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Электронный компонент: 74F245MSA

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April 1988
Revised April 1999
7
4F245
O
c
t
a
l
Bi
dir
ecti
onal
T
r
anscei
ver
w
i
th
3-
ST
A
T
E
O
u
t
put
s
1999 Fairchild Semiconductor Corporation
DS009503.prf
www.fairchildsemi.com
74F245
Octal Bidirectional Transceiver with 3-STATE Outputs
General Description
The 74F245 contains eight non-inverting bidirectional buff-
ers with 3-STATE outputs and is intended for bus-oriented
applications. Current sinking capability is 24 mA at the A
Ports and 64 mA at the B Ports. The Transmit/Receive
(T/R) input determines the direction of data flow through
the bidirectional transceiver. Transmit (active HIGH)
enables data from A Ports to B Ports; Receive (active
LOW) enables data from B Ports to A Ports. The Output
Enable input, when HIGH, disables both A and B Ports by
placing them in a High Z condition.
Features
s
Non-inverting buffers
s
Bidirectional data path
s
A outputs sink 24 mA
s
B outputs sink 64 mA
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number
Package Number
Package Description
74F245SC
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74F245SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74F245MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74F245MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74F245PC
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
www.fairchildsemi.com
2
74F245
Unit Loading/Fan Out
Truth Table
H
=
HIGH Voltage Level
L
=
LOW Voltage Level
X
=
Immaterial
Pin Names
Description
U.L.
Input I
IH
/I
IL
HIGH/LOW
Output I
OH
/I
OL
OE
Output Enable Input (Active LOW)
1.0/2.0
20
A/
-
1.2 mA
T/R
Transmit/Receive Input
1.0/2.0
20
A/
-
1.2 mA
A
0
A
7
Side A Inputs or
3.5/1.083
70
A/
-
0.65 mA
3-STATE Outputs
150/40(38.3)
-
3 mA/24 mA (20 mA)
B
0
B
7
Side B Inputs or
3.5/1.083
70
A/
-
0.65 mA
3-STATE Outputs
600/106.6(80)
-
12 mA/64 mA (48 mA)
Inputs
Output
OE
T/R
L
L
Bus B Data to Bus A
L
H
Bus A Data to Bus B
H
X
High Z State
3
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7
4F245
Absolute Maximum Ratings
(Note 1)
Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Storage Temperature
-
65
C to
+
150
C
Ambient Temperature under Bias
-
55
C to
+
125
C
Junction Temperature under Bias
-
55
C to
+
150
C
V
CC
Pin Potential to Ground Pin
-
0.5V to
+
7.0V
Input Voltage (Note 2)
-
0.5V to
+
7.0V
Input Current (Note 2)
-
30 mA to
+
5.0 mA
Voltage Applied to Output
in HIGH State (with V
CC
=
0V)
Standard Output
-
0.5V to V
CC
3-STATE Output
-
0.5V to
+
5.5V
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
ESD Last Passing Voltage (Min)
4000V
Free Air Ambient Temperature
0
C to
+
70
C
Supply Voltage
+
4.5V to
+
5.5V
Symbol
Parameter
Min
Typ
Max
Units
V
CC
Conditions
V
IH
Input HIGH Voltage
2.0
V
Recognized as a HIGH Signal
V
IL
Input LOW Voltage
0.8
V
Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
-
1.2
V
Min
I
IN
=
-
18 mA
V
OH
Output HIGH Voltage
10% V
CC
2.4
V
Min
I
OH
=
-
3 mA (A
n
)
10% V
CC
2.0
I
OH
=
-
15 mA (B
n
)
5% V
CC
2.7
I
OH
=
-
3 mA (A
n
)
V
OL
Output LOW Voltage
10% V
CC
0.5
V
Min
I
OL
=
24 mA (A
n
)
10% V
CC
0.55
I
OL
=
64 mA (B
n
)
I
IH
Input HIGH Current
5.0
A
Max
V
IN
=
2.7V
I
BVI
Input HIGH Current Breakdown Test
7.0
A
Max
V
IN
=
7.0V (OE, T/R)
I
BVIT
Input HIGH Current Breakdown (I/O)
0.5
mA
Max
V
IN
=
5.5 V (A
n
, B
n
)
I
CEX
Output HIGH Leakage Current
50
A
Max
V
OUT
=
V
CC
(A
n
, B
n
)
V
ID
Input Leakage
4.75
V
0.0
I
ID
=
1.9
A
Test
All Other Pins Grounded
I
OD
Output Leakage
3.75
A
0.0
V
IOD
=
150 mV
Circuit Current
All Other Pins Grounded
I
IL
Input LOW Current
-
1.2
mA
Max
V
IN
=
0.5V (T/R, OE)
I
IH
+
I
OZH
Output Leakage Current
70
A
Max
V
OUT
=
2.7V (A
n
, B
n
)
I
IL
+
I
OZL
Output Leakage Current
-
650
A
Max
V
OUT
=
0.5V (A
n
, B
n
)
I
OS
Output Short-Circuit Current
-
60
-
150
mA
Max
V
OUT
=
0V (A
n
)
-
100
-
225
V
OUT
=
0V (B
n
)
I
ZZ
Bus Drainage Test
500
A
0.0V
V
OUT
=
5.25V(A
n
, B
n
)
I
CCH
Power Supply Current
70
90
mA
Max
V
O
=
HIGH
I
CCL
Power Supply Current
95
120
mA
Max
V
O
=
LOW
I
CCZ
Power Supply Current
85
110
mA
Max
V
O
=
HIGH Z
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4
74F245
AC Electrical Characteristics
Symbol
Parameter
T
A
=
+
25
C
T
A
=
-
55
C to
+
125
C
T
A
=
0
C to
+
70
C
Units
V
CC
=
+
5.0V
C
L
=
50 pF
C
L
=
50 pF
C
L
=
50 pF
Min
Typ
Max
Min
Max
Min
Max
t
PLH
Propagation Delay
2.5
4.2
6.0
2.0
7.5
2.0
7.0
ns
t
PHL
A
n
to B
n
or B
n
to A
n
2.5
4.2
6.0
2.0
7.5
2.0
7.0
t
PZH
Output Enable Time
3.0
5.3
7.0
2.5
9.0
2.5
8.0
t
PZL
3.5
6.0
8.0
3.0
10.0
3.0
9.0
ns
t
PHZ
Output Disable Time
2.0
5.0
6.5
2.0
9.0
2.0
7.5
t
PLZ
2.0
5.0
6.5
2.0
10.0
2.0
7.5
5
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7
4F245
Physical Dimensions
inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
74F245
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
7
www.fairchildsemi.com
7
4F245
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
74F
245
Oct
a
l Bidi
rec
t
i
onal T
r
an
sceive
r
wi
th 3-
S
T
A
T
E O
u
t
puts
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N20A