Mounting Instructions
High temperature soldering guaranteed: 260 C 10 sc.
Recommended mounting torque: 8 Kg.cm.
FBI2B
5S2
100
40
FBI2B5S2.......FBI2M5S2
2. Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
Maximum Ratings, according to IEC publication No. 134
Recurrent peak forward current
10 ms. peak forward surge current
I
2
t value for fusing (t = 10 ms)
Dielectric strength
(terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range
I
FRM
I
FSM
I
2
t
V
DIS
T
j
T
stg
4.5 A at 65 C
2.0 A at 25 C
15 A
100 A
50 A
2
sec
1500 V
40 to + 150 C
40 to +150 C
Electrical Characteristics at Tamb = 25C
V
F
Max. forward voltage drop per element at I
F
=3 A
I
R
1.1 V
Max. reverse current per element at V
RRM
Voltage
100 to 1000 V.
Current
2.0 A.
V
RRM
V
R
I
F(AV)
Peak Recurrent Reverse Voltage (V)
Recommended Input Voltage (V)
Max. Average forward current with heatsink
without heatsink
FBI2D
5S2
200
80
FBI2F
5S2
300
125
FBI2J
5S2
600
250
FBI2L
5S2
900
380
FBI2M
5S2
1000
500
Plastic
Case
5 A
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.
12 C/W
40 C/W
R
th (j-c)
R
th (j-a)
20
5
1
0.5
3.5
+
_
5
5
1.5
1
+ 0.05
1.5
L
suffix
13.5
7
4
Glass Passivated Junction Chips.
UL recognized under component index file
number E130180.
Lead and polarity identifications.
Case: Molded Plastic.
Ideal for printed circuit board (P.C.B.).
The plastic material carries U/L recognition 94 V-O.
Jan - 00
70
V
RMS
Maximum RMS Voltage (V)
140
210
420
630
700
V
F
, instantaneous forward voltage (V)
0.6
1.0
1.4
0
0.1
1.0
10
Tamb = 25 C
Characteristic Curves
FBI2 - 5S2
Tamb, ambient temperature (C)
1
2
3
4
0
50
100
150 175
0
125
25
75
Number of cycles at 50 Hz.
10
100
TYPICAL FORWARD CHARACTERISTIC
FORWARD CURRENT DERATING CURVE
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
1
0
25
50
75
100
4.5
heatsink
Tc
Tc
sine wave
R-load
on heatsink
+
_
on glass-epoxi substrate
P.C.B.
soldering land 5 mm
sine wave
R-load
free in air
Jan - 00
+
_
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