FSS12 ...... FSS16
1 Amp. Surface Mounted Schottky Barrier Rectifier
Metal Silicon Junction, majority carrier conduction
High current capability, low forward voltage drop
Guardring for overvoltage protection
Low power loss, high efficiency
High surge capability
Plastic material carries U/L recognition 94 V-O
Low profile package
Easy pick and place
Dimensions in mm.
Maximum Ratings, according to IEC publication No. 134
Electrical Characteristics at Tamb = 25 C
V
F
Max. forward voltage drop at I
F
= 1.0 A
I
R
0.5 mA
0.55 V
Max. Instantaneous reverse
current at V
RRM
R
thj-a
R
thj-l
Typical Thermal Resistance
88 C/W
28 C/W
Voltage
20 V to 60 V
Current
1.0 A
Ta = 25 C
Ta = 100 C
0.75 V
10 mA
5 mA
NOTE: Thermal Resistance from junction to lead or to ambient PCB mounted with 5x5 mm copper pads areas.
CASE:
SMA/DO-214AC
(Plastic)
Peak recurrent reverse voltage (V)
Maximum RMS voltage (V)
Maximum DC blocking voltage (V)
Maximum average Forward current.
V
RRM
V
RMS
V
DC
I
F (AV)
T
j
T
stg
Operating temperature range
Storage temperature range
65 to + 150 C
I
FSM
8.3 ms. peak forward surge current
FSS12
A1
20
(Jedec Method)
14
20
1 A
40 A
21
30
28
40
35
50
42
60
65 to + 125 C
65 to + 150 C
Marking Code
FSS13
A2
30
FSS14
A3
40
FSS15
A4
50
FSS16
A5
60
Jun - 03
2.0
4.2
Standard soldering pad
1.25
0.25
5.1
0.3
1.25
0.25
Year code
Week code
Type No. Closs
V
F,
instantaneous forward voltage (V)
0 0.2
1.2 1.4 1.6
0
25
50
75 100 125
175
150
T
L
, lead temperature (C)
10
100
MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
TYPICAL JUNCTION CAPACITANCE
V
R,
reverse voltage (V)
1
10
100
Number of cycles at 60 Hz.
TYPICAL FORWARD CHARACTERISTIC
FORWARD CURRENT DERATING CURVE
50
1
FSS1
1.5
1
0.5
0
10
0.1
0.01
50
40
30
20
10
0
400
1
0.1
0.4 0.6 0.8 1.0
100
10
T
j
= 25 C
f = 1.0 MHz
Vsig = 50mVp-p
PULSE WIDTH = 300
s
1% DUTY CYCLE
T
j
= 25 C
FSS12 - FSS14
FSS15 & FSS16
FSS12 - FSS14
FSS12 - FSS14
FSS15 & FSS16
FSS15 & FSS16
RESISTIVE OR
INDUCTIVE LOAD
P.C.B. MOUNTED ON 0.2 x 0.2"
(5.0 x 5.0 mm) COPPER PAD AREAS
Jun - 03
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