August 1998
FDC6326L
Integrated Load Switch
General Description
Features
Absolute Maximum Ratings
T
A
= 25C unless otherwise noted
Symbol
Parameter
FDC6326L
Units
V
IN
Input Voltage Range
3 - 20
V
V
ON/OFF
On/Off Voltage Range
2.5 - 8
V
I
L
Load Current - Continuous
(Note 1)
1.8
A
- Pulsed
(Note 1 & 3)
5
P
D
Maximum Power Dissipation
(Note 2)
0.7
W
T
J
,T
STG
Operating and Storage Temperature Range
-55 to 150
C
ESD
Electrostatic Discharge Rating MIL-STD-883D Human Body
Model (100pf/1500Ohm)
6
kV
THERMAL CHARACTERISTICS
R
JA
Thermal Resistance, Junction-to-Ambient
(Note 2)
180
C/W
R
JC
Thermal Resistance, Junction-to-Case
(Note 2)
60
C/W
FDC6326L Rev.D1
This device is particularly suited for compact power
management in portable electronic equipment where 3V to
20V input and 1.8A output current capability are needed.
This load switch integrates a small N-Channel power
MOSFET (Q1) which drives a large P-Channel power
MOSFET (Q2) in one tiny SuperSOT
TM
-6 package.
V
DROP
=0.20V @ V
IN
=12V, I
L
=1.5A.R
DS(ON)
= 0.125
V
DROP
=0.20V @ V
IN
=5V, I
L
=1A.R
DS(ON)
= 0.20
.
SuperSOT
TM
-6 package design using copper lead frame for
superior thermal and electrical capabilities.
I N
O U T
O N / O F F
E Q U I V A L E N T C I R C U I T
V
D R O P
+
-
SOT-23
SuperSOT
TM
-8
SOIC-16
SO-8
SOT-223
SuperSOT
TM
-6
SuperSOT -6
TM
.326
pin
1
S e e A p p l i c a t i o n C i r c u i t
1
5
6
3
2
V i n , R 1
V o u t , C 1
R 2
O N / O F F
R 1 , C 1
Q 2
Q 1
V o u t , C 1
4
1998 Fairchild Semiconductor Corporation
Electrical Characteristics
(T
A
= 25C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
I
FL
Forward Leakage Current
V
IN
= 20 V, V
ON/OFF
= 0 V
1
A
ON CHARACTERISTICS
(Note 3)
V
DROP
Conduction Voltage Drop
V
IN
= 12 V, V
ON/OFF
= 3.3 V, I
L
= 1.5 A
0.15
0.2
V
V
IN
= 5 V, V
ON/OFF
= 3.3 V, I
L
= 1 A
0.14
0.2
R
DS(ON)
Q
2
- Static On-Resistance
V
GS
= -12 V, I
D
= -1.9 A
0.095
0.125
V
GS
= -5 V, I
D
= -1.5 A
0.14
0.2
I
L
Load Current
V
DROP
= 0.125 V, V
IN
= 12 V, V
ON/OFF
= 3.3 V
1
A
V
DROP
= 0.20 V, V
IN
= 5 V, V
ON/OFF
= 3.3 V
1
Notes:
1. V
IN
=20V, V
ON/OFF
=8V, T
A
=25
o
C
2.
R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. R
JC
is guaranteed by design while R
CA
is determined by the user's board design.
3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%.
FDC6326L Load Switch Application
External Component Recommendation
First select R2, 100 - 1k
, for Slew Rate control.
C1
1000pF can be added in addition to R2 for further In-rush current control.
Then select R1 such that R1/R2 ratio maintains between 10 - 100. R1 is required to turn Q2 off.
For SPICE simulation, users can download a "FDC6326L.MOD" Spice model from Fairchild Web Site at
www.fairchildsemi.com
FDC6326L Rev.D1
APPLICATION CIRCUIT
IN
OUT
ON/OFF
R1
R2
C1
LOAD
Co
Q2
Q1
Ci
FDC6326L Rev.D1
Typical Electrical Characteristics
(T
A
= 25
O
C unless otherwise noted )
0
1
2
3
4
0
0.1
0.2
0.3
0.4
0.5
I ,(A)
V , (V)
DROP
T = 125C
A
L
T =25C
A
V =12V
V = 1.5 - 8V
PW =300us, D
2%
ON/OFF
IN
0
1
2
3
4
0
0.1
0.2
0.3
0.4
0.5
I ,(A)
V , (V)
DROP
T = 125C
A
L
T =25C
A
V =5V
V = 1.5 - 8V
PW =300us, D
2%
ON/OFF
IN
2
4
6
8
10
12
0
0.1
0.2
0.3
0.4
0.5
0.6
V ,(V)
V ,(V) / R (Ohm)
IN
T = 25C
A
T =125C
A
DROP
I = 1A
V = 1.5 - 8V
PW =300us, D
2%
ON/OFF
L
ON
Figure 4. Transient Thermal Response Curve.
Thermal characterization performed on the conditions described in Note 2.
0.00001
0.0001
0.001
0.01
0.1
1
10
100
300
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
t , TIME (sec)
TRANSIENT THERMAL RESISTANCE
1
Single Pulse
D = 0.5
0.1
0.05
0.02
0.01
0.2
Duty Cycle, D = t / t
1
2
R (t) = r(t) * R
R = See Note 2
JA
JA
JA
T - T = P * R (t)
JA
A
J
P(pk)
t
1
t
2
r(t), NORMALIZED EFFECTIVE
Figure 1. Conduction Voltage Drop
Variation with Load Current.
Figure 2. Conduction Voltage Drop
Variation with Load Current.
Figure 3. On-Resistance Variation
with Input Voltage.
1998 Fairchild Semiconductor Corporation
9/98 Rev A
SuperSOT
TM
-6 (FS PKG Code 31, 33)
1 : 1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.0158
TRADEMARKS
ACExTM
CoolFETTM
CROSSVOLTTM
E
2
CMOS
TM
FACTTM
FACT Quiet SeriesTM
FAST
FASTrTM
GTOTM
HiSeCTM
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
ISOPLANARTM
MICROWIRETM
POPTM
PowerTrenchTM
QSTM
Quite SeriesTM
SuperSOTTM-3
SuperSOTTM-6
SuperSOTTM-8
TinyLogicTM
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The data sheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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