FBI2.5A
4S1
50
FBI2.5B
4S1
100
FBI2.5D
4S1
200
FBI2.5G
4S1
400
FBI2.5J
4S1
600
FBI2.5K
4S1
800
FBI2.5M
4S1
1000
Mounting Instructions
High temperature soldering guaranteed: 260 C 10 sc.
Recommended mounting torque: 8 Kg.cm.
FBI2.5A4S1.......FBI2.5M4S1
2.5 Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
Maximum Ratings, according to IEC publication No. 134
Peak recurrent reverse voltage (V)
Max. Average forward current with heatsink
without heatsink
8.3 ms. peak forward surge current
Rating for fusing ( t<8.3 ms.)
Dielectric strength
(terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range
I
FSM
I
2
t
V
DIS
T
j
T
stg
4.5 A at 65 C
2.5 A at 25 C
100 A
15 A
2
sec
1500 V
55 to + 150 C
55 to +150 C
Voltage
50 to 1000 V.
Current
2.5 A.
V
RRM
I
F(AV)
Plastic
Case
(Jedec Method)
Electrical Characteristics at Tamb = 25C
V
F
Max. forward voltage drop per element at I
F
= 2.5 A
I
R
1.0 V
Max. reverse current per element at V
RRM
5 A
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.
12 C/W
40 C/W
R
th (j-c)
R
th (j-a)
20
4
1
0.5
3.5
+
_
4
4
0.8
+ 0.05
L
suffix
13.5
7
4
Glass Passivated Junction Chips.
UL recognized under component index file
number E130180.
Lead and polarity identifications.
Case: Molded Plastic.
Ideal for printed circuit board (P.C.B.).
The plastic material carries U/L recognition 94 V-O.
Jan - 00
35
70
140
280
420
560
700
Maximum RMS voltage (V)
V
RMS
V
F
, instantaneous forward voltage (V)
0.6
1.0
1.4
0
0.1
1.0
10
Tamb = 25 C
Characteristic Curves
FBI2.5 - 4S1
Tamb, ambient temperature (C)
1
3
4
5
0
50
100
150 175
0
125
25
75
TYPICAL FORWARD CHARACTERISTIC
FORWARD CURRENT DERATING CURVE
2
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
Number of cycles at 60 Hz.
10
100
0
25
50
75
100
1
heatsink
Tc
Tc
sine wave
R-load
on heatsink
+
_
on glass-epoxi substrate
P.C.B.
soldering land 5 mm
sine wave
R-load
free in air
Jan - 00
+
_
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