Excelics
EPA720A
DATA SHEET
High Efficiency Heterojunction Power FET
+37.5dBm TYPICAL OUTPUT POWER
19.0dB TYPICAL POWER GAIN AT 2GHz
0.4 X 7200 MICRON RECESSED
"MUSHROOM" GATE
Si
3
N
4
PASSIVATION
ADVANCED EPITAXIAL
HETEROJUNCTION
PROFILE PROVIDES EXTRA HIGH POWER
EFFICIENCY, AND HIGH RELIABILITY
Idss SORTED IN 180mA PER BIN RANGE
ELECTRICAL CHARACTERISTICS (T
a
= 25
O
C)
SYMBOLS PARAMETERS/TEST
CONDITIONS MIN
TYP
MAX
UNIT
P
1dB
Output Power at 1dB Compression f= 2GHz
Vds=8V, Ids=50% Idss f= 4GHz
36.0 37.5
37.5
dBm
G
1dB
Gain at 1dB Compression f= 2GHz
Vds=8V, Ids=50% Idss f= 4GHz
17.5 19.0
14.0
dB
PAE
Power Added Efficiency at 1dB Compression
Vds=8V, Ids=50% Idss f=2GHz
52
%
Idss
Saturated Drain Current Vds=3V, Vgs=0V
1320
2160
2820
mA
Gm
Transconductance Vds=3V, Vgs=0V
1440
2280
mS
Vp
Pinch-off Voltage Vds=3V, Ids=22mA
-1.0
-2.5
V
BVgd
Drain Breakdown Voltage Igd=7.2mA
-11
-15
V
BVgs
Source Breakdown Voltage Igs=7.2mA
-7
-14
V
Rth
Thermal Resistance (Au-Sn Eutectic Attach)
6
o
C/W
MAXIMUM RATINGS AT 25
O
C
SYMBOLS PARAMETERS ABSOLUTE
1
CONTINUOUS
2
Vds
Drain-Source Voltage
12V
8V
Vgs
Gate-Source Voltage
-8V
-3V
Ids
Drain Current
Idss
1.6A
Igsf
Forward Gate Current
360mA
60mA
Pin
Input Power
35dBm
@ 3dB Compression
Tch
Channel Temperature
175
o
C
150
o
C
Tstg
Storage Temperature
-65/175
o
C
-65/150
o
C
Pt
Total Power Dissipation
23 W
19 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
Chip Thickness: 50
10 microns
(with > 20 microns Gold Plated Heat Sink (PHS) )
All Dimensions In Microns
'
'
'
*
*
*
6
6
6
6
EPA720A
DATA SHEET
High Efficiency Heterojunction Power FET
S-PARAMETERS
8V, 1/2 Idss
FREQ --- S11 --- --- S21 --- --- S12 --- --- S22 ---
(GHz) MAG ANG MAG ANG MAG ANG MAG ANG
0.500 0.947 -146.8 11.090 102.6 0.016 22.4 0.501 -168.2
1.000 0.944 -164.2 5.705 90.6 0.017 20.3 0.520 -172.3
1.500 0.944 -170.7 3.808 83.9 0.017 23.5 0.531 -173.1
2.000 0.944 -174.4 2.844 78.6 0.018 28.1 0.542 -173.3
2.500 0.945 -176.9 2.259 74.0 0.019 33.2 0.555 -173.4
3.000 0.945 -178.8 1.865 69.7 0.020 38.3 0.570 -173.5
3.500 0.946 179.5 1.582 65.7 0.021 43.3 0.586 -173.7
4.000 0.947 178.1 1.367 61.9 0.022 47.9 0.603 -174.2
4.500 0.948 176.8 1.199 58.3 0.024 52.1 0.621 -174.8
5.000 0.949 175.6 1.064 54.9 0.026 55.6 0.639 -175.6
5.500 0.951 174.5 0.952 51.6 0.028 58.6 0.657 -176.6
6.000 0.952 173.4 0.859 48.5 0.031 61.1 0.674 -177.7
6.500 0.953 172.3 0.780 45.5 0.033 63.0 0.691 -178.9
7.000 0.954 171.3 0.712 42.7 0.036 64.5 0.708 179.8
7.500 0.955 170.3 0.653 40.1 0.039 65.5 0.724 178.4
8.000 0.956 169.3 0.601 37.6 0.042 66.3 0.739 176.9
8.500 0.957 168.3 0.556 35.3 0.045 66.8 0.753 175.4
9.000 0.958 167.3 0.516 33.2 0.048 67.0 0.767 173.9
9.500 0.959 166.3 0.481 31.2 0.052 67.0 0.780 172.3
10.000 0.960 165.4 0.449 29.3 0.055 66.8 0.792 170.7
Note: The data included 0.7 mils diameter Au bonding wires:
3 gate wires, 20 mils each; 3 drain wires, 12 mils each; 8 source wires, 7 mils each.
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