Mounting Instructions
High temperature soldering guaranteed: 260 C 10 sc.
Recommended mounting torque: 8 Kg.cm.
FBI5.1B
1M1
100
40
FBI5.1B1M1.......FBI5.1J1M1
5 Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
Maximum Ratings, according to IEC publication No. 134
Recurrent peak forward current
10 ms. peak forward surge current
I
2
t value for fusing (t = 10 ms)
Dielectric strength
(terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range
I
FRM
I
FSM
I
2
t
V
DIS
T
j
T
stg
5.0 A at 100 C
3.0 A at 25 C
30 A
400 A
800 A
2
sec
1500 V
40 to + 150 C
40 to +150 C
Electrical Characteristics at Tamb = 25C
V
F
Max. forward voltage drop per element at I
F
= 5 A
I
R
1.1 V
Max. reverse current per element at V
RRM
Voltage
100 to 600 V.
Current
5.0 A.
V
RRM
V
R
I
F(AV)
Peak Recurrent Reverse Voltage (V)
Recommended Input Voltage (V)
Max. Average forward current with heatsink
without heatsink
Plastic
Case
5 A
FBI5.1D
1M1
200
80
FBI5.1F
1M1
300
125
FBI5.1J
1M1
600
250
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.
2.2 C/W
22 C/W
R
th (j-c)
R
th (j-a)
25
3.2
7.5
7.5
10
1
0.7
3.5
1
+ 0.05
+
_
L
suffix
17.5
8
4
Glass Passivated Junction Chips.
UL recognized under component index file
number E130180.
Lead and polarity identifications.
Case: Molded Plastic.
Ideal for printed circuit board (P.C.B.).
High surge current capability.
The plastic material carries U/L recognition 94 V-O.
Jan - 00
70
V
RMS
Maximum RMS Voltage (V)
140
210
420
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
Number of cycles at 50 Hz.
10
100
0
100
200
300
400
1
1
3
4
Tamb, ambient temperature (C)
2
0
50
100
150 175
0
125
25
75
FORWARD CURRENT DERATING CURVE
5
V
F
, instantaneous forward voltage (V)
0.6
1.0
1.4
0
0.1
1.0
10
Tamb = 25 C
Characteristic Curves
FBI5.1 - 1M1
TYPICAL FORWARD CHARACTERISTIC
heatsink
Tc
Tc
sine wave
R-load
on heatsink
+
_
on glass-epoxi substrate
P.C.B.
soldering land 5 mm
sine wave
R-load
free in air
Jan - 00
+
_
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