 125C
-
1400
-
mWs
2 (9)
DB_FZ1200R33KF2 B5_2.0.xls
background image
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
FZ 1200 R 33 KF2_B5
vorlufige Daten
preliminary data
Thermische Eigenschaften / Thermal properties
min.
typ.
max.
Innerer Wrmewiderstand
Transistor / transistor, DC
R
thJC
-
-
0,0085
K/W
thermal resistance, junction to case
Diode/Diode, DC
-
-
0,0170
K/W
bergangs-Wrmewiderstand
thermal resistance, case to heatsink
pro Modul / per module
Paste
= 1 W/m*K /
grease
= 1 W/m*K
R
thCK
-
0,006
-
K/W
Hchstzulssige Sperrschichttemperatur
maximum junction temperature
T
vj max
-
-
150
C
Betriebstemperatur
operation temperature
T
vj op
-40
-
125
C
Lagertemperatur
storage temperature
T
stg
-40
-
125
C
Mechanische Eigenschaften / Mechanical properties
Gehuse, siehe Anlage
case, see appendix
Material Modulgrundplatte
material of module baseplate
AlSiC
Innere Isolation
internal insulation
AlN
Kriechstrecke
creepage distance
56
mm
Luftstrecke
clearance
26
mm
CTI
comperative tracking index
> 600
Anzugsdrehmoment f. mech. Befestigung
mounting torque
Anzugsdrehmoment f. elektr. Anschlsse
Anschlsse / terminals M4
M
1,8
2,1
Nm
terminal connection torque
Anschlsse / terminals M8
M
8
10
Nm
Gewicht
weight
G
1400
g
Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert.
Sie gilt in Verbindung mit den zugehrigen Technischen Erluterungen.
This technical information specifies semiconductor devices but promises no characteristics. It is
valid in combination with the belonging technical notes.
5,75
Nm
Schraube M6 / screw M6
M
4,25
-
3 (9)
DB_FZ1200R33KF2 B5_2.0.xls
background image
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
FZ 1200 R 33 KF2_B5
vorlufige Daten
preliminary data
I
C
[A
]
V
CE
[V]
I
C
[A
]
V
CE
[V]
0
400
800
1200
1600
2000
2400
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
4,0
4,5
5,0
5,5
6,0
6,5
7,0
Tvj = 25C
Tvj = 125C
Ausgangskennlinie (typisch) I
C
= f (V
CE
)
Output characteristic (typical)
V
GE
= 15V
0
400
800
1200
1600
2000
2400
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
4,0
4,5
5,0
5,5
6,0
6,5
7,0
VGE = 8V
VGE = 9V
VGE = 10V
VGE = 12V
VGE = 15V
VGE = 20V
Ausgangskennlinienfeld (typisch) I
C
= f (V
CE
)
Output characteristic (typical)
T
vj
= 125C
4 (9)
DB_FZ1200R33KF2 B5_2.0.xls
background image
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
FZ 1200 R 33 KF2_B5
vorlufige Daten
preliminary data
I
C
[A
]
V
GE
[V]
I
F
[A
]
V
F
[V]
0
400
800
1200
1600
2000
2400
5
6
7
8
9
10
11
12
13
Tvj = 25C
Tvj = 125C
bertragungscharakteristik (typisch) I
C
= f (V
GE
)
Transfer characteristic (typical)
V
CE
= 20V
0
400
800
1200
1600
2000
2400
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
4,0
Tvj = 25C
Tvj = 125C
Durchlakennlinie der Inversdiode (typisch) I
F
= f (V
F
)
Forward characteristic of inverse diode (typical)
5 (9)
DB_FZ1200R33KF2 B5_2.0.xls