DISCRETE POWER AND SIGNAL
TECHNOLOGIES
Absolute Maximum Ratings*
TA = 25
O
C unless otherwise noted
Sym
Parameter
Value
Units
T
stg
Storage Temperature
-55 to +150
O
C
T
J
Operating Junction Temperature
-55 to +150
O
C
P
D
Total Power Dissipation at T
A
= 25
O
C
350
W
Linear Derating Factor from T
A
= 25
O
C
2.8
mW/
O
C
R
OJA
Thermal Resistance Junction-to-Ambient
357
O
C/W
W
iv
Working Inverse Voltage
75
V
I
O
Average Rectified Current
200
mA
I
F
DC Forward Current (I
F
)
600
mA
i
f
Recurrent Peak Forward Current (I
F
)
700
mA
i
F(surge)
Peak Forward Surge Current (I
FSM
) Pulse Width = 1.0 second
1.0
Amp
Pulse Width = 1.0 microsecond
2.0
Amp
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
MMBD4448
Electrical Characteristics
TA = 25
O
C unless otherwise noted
SYM
CHARACTERISTICS
MIN
MAX
UNITS
TEST CONDITIONS
B
V
Breakdown Voltage
100
V
I
R
= 100 uA
75
V
I
R
= 5.0 uA
I
R
Reverse Leakage
25
nA
V
R
= 20 V
50
uA
V
R
= 20 V T
A
= 150 Deg C
5.0
uA
V
R
= 75 V
V
F
Forward Voltage
620
720
mV
I
F
= 5 mA
1.0
V
I
F
= 100 mA
C
T
Capacitance
2.0
pF
V
R
= 0.0 V, f = 1.0 MHz
T
RR
Reverse Recovery Time
4.0
ns
I
F
= 10 mA I
R
= 10 mA
I
RR
= 1.0 Ma, R
L
= 100 ohms
V
FM
Peak Forward Recovery Voltage
2.5
V
I
F
= 50 mA Pk Square Wave
High Conductance
Fast Diode
1997 Fairchild Semiconductor Corporation
Features:
350 milliwatt Power Dissipation package.
High Breakdown Voltage, Fast Switching Speed.
Typical capacitance less than 1.5 picofarad.
Ordering:
7 inch reel (178 mm); 8 mm Tape; 3,000 units per reel.
General Description:
The high breakdown voltage, fast switching speed and high
forward conductance of this diode packaged in a SOT-23
Surface Mount package makes it desirable also as a general
purpose diode.
Top Mark: RAB
3
1
2
PACKAGE
TO-236AB (Low)
3
2 NC
1
CONNECTION DIAGRAMS
Revision A; November 10, 1998
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
SOT-23
Diode (pinout)
TO-236AB (L
OW
P
ROFILE
)
22-August-1994
0.098 (2.489)
0.083 (2.108)
0.055 (1.397)
0.047 (1.194)
0.024 (0.810)
0.018 (0.457)
3 CHARACTERS MAX
LOW PROFILE
0.0040 (0.102)
(49)
0.0005 (0.013)
0.120 (3.048)
0.110 (2.794)
0.040 (1.016)
0.035 (0.889)
0.080 (2.032)
0.070 (1.778)
0.019 (0.483)
0.015 (0.381)
0.0059 (0.150)
0.0035 (0.089)
2
3
1
LOW PROFILE
0.041 (1.041)
(49)
0.035 (0.889)
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
0.035" T
YPICAL
(0.889)
0.060" +/- 0.005"
(1.524 +/- 0.127)
0.120" M
INIMUM
(3.048)
0.030" +/- 0.005"
(0.762 +/- 0.127)
R
ECOMMENDED
S
OLDER
P
ADS
FOR
SOT-23
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
0.037" +/- 0.005"
(0.950 +/- 0.127 )
0.099" +/- 0.005"
(2.524 +/- 0.127 )
0.039" +/- 0.005"
(1.000 +/- 0.127)
R
ECOMMENDED
S
OLDER
P
ADS
FOR
U.S. & European SOT-23
&
Japanese SC-59
0.031" +/- 0.005"
(0.800 +/- 0.127)
0.060" +/- 0.005"
(1.524 +/- 0.127)
TRADEMARKS
ACExTM
CoolFETTM
CROSSVOLTTM
E
2
CMOS
TM
FACTTM
FACT Quiet SeriesTM
FAST
FASTrTM
GTOTM
HiSeCTM
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
SyncFETTM
TinyLogicTM
UHCTM
VCXTM
ISOPLANARTM
MICROWIRETM
POPTM
PowerTrench
QFETTM
QSTM
Quiet SeriesTM
SuperSOTTM-3
SuperSOTTM-6
SuperSOTTM-8
Rev. D
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