Excelics
EPA960B
PRELIMINARY DATA SHEET
High Efficiency Heterojunction Power FET
+38.5dBm TYPICAL OUTPUT POWER
18.5dB TYPICAL POWER GAIN AT 2GHz
0.5 X 9600 MICRON RECESSED
"MUSHROOM" GATE
Si
3
N
4
PASSIVATION
ADVANCED EPITAXIAL HETEROJUNCTION
PROFILE PROVIDES EXTRA HIGH POWER
EFFICIENCY, AND HIGH RELIABILITY
Idss SORTED IN 240mA PER BIN RANGE
ELECTRICAL CHARACTERISTICS (T
a
= 25
O
C)
SYMBOLS PARAMETERS/TEST
CONDITIONS MIN
TYP
MAX
UNIT
P
1dB
Output Power at 1dB Compression f= 2GHz
Vds=8V, Ids=50% Idss f= 4GHz
37.0 38.5
38.5
dBm
G
1dB
Gain at 1dB Compression f= 2GHz
Vds=8V, Ids=50% Idss f= 4GHz
17.0 18.5
13.5
dB
Idss
Saturated Drain Current Vds=3V, Vgs=0V
1760
2880
3760
mA
Gm
Transconductance Vds=3V, Vgs=0V
1920
3120
mS
Vp
Pinch-off Voltage Vds=3V, Ids=28mA
-1.0
-2.5
V
BVgd
Drain Breakdown Voltage Igd=9.6mA
-11
-15
V
BVgs
Source Breakdown Voltage Igs=9.6mA
-7
-14
V
Rth
Thermal Resistance (Au-Sn Eutectic Attach)
5
o
C/W
MAXIMUM RATINGS AT 25
O
C
SYMBOLS PARAMETERS ABSOLUTE
1
CONTINUOUS
2
Vds
Drain-Source Voltage
12V
8V
Vgs
Gate-Source Voltage
-8V
-3V
Ids
Drain Current
Idss
2.8A
Igsf
Forward Gate Current
480mA
80mA
Pin
Input Power
36dBm
@ 3dB Compression
Tch
Channel Temperature
175
o
C
150
o
C
Tstg
Storage Temperature
-65/175
o
C
-65/150
o
C
Pt
Total Power Dissipation
27 W
23 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
Chip Thickness: 50
10 microns
(with > 20 microns Gold Plated Heat Sink (PHS) )
All Dimensions In Microns
'
'
'
'
*
*
*
*
6
6
6
6
6
EPA960B
PRELIMINARY DATA SHEET
High Efficiency Heterojunction Power FET
S-PARAMETERS
8V, 1/2 Idss
FREQ --- S11 --- --- S21 --- --- S12 --- --- S22 ---
(GHz) MAG ANG MAG ANG MAG ANG MAG ANG
0.500 0.959 -155.9 9.081 98.1 0.013 18.6 0.607 -173.3
1.000 0.957 -168.7 4.601 88.2 0.014 19.1 0.618 -175.4
1.500 0.957 -173.4 3.060 82.3 0.014 23.6 0.626 -175.7
2.000 0.958 -176.1 2.280 77.5 0.015 29.0 0.636 -175.7
2.500 0.958 -177.9 1.807 73.2 0.015 34.7 0.647 -175.6
3.000 0.959 -179.4 1.489 69.1 0.016 40.2 0.659 -175.6
3.500 0.960 179.4 1.260 65.3 0.017 45.4 0.673 -175.8
4.000 0.961 178.4 1.087 61.7 0.019 50.1 0.687 -176.1
4.500 0.961 177.4 0.951 58.3 0.020 54.3 0.702 -176.5
5.000 0.962 176.5 0.842 55.0 0.022 57.8 0.716 -177.1
5.500 0.963 175.6 0.752 52.0 0.024 60.8 0.731 -177.8
6.000 0.964 174.8 0.677 49.1 0.026 63.3 0.746 -178.6
6.500 0.965 174.0 0.614 46.4 0.028 65.2 0.759 -179.5
7.000 0.966 173.2 0.559 43.8 0.030 66.8 0.773 179.6
7.500 0.966 172.4 0.512 41.5 0.033 67.9 0.786 178.5
8.000 0.967 171.7 0.472 39.3 0.035 68.8 0.798 177.4
8.500 0.968 170.9 0.436 37.3 0.038 69.4 0.809 176.3
9.000 0.968 170.2 0.404 35.4 0.040 69.8 0.820 175.1
9.500 0.969 169.4 0.376 33.8 0.043 70.0 0.830 173.9
10.000 0.970 168.7 0.351 32.2 0.046 70.0 0.840 172.7
Note: The data included 0.7 mils diameter Au bonding wires:
4 gate wires, 20 mils each; 4 drain wires, 12 mils each; 10 source wires, 7 mils each.
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