June 2000
PRELIMINARY
2000 Fairchild Semiconductor Corporation
FDP7042L Rev B(W)
FDP7042L / FDB7042L
N-Channel Logic Level PowerTrench
MOSFET
General Description
This N-Channel MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers. It has been optimized for
"low side" synchronous rectifier operation, providing an
extremely low R
DS(ON)
.
Applications
Synchronous rectifier
DC/DC converter
Features
50 A, 30 V.
R
DS(ON)
= 9 m
@ V
GS
= 4.5 V
R
DS(ON)
= 7.5 m
@ V
GS
= 10 V
Critical DC electrical parameters specified at
elevated temperature
High performance trench technology for extremely
low R
DS(ON)
175C maximum junction temperature rating
S
G
D
TO-220
FDP Series
D
G
S
TO-263AB
FDB Series
S
G
D
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
Ratings
Units
V
DSS
Drain-Source Voltage
30
V
V
GSS
Gate-Source Voltage
12
V
I
D
Drain Current Continuous
(Note 1)
50
A
Pulsed
(Note 1)
150
P
D
Total Power Dissipation @ T
C
= 25
C
83
W
Derate above 25
C
0.48
W
C
T
J
, T
STG
Operating and Storage Junction Temperature Range
-65 to +175
C
Thermal Characteristics
R
JC
Thermal Resistance, Junction-to-Case
1.8
C/W
R
JA
Thermal Resistance, Junction-to-Ambient
62.5
C/W
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
FDB7042L
FDB7042L
13''
24mm
800 units
FDP7042L
FDP7042L
Tube
n/a
45
FDP7042L /
FDB7042L
FDP7042L Rev B(W)
Electrical Characteristics
T
A
= 25C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BV
DSS
DrainSource Breakdown Voltage
V
GS
= 0 V, I
D
= 250
A
30
V
BV
DSS
===T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250
A, Referenced to 25C
24
mV/
C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 24 V,
V
GS
= 0 V
1
A
I
GSSF
GateBody Leakage, Forward
V
GS
= 12 V,
V
DS
= 0 V
100
nA
I
GSSR
GateBody Leakage, Reverse
V
GS
= 12 V
V
DS
= 0 V
100
nA
On Characteristics
(Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250
A
0.8
1.2
2
V
V
GS(th)
===T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250
A, Referenced to 25C
4.1
mV/
C
R
DS(on)
Static DrainSource OnResistance
V
GS
= 4.5 V,
I
D
= 25A
V
GS
= 10 V,
I
D
= 25A
V
GS
= 4.5 V, I
D
=25A, T
J
=125
C
6.2
5.5
9.6
9
7.5
16
m
I
D(on)
OnState Drain Current
V
GS
= 4.5 V,
V
DS
= 10 V
60
A
g
FS
Forward Transconductance
V
DS
= 5V,
I
D
= 25 A
117
S
Dynamic Characteristics
C
iss
Input Capacitance
2418
pF
C
oss
Output Capacitance
549
pF
C
rss
Reverse Transfer Capacitance
V
DS
= 15 V, V
GS
= 0 V,
f = 1.0 MHz
243
pF
Switching Characteristics
(Note 2)
t
d(on)
TurnOn Delay Time
21
34
ns
t
r
TurnOn Rise Time
20
32
ns
t
d(off)
TurnOff Delay Time
60
96
ns
t
f
TurnOff Fall Time
V
DD
= 15 V, I
D
= 1 A,
V
GS
= 4.5 V, R
GEN
= 6
30
48
ns
Q
g
Total Gate Charge
32
51
nC
Q
gs
GateSource Charge
10
nC
Q
gd
GateDrain Charge
V
DS
= 15 V, I
D
= 50 A,
V
GS
= 4.5 V
9
nC
DrainSource Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous DrainSource Diode Forward Current
50
A
V
SD
DrainSource Diode Forward
Voltage
V
GS
= 0 V,
I
S
= 25 A
(Note 2)
0.8
1.3
V
Notes:
1. Maximum continuous current is limited by the package.
2. Pulse Test: Pulse Width < 300
s, Duty Cycle < 2.0%
FDP7042L /
FDB7042L
FDP7042L Rev B(W)
Typical Characteristics
0
30
60
90
120
150
0
1
2
3
4
5
V
DS
, DRAIN-SOURCE VOLTAGE (V)
4.0V
3.0V
2.5V
V
GS
= 4.5V
3.5V
0.8
1
1.2
1.4
1.6
1.8
2
0
30
60
90
120
150
I
D
, DRAIN CURRENT (A)
V
GS
= 2.5V
4.0V
3.5V
4.5V
3.0V
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
-50
-25
0
25
50
75
100
125
150
175
T
J
, JUNCTION TEMPERATURE (
o
C)
I
D
=25A
V
GS
= 4.5V
0
0.005
0.01
0.015
0.02
0.025
2
2.5
3
3.5
4
4.5
5
V
GS
, GATE TO SOURCE VOLTAGE (V)
I
D
= 25 A
T
A
= 125
o
C
T
A
= 25
o
C
Figure 3. On-Resistance Variation
withTemperature.
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
0
20
40
60
80
1
1.5
2
2.5
3
V
GS
, GATE TO SOURCE VOLTAGE (V)
T
A
= 125
o
C
25
o
C
-55
o
C
V
DS
= 5V
0.001
0.01
0.1
1
10
100
0
0.2
0.4
0.6
0.8
1
1.2
1.4
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
T
A
= 125
o
C
25
o
C
-55
o
C
V
GS
= 0V
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
FDP7042L /
FDB7042L
FDP7042L Rev B(W)
Typical Characteristics
0
1
2
3
4
5
0
5
10
15
20
25
30
35
Q
g
, GATE CHARGE (nC)
I
D
= 50A
V
DS
= 5V
15V
10V
0
1000
2000
3000
4000
5000
6000
0
6
12
18
24
30
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
C
ISS
C
RSS
C
OSS
f = 1MHz
V
GS
= 0 V
Figure 7. Gate Charge Characteristics.
Figure 8. Capacitance Characteristics.
1
10
100
1000
0.1
1
10
100
V
DS
, DRAIN-SOURCE VOLTAGE (V)
DC
100ms
100s
R
DS(ON)
LIMIT
V
GS
= 4.5V
SINGLE PULSE
R
JC
= 1.8
o
C/W
T
C
= 25
o
C
10ms
1ms
0
200
400
600
800
1000
1
10
100
1000
t
1
, TIME (sec)
SINGLE PULSE
R
JC
= 1.8C/W
T
C
= 25C
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
10
100
1000
t
1
, TIME (sec)
R
JC
(t) = r(t) + R
JC
R
JC
= 1.8 C/W
T
J
- T
C
= P * R
JC
(t)
Duty Cycle, D = t
1
/ t
2
P(pk)
t
1
t
2
SINGLE PULSE
0.01
0.02
0.05
0.1
0.2
D = 0.5
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDP7042L /
FDB7042L
TO-220 Tape and Reel Data and Package Dimensions
August 1999, Rev. B
0.165
TO-220 Tube Packing
Configuration: Figur e 1.0
Note/Comments
Packaging Option
TO-220 Packaging Information
Standard
(no
f l ow code )
Packaging type
Rail/Tube
Qty per Tube/Box
45
Box Dimension (mm)
530x130x83
Max qty per Box
1,080
Weight per unit (gm)
1.4378
S62Z
BULK
300
114x102x51
1,500
1.4378
FSCINT Label
FSCINT Label
114mm x 102mm x 51mm
EO70 Immed iate Box
530mm x 130mm x 83mm
Intermediate bo x
300 units per
EO70 box
5 EO70 boxe s per per
Interm ediate Bo x
1500 uni ts maxi mum
qu ant it y per intermediate box
An ti-stati c
Bubbl e Sheet s
45 un it s per Tube
Conduct ive Plas ti c B ag
1080 uni ts maxi mum
qu ant it y per bo x
530mm x 130mm x 83mm
Intermediate bo x
FSCINT Label
12 Tube s per Bag
Note: All dim ensions are in inches
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
F9852
NDP4060L
1.300
.015
0.080
0.032
.003
0.275
0.275
0.160
0.800
0.450
.030
20.000
+0.031
-0.065
0.123
+0.001
-0.003
LOT:
CBVK741B019
NSID:
FDP7060
D/C1:
D9842
SPEC REV:
B2
SPEC:
QTY:
1080
QA REV:
FAIRCHILD SEMICONDUCTOR CORPORATION
HTB:B
(FSCINT)
FSCINT Labe l samp le
TO-220 Tube
Configuration: Figure 4.0
TO-220 Packaging
Information: Figure 2.0
TO-220 bulk Packing
Configuration: Figure 3.0
2 bag s per Box
Packaging Description:
TO-220 parts are ship ped normally in tube. The tube is
made of PVC plastic treated with anti -stati c agent.These
tubes in standard option are placed inside a dissipative
plastic bag, barcode labeled, and placed inside a box
made of recyclable corrugated pa per. One box contains
two ba gs maximum (see fig. 1.0). And one or several o f
these boxes are placed inside a labeled shipp ing bo x
whic h c omes in different sizes dependi ng on the nu mber
of parts ship ped. The other option comes in bulk as
described in the Packagin g Information table. The unit s in
this option are placed inside a small box laid w ith anti-
static bubble sheet. These smaller boxes are individually
labeled and placed ins ide a larger box (see fig. 3.0).
These larger or intermediate boxes then will b e placed
finally inside a labeled shipping box whic h still comes in
different sizes depending on the number of units shipped.
TO-220 (FS PKG Code 37)
TO-220 Tape and Reel Data and Package Dimensions, continued
September 1998, Rev. A
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 1.4378
TO-263AB/D
2
PAK Packaging
Configuration: Figure 1.0
Components
TO-263AB/D
2
PAK Tape Leader and Trailer
Configuration: Figure 2.0
Cover Tape
Carrier Tape
Note/Comments
Packaging Option
TO-263AB/D
2
PAK Packaging Information
Standard
(no flow code)
L86Z
Packaging type
Reel Size
TNR
13" Dia
Rail/Tube
-
Qty per Reel/Tube/Bag
800
45
Box Dimension (mm)
359x359x57
530x130x83
Max qty per Box
800
1,080
Weight per unit (gm)
1.4378
1.4378
Weight per Reel
1.6050
-
Moisture Sensitive
Label
DRYPACK Bag
ESD Label
F63TNR Label
359mm x 359mm x 57mm
Standard Intermediate box
TO-263AB/D
2
PAK Unit Orientation
FD
B60
3AL
F98
35
FD
B60
3AL
F98
35
FD
B60
3AL
F98
35
FD
B60
3AL
F98
35
F63TNR Label sample
Static Dissipative
Embossed Carrier Tape
F63TNR
Label
Antistatic Cover Tape
ESD Label
EL ECT RO ST AT IC
SEN SIT IVE DEVI CES
DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC
EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S
TNR D ATE
PT NUMB ER
PEEL STREN GTH MIN ___ __ ____ __ ___gms
MAX ___ ___ ___ ___ _ gms
CAUTION
Moisture Sensitive
Label
Customized
Label
LOT: CBVK741B019
FSID: FDB6320L
D/C1: D9842 QTY1:
SPEC REV:
SPEC:
QTY: 800
D/C2:
QTY2:
CPN:
N/F: F (F63TNR)3
Leader Tape
1520mm minimum or
95 empty pockets
Trailer Tape
400mm minimum or
25 empty pockets
Packaging Description:
TO-263/D
2
PAK parts are shipped in tape. The carrier tape
is made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
800 units per 13" or 330cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). This and some other options are further
described in the Packaging Information table.
These full reels are individually barcode labeled, dry
packed, and placed inside a standard intermediate box
(illustrated in figure 1.0) made of recyclable corrugated
brown paper. One box contains one reel maximum. And
these boxes are placed inside a barcode labeled shipping
box which comes in different sizes depending on the
number of parts shipped.
TO-263AB/D
2
PAK Tape and Reel Data and Package
Dimensions
September 1999, Rev. B
P1
A0
D1
P0
F
W
E1
D0
E2
B0
Tc
Wc
K0
T
Dimensions are in inches and millimeters
Tape Size
Reel
Option
Dim A
Dim B
Dim C
Dim D
Dim N
Dim W1
Dim W2
Dim W3 (LSL-USL)
24mm
13" Dia
13.00
330
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
4.00
100
0.961 +0.078/-0.000
24.4 +2/0
1.197
30.4
0.941 0.1.079
23.9 27.4
See detail AA
Dim A
max
13" Diameter Option
Dim A
Max
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
10 deg maximum component rotation
0.9mm
maximum
0.9mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
10 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
TO-263AB/D
2
PAK Embossed Carrier Tape
Configuration: Figure 3.0
TO-263AB/D
2
PAK Reel Configuration:
Figure 4.0
Dimensions are in millimeter
Pkg type
A0
B0
W
D0
D1
E1
E2
F
P1
P0
K0
T
Wc
Tc
T
D
2
PAK
O263AB/
(24mm)
10.60
+/-0.10
15.80
+/-0.10
24.0
+/-0.3
1.55
+/-0.05
1.60
+/-0.10
1.75
+/-0.10
22.25
min
11.50
+/-0.10
16.0
+/-0.1
4.0
+/-0.1
4.90
+/-0.10
0.450
+/-0.150
21.0
+/-0.3
0.06
+/-0.02
TO-263AB/D
2
PAK Tape and Reel Data and Package Dimensions, continued
August 1999, Rev. B
TO-263AB/D
2
PAK (FS PKG Code 45)
TO-263AB/D
2
PAK Tape and Reel Data and Package Dimensions, continued
August 1998, Rev. A
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 1.4378
TRADEMARKS
ACExTM
BottomlessTM
CoolFETTM
CROSSVOLTTM
E
2
CMOS
TM
FACTTM
FACT Quiet SeriesTM
FAST
FASTrTM
GTOTM
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
SuperSOTTM-8
SyncFETTM
TinyLogicTM
UHCTM
VCXTM
HiSeCTM
ISOPLANARTM
MICROWIRETM
POPTM
PowerTrench
QFETTM
QSTM
Quiet SeriesTM
SuperSOTTM-3
SuperSOTTM-6
Rev. E
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