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FDC6330L
FDC6330L Rev. C
FDC6330L
Integrated Load Switch
General Description
This device is particularly suited for compact power
management in portable electronic equipment where 3V
to 20V input and 2.3A output current capability are needed.
This load switch integrates a small N-Channel power
MOSFET (Q1) which drives a large P-Channel power
MOSFET (Q2) in one tiny SuperSOT
TM
-6 package.
February 1999
Features
V
DROP
= 0.2V @ V
IN
= 12V, I
L
=2.5 A. R
(ON)
= 0.08
V
DROP
= 0.2V @ V
IN
= 5V,I
L
= 1.6 A. R
(ON)
= 0.125
.
Control MOSFET (Q1) includes Zener protection for
ESD ruggedness (>6kV Human Body Model).
High performance PowerTrench
TM
technology for
extremely low on-resistance.
SuperSOT
TM
-6 package design using copper lead frame
for superior thermal and electrical capabilities.
1999 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
Ratings
Units
V
IN
Input Voltage Range
(Note 1)
3 - 20
V
V
ON/OFF
On/Off Voltage Range
1.5 - 8
V
I
D
Load Current
- Continuous
(Note 2)
2.3
A
- Pulsed
10
P
D
Maximum Power Dissipation
(Note 1)
0.7
W
T
J
, T
stg
Operating and Storage Temperature Range
-55 to +150
C
ESD
Electrostatic Discharge Rating MIL-STD-883D
Human-Body-Model (100pf/1500 Ohm)
6
kV
Thermal Characteristics
R
JA
Thermal Resistance, Junction-to-Ambient
(Note 2)
180
C/W
R
JC
Thermal Resistance, Junction-to-Case
(Note 2)
60
C/W
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
.
330 (
.
Denotes pin 1)
FDC6330L
7''
8mm
3000 units
Applications
Power management
Load actuation
See Application Circuit
1
5
6
3
2
Vin,R1
Vout,C1
R2
ON/OFF
R1,C1
Q2
Q1
4
Vout,C1
IN
OUT
ON/ OFF
EQUIVALENT CIRCUIT
V
DR OP
+
-
SuperSOT -6
TM
FDC6330L
FDC6330L Rev. C
Electrical Characteristics
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
OFF Characteristics
I
FL
Leakage Current
V
IN
= 20 V, V
ON/OFF
= 250
A
1
A
ON Characteristics
(Note 3)
V
IN
= 12 V, V
ON/OFF
= 3.3 V, I
L
= 2.5 A
0.2
V
V
DROP
Conduction Voltage
V
IN
= 5 V, V
ON/OFF
= 3.3 V, I
L
= 1.6 A
0.2
V
R
(ON)
Q
2
- Static On-Resistance
V
GS
= -12 V, I
D
= -2.3 A
V
GS
= -5 V, I
D
= -1.9 A
0.054
0.081
0.08
0.125
V
DROP
= 0.2 V, V
IN
= 12 V, V
ON/OFF
= 3.3 V
2.5
I
L
Load Current
V
DROP
= 0.2 V, V
IN
= 5 V, V
ON/OFF
= 3.3 V
1.6
A
Notes:
1. Range of V
in
can be up to 30V, but R
1
and R
2
must be scaled such that V
GS
of Q2 does not exceed 20V.
2. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R
JC
is guaranteed by design while R
JA
is determined by the user's board design.
3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%.
FDC6330L Load Switch Application
External Component Recommendation:
For applications where Co
1
F.
For slew rate control, select R2 in the range of 1k - 4.7k
.
For additional in-rush current control,C1
1000pF can be added.
Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.
FDC6330L
FDC6330L Rev. C
Figure 1. Conduction Voltage Drop
Variation with Load Current.
Figure 2. Conduction Voltage Drop
Variation with Load Current.
Figure 3. On-Resistance Variation
with Input Voltage.
Typical Characteristics
(continued)
Figure 4.Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 2.
Transient themal response will change depending on the circuit board design.
0
1
2
3
4
5
0
0.1
0.2
0.3
0.4
0.5
I , (A)
V
(
V
)
DR
O
P
L
V = 5V
V = 1. 5 - 8 V
PW =300 us, D
2%
ON/OF F
IN
T = 125C
J
T = 25 C
J
0
1
2
3
4
5
0
0.1
0.2
0.3
0.4
I , (A)
V
(
V
)
DR
O
P
L
V = 12 V
V = 1. 5 - 8 V
PW =300 us, D
2%
ON/OF F
IN
T = 125C
J
T = 25 C
J
2
4
6
8
10
12
0
0.05
0.1
0.15
0.2
0.25
V , (V)
R
,
(
O
h
m
)
I N
I = 1 A
V = 1.5 - 8 V
PW =3 00 us, D
2%
ON/OFF
L
(O
N
)
T = 1 25C
J
T = 25 C
J
0.0001
0.001
0.01
0.1
1
10
100
300
0.01
0.02
0.05
0.1
0.2
0.5
1
t , TIME (sec)
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
E
SI
ST
A
N
C
E
1
Single Pulse
D = 0.5
0.1
0.05
0.02
0.01
0.2
r(
t
)
,
NO
RM
ALI
ZE
D EF
FE
C
T
I
V
E
Duty Cycle, D = t / t
1
2
T - T = P * R (t)
JA
A
J
P(pk)
t
1
t
2
R (t) = r(t) * R
R =180C/W
JA
JA
JA
1998 Fairchild Semiconductor Corporation
SSOT-6 Unit Orientation
Conductive Embossed
Carrier Tape
F63TNR
Label
Customize Label
Antistatic Cover Tape
SSOT-6 Packaging
Configuration: Figure 1.0
Components
Leader Tape
390mm minimum
Trailer Tape
160mm minimum
SSOT-6 Tape Leader
Trailer
Configuration: Figure 2.0
Cover Tape
Carrier
Pin 1
Tape
Note/Comments
Packaging Option
SSOT-6 Packaging Information
Standard
(no flow code)
D87Z
Packaging type
Reel Size
TNR
7" Dia
TNR
13"
Qty per Reel/Tube/Bag
3,000
10,000
Box Dimension (mm)
184x187x47
343x343x64
Max qty per Box
9,000
20,000
Weight per unit (gm)
0.0158
0.0158
Weight per Reel (kg)
0.1440
0.4700
184mm x 184mm x 47mm
Pizza Box for Standard Option
F63TNR
Label
F63TNR Label
F63TNR Label sample
343mm x 342mm x 64mm
Intermediate box for D87Z Option
631
631
631
631
LOT: CBVK741B019
FSID: FDC633N
D/C1: D9842
QTY1:
SPEC REV: QARV:
SPEC:
QTY: 3000
D/C2:
QTY2:
CPN:
(F63TNR)2
F63TNR
Label
SuperSOT
TM
-6 Tape and Reel Data and Package Dimensions
December 1998, Rev. B
P1
A0
D1
P0
F
W
E1
D0
E2
B0
Tc
Wc
K0
T
Dimensions are in inches and millimeters
Tape Size
Reel
Option
Dim A
Dim B
Dim C
Dim D
Dim N
Dim W1
Dim W2
Dim W3 (LSL-USL)
8mm
7" Dia
7.00
177.8
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
2.165
55
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 0.429
7.9 10.9
8mm
13" Dia
13.00
330
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
4.00
100
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 0.429
7.9 10.9
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
SSOT-6 Embossed Carrier Tape
Configuration: Figure 3.0
SSOT-6 Reel Configuration: Figure 4.0
Dimensions are in millimeter
Pkg type
A0
B0
W
D0
D1
E1
E2
F
P1
P0
K0
T
Wc
Tc
SSOT-6
(8mm)
3.23
+/-0.10
3.18
+/-0.10
8.0
+/-0.3
1.55
+/-0.05
1.00
+/-0.125
1.75
+/-0.10
6.25
min
3.50
+/-0.05
4.0
+/-0.1
4.0
+/-0.1
1.37
+/-0.10
0.255
+/-0.150
5.2
+/-0.3
0.06
+/-0.02
SuperSOT
TM
-6 Tape and Reel Data and Package Dimensions, continued
December 1998, Rev. B
1998 Fairchild Semiconductor Corporation
SuperSOT
TM
-6 (FS PKG Code 31, 33)
1 : 1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.0158
SuperSOT
TM
-6 Tape and Reel Data and Package Dimensions, continued
September 1998, Rev. A
TRADEMARKS
ACExTM
CoolFETTM
CROSSVOLTTM
E
2
CMOS
TM
FACTTM
FACT Quiet SeriesTM
FAST
FASTrTM
GTOTM
HiSeCTM
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
ISOPLANARTM
MICROWIRETM
POPTM
PowerTrenchTM
QSTM
Quiet SeriesTM
SuperSOTTM-3
SuperSOTTM-6
SuperSOTTM-8
TinyLogicTM
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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