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FDG313N
FDG313N Rev. C
FDG313N
Digital FET, N-Channel
July 2000
1998 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
T
A
= 25C unless otherwise noted
Symbol
Parameter
FDG313N
Units
V
DSS
Drain-Source Voltage
25
V
V
GSS
Gate-Source Voltage
8
V
I
D
Drain Current - Continuous
(Note 1a)
0.95
A
- Pulsed
2
Power Dissipation for Single Operation
(Note 1a)
0.75
W
(Note 1b)
0.55
P
D
(Note 1c)
0.48
T
J
, T
stg
Operating and Storage Junction Temperature Range
-55 to +150
C
ESD
Electrostatic Discharge Rating MIL-STD-883D
Human Body Model (100pf / 1500 Ohm)
6
kV
Thermal Characteristics
R
JA
Thermal Resistance, Junction-to-Ambient
(Note 1c)
260
C/W
Package Outlines and Ordering Information
Device Marking
Device
Reel Size
Tape Width
Quantity
.
13
FDG313N
7''
8mm
3000 units
General Description
This N-Channel enhancement mode field effect
transistor is produced using Fairchild's proprietary, high
cell density, DMOS technology. This very high density
process is especially tailored to minimize on-state
resistance. This device has been designed especially
for low voltage applications as a replacement for
bipolar digital transistor and small signal MOSFET.
Applications
Load switch
Battery protection
Power management
Features
0.95 A, 25 V. R
DS(on)
= 0.45
@ V
GS
= 4.5 V
R
DS(on)
= 0.60
@ V
GS
= 2.7 V.
Low gate charge (1.64 nC typical)
Very low level gate drive requirements allowing direct
operation in 3V circuits (V
GS(th)
< 1.5V).
Gate-Source Zener for ESD ruggedness
(>6kV Human Body Model).
Compact industry standard SC70-6 surface mount
package.
SC70-6
D
S
D
G
D
D
pin
1
3
5
6
4
1
2
3
FDG313N
FDG313N Rev. C
DMOS Electrical Characteristics
T
A
= 25C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BV
DSS
Drain-Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250
A
25
V
BV
DSS
T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250
A, Referenced to 25
C
30
mV/
C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 20 V, V
GS
= 0 V
1
A
I
GSS
Gate-Body Leakage Current
V
GS
= 8 V, V
DS
= 0 V
100
nA
On Characteristics
(Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250
A
0.65
0.8
1.5
V
V
GS(th)
T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250
A, Referenced to 25
C
-2
mV/
C
R
DS(on)
Static Drain-Source
On-Resistance
V
GS
= 4.5 V, I
D
= 0.5 A
V
GS
= 4.5 V, I
D
= 0.5 A @ 125
C
V
GS
= 2.7 V, I
D
= 0.2 A
0.35
0.53
0.45
0.45
0.76
0.6
I
D(on)
On-State Drain Current
V
GS
= 4.5 V, V
DS
= 5 V
0.5
A
g
FS
Forward Transconductance
V
DS
= 5 V, I
D
= 0.5 A
1.5
S
Dynamic Characteristics
C
iss
Input Capacitance
50
pF
C
oss
Output Capacitance
28
pF
C
rss
Reverse Transfer Capacitance
V
DS
= 10 V, V
GS
= 0 V,
f = 1.0 MHz
9
pF
Switching Characteristics
(Note 2)
t
d(on)
Turn-On Delay Time
3
6
ns
t
r
Turn-On Rise Time
8.5
18
ns
t
d(off)
Turn-Off Delay Time
17
30
ns
t
f
Turn-Off Fall Time
V
DD
= 6 V, I
D
= 0.5 A,
V
GS
= 4.5 V, R
GEN
= 50
13
25
ns
Q
g
Total Gate Charge
1.64
2.3
nC
Q
gs
Gate-Source Charge
0.38
nC
Q
gd
Gate-Drain Charge
V
DS
= 5 V, I
D
= 0.95 A,
V
GS
= 4.5 V
0.45
nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain-Source Diode Forward Current
0.6
A
V
SD
Drain-Source Diode Forward Voltage V
GS
= 0 V, I
S
= 0.6 A
(Note 2)
0.8
1.2
V
Notes:
1. R
JA
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R
JC
is guaranteed by design while R
JA
is determined by the user's board design.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width
300
s, Duty Cycle
2.0%
a) 170
C/W when
mounted on a 1 in
2
pad of 2oz copper.
b) 225
C/W when
mounted on a half
of package sized 2oz.
copper.
c) 260
C/W when
mounted on a minimum
pad of 2oz copper.
FDG313N
FDG313N Rev. C
Typical Characteristics
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation
with Drain Current and Gate Voltage.
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage
Variation with Source Current
and Temperature.
Figure 3. On-Resistance Variation
with Temperature.
Figure 4. On-Resistance Variation
with Gate-to-Source Voltage.
1
2
3
4
5
0
0.4
0.8
1.2
1.6
V , GATE TO SOUR CE VOLTAGE (V)
GS
R
,
O
N
-
R
E
S
IS
T
A
N
C
E
(
O
H
M
)
DS
(
O
N
)
T = 25C
A
I = 0.5A
D
T = 1 25C
A
-50
-25
0
25
50
75
100
125
150
0.6
0.8
1
1.2
1.4
1.6
T , JUNCTION TEMPERATURE (C)
DR
AI
N-
S
O
UR
CE
O
N
-
R
E
S
I
S
T
AN
CE
J
V = 4.5 V
GS
I = 0.95 A
D
R
,
N
O
R
M
A
L
IZ
ED
DS
(
O
N)
0
1
2
3
4
0
0.5
1
1.5
2
V , DRAIN-SOURCE VOLTAGE (V)
I
, DRAIN
-
S
O
URCE
CURR
E
N
T
(
A
)
V = 4.5V
GS
3.0V
2.5V
1.5V
DS
D
2.0V
0
0.5
1
1.5
2
0.5
1
1.5
2
2.5
I , DRAIN CURRENT (A)
D
R
A
I
N-
S
O
UR
CE
O
N
-
R
E
S
I
S
T
A
N
C
E
V = 2.0V
GS
2.5V
3.0V
3.5V
D
4.5V
4.0V
R
,
N
O
R
M
A
L
IZ
ED
DS
(ON)
0
0.2
0.4
0.6
0.8
1
1.2
0.0001
0.001
0.01
0.1
1
V , BODY DIODE FORWARD VOLTAGE (V)
I
,
RE
V
E
RS
E
DRAI
N
CURRE
NT
(
A
)
T = 125C
J
25C
-55C
V = 0V
GS
SD
S
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
1
V , GATE TO SOURCE VOLTAGE (V)
I
, DRA
IN
C
URR
E
N
T
(
A
)
25C
125C
V = 5.0V
DS
GS
D
T = -55C
J
FDG313N
FDG313N Rev. C
Typical Characteristics
(continued)
Figure 7. Gate-Charge Characteristics.
Figure 8. Capacitance Characteristics.
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient themal response will change depending on the circuit board design.
0.0001
0.001
0.01
0.1
1
10
100
300
0.005
0.01
0.05
0.1
0.5
1
t , TIME (sec)
T
R
A
N
S
I
E
N
T
T
H
E
R
M
A
L
RE
S
I
S
T
ANCE
1
Single Pulse
D = 0.5
0.1
0.05
0.02
0.01
0.2
r
(
t
)
,
N
O
RM
AL
IZ
E
D
E
F
FE
C
T
IV
E
Duty Cycle, D = t / t
1
2
R (t) = r(t) * R
R =260C/W
JA
JA
JA
T - T = P * R (t)
JA
A
J
P(pk)
t
1
t
2
0.1
0.2
0.5
1
2
5
10
20 30
50
0.01
0.03
0.1
0.3
1
2
5
V , DRAIN-SOURCE VOLTAGE (V)
I
,
DRAI
N C
URRE
NT
(A)
DS
D
RDS
(O
N)
LIM
IT
V = 4.5V
SINGLE PULSE
R =260C/W
T = 25C
GS
A
JA
DC
1s
10m
s
100m
s
10s
1ms
0
0.4
0.8
1.2
1.6
2
0
1
2
3
4
5
Q , GATE CHARGE (nC)
V
, G
A
TE
-
S
O
URCE
V
O
LTAG
E
(
V
)
g
GS
I = 0.95A
D
10V
15V
V = 5V
DS
0.1
0.5
1
2
5
10
25
5
10
20
50
100
150
V , DRAIN TO SOURCE VOLTAGE (V)
CAP
ACI
TANC
E
(pF)
DS
C
iss
f = 1 MHz
V = 0V
GS
C
oss
C rss
0
6
12
18
24
30
0.0001
0.001
0.01
0.1
1
10
100
1000
SINGLE PULSE TIME (SEC)
POW
ER
(W
)
SINGLE PULSE
R
JA
= 260
o
C/W
T
A
= 25
o
C
SC70-6 Unit Orientation
SC70-6 Packaging
Configuration: Figure 1.0
Components
Leader Tape
500mm minimum or
125 empty pockets
Trailer Tape
300mm minimum or
75 empty pockets
SC70-6 Tape Leader and Trailer
Configuration: Figure 2.0
Cover Tape
Carrier Tape
Note/Comments
Packaging Option
SC70-6 Packaging Information
Standard
(no flow code)
D87Z
Packaging type
Reel Size
TNR
7" Dia
TNR
13"
Qty per Reel/Tube/Bag
3,000
10,000
Box Dimension (mm)
184x187x47
343x343x64
Max qty per Box
9,000
30,000
Weight per unit (gm)
0.0055
0.0055
Weight per Reel (kg)
0.1140
0.3960
F63TNR
Label
Customized Label
Antistatic Cover Tape
184mm x 187mm x 47mm
Pizza Box for Standard Option
F63TNR
Label
F63TNR Barcode Label
F63TNR Label sample
343mm x 342mm x 64mm
Intermediate box for D87Z Option
21
21
21
21
F63TNR
Label
21
Pin 1
LOT: CBVK741B019
FSID: FDG6302P
D/C1: D9842 QTY1:
SPEC REV:
SPEC:
QTY: 3000
D/C2:
QTY2:
CPN:
N/F: F (F63TNR)3
Packaging Description:
SC70-6 parts are shipped in tape. The carrier tape is
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
3,000 units per 7" or 177cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). Other option comes in 10,000 units per 13"
or 330cm diameter reel. This and some other options are
described in the Packaging Information table.
These full reels are individually barcode labeled and
placed inside a pizza box (illustrated in figure 1.0) made of
recyclable corrugated brown paper with a Fairchild logo
printing. One pizza box contains three reels maximum.
And these pizza boxes are placed inside a barcode
labeled shipping box which comes in different sizes
depending on the number of parts shipped.
Static Dissipative
Embossed Carrier Tape
SC70-6 Tape and Reel Data and Package Dimensions
August 1999, Rev. C
SC70-6 Tape and Reel Data and Package Dimensions, continued
July 1999, Rev. C
P1
A0
D1
P0
F
W
E1
D0
E2
B0
Tc
Wc
K0
T
Dimensions are in inches and millimeters
Tape Size
Reel
Option
Dim A
Dim B
Dim C
Dim D
Dim N
Dim W1
Dim W2
Dim W3 (LSL-USL)
8mm
7" Dia
7.00
177.8
0.059
1.5
0.512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
2.165
55
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 0.429
7.9 10.9
8mm
13" Dia
13.00
330
0.059
1.5
0.512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
4.00
100
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.311 0.429
7.9 10.9
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
SC70-6 Embossed Carrier Tape
Configuration: Figure 3.0
SC70-6 Reel Configuration: Figure 4.0
Dimensions are in millimeter
Pkg type
A0
B0
W
D0
D1
E1
E2
F
P1
P0
K0
T
Wc
Tc
SC70-6
(8mm)
2.24
+/-0.10
2.34
+/-0.10
8.0
+/-0.3
1.55
+/-0.05
1.125
+/-0.125
1.75
+/-0.10
6.25
min
3.50
+/-0.05
4.0
+/-0.1
4.0
+/-0.1
1.20
+/-0.10
0.255
+/-0.150
5.2
+/-0.3
0.06
+/-0.02
SC70-6 (FS PKG Code 76)
SC70-6 Tape and Reel Data and Package Dimensions, continued
March 2000, Rev. B
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.0055
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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HiSeCTM
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