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Электронный компонент: NDP7061

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May 1996
NDP7061 / NDB7061
N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
________________________________________________________________________________
Absolute Maximum Ratings
T
C
= 25C unless otherwise noted
Symbol
Parameter
NDP7061
NDB7061
Units
V
DSS
Drain-Source Voltage
60
V
V
DGR
Drain-Gate Voltage (R
GS
< 1 M
)
60
V
V
GSS
Gate-Source Voltage - Continuous
20
V
- Nonrepetitive (t
P
< 50 s)
40
I
D
Drain Current
- Continuous
64
A
- Pulsed
190
P
D
Maximum Power Dissipation @ T
C
= 25C
130
W
Derate above 25C
0.87
W/C
T
J
,T
STG
Operating and Storage Temperature Range
-65 to 175
C
T
L
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
275
C
NDP7061 Rev. C / NDB7061 Rev. D
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild's proprietary, high cell
density, DMOS technology. This very high density process is
especially tailored to minimize on-state resistance, provide
superior switching performance, and withstand high energy
pulses in the avalanche and commutation modes. These
devices are particularly suited for low voltage applications such
as automotive, DC/DC converters, PWM motor controls, and
other battery powered circuits where fast switching, low in-line
power loss, and resistance to transients are needed.
64A, 60V. R
DS(ON)
= 0.016
@ V
GS
=10V.
Critical DC electrical parameters specified at elevated
temperature.
Rugged internal source-drain diode can eliminate the need
for an external Zener diode transient suppressor.
175C maximum junction temperature rating.
High density cell design for extremely low R
DS(ON)
.
TO-220 and TO-263 (D
2
PAK) package for both through hole
and surface mount applications.
S
D
G
1997 Fairchild Semiconductor Corporation
Electrical Characteristics
(T
C
= 25C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
W
DSS
Single Pulse Drain-Source Avalanche
Energy
V
DD
= 30 V, I
D
= 64 A
500
mJ
I
AR
Maximum Drain-Source Avalanche Current
64
A
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250 A
60
V
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 48 V, V
GS
= 0 V
10
A
T
J
= 125C
1
mA
I
GSSF
Gate - Body Leakage, Forward
V
GS
= 20 V, V
DS
= 0 V
100
nA
I
GSSR
Gate - Body Leakage, Reverse
V
GS
= -20 V, V
DS
= 0 V
-100
nA
ON CHARACTERISTICS
(Note 1)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250 A
2
2.9
4
V
T
J
= 125C
1.4
2.2
3.6
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
= 10 V, I
D
= 35 A
0.013
0.016
T
J
= 125C
0.021
0.032
I
D(on)
On-State Drain Current
V
GS
= 10 V, V
DS
= 10 V
60
A
g
FS
Forward Transconductance
V
DS
= 10 V, I
D
= 35 A
30
S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
1930
pF
C
oss
Output Capacitance
870
pF
C
rss
Reverse Transfer Capacitance
310
pF
SWITCHING CHARACTERISTICS
(Note 1)
t
D(on)
Turn - On Delay Time
V
DD
= 25 V, I
D
= 64 A,
V
GS
= 10 V, R
GEN
= 5
13
30
nS
t
r
Turn - On Rise Time
98
200
nS
t
D(off)
Turn - Off Delay Time
36
80
nS
t
f
Turn - Off Fall Time
65
150
nS
Q
g
Total Gate Charge
V
DS
= 48 V,
I
D
= 64 A, V
GS
= 10 V
67
100
nC
Q
gs
Gate-Source Charge
11
nC
Q
gd
Gate-Drain Charge
37.5
nC
NDP7061 Rev. C / NDB7061 Rev. D
Electrical Characteristics
(T
C
= 25C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRAIN-SOURCE DIODE CHARACTERISTICS
I
S
Maximum Continuos Drain-Source Diode Forward Current
64
A
I
SM
Maximum Pulsed Drain-Source Diode Forward Current
190
A
V
SD
Drain-Source Diode Forward Voltage
V
GS
= 0 V, I
S
= 35 A
(
Note 1)
0.9
1.3
V
T
J
= 125C
0.8
1.2
t
rr
Reverse Recovery Time
V
GS
= 0 V, I
F
= 64 A, dI
F
/dt = 100 A/s
40
105
150
ns
I
rr
Reverse Recovery Current
2
4.5
10
A
THERMAL CHARACTERISTICS
R
JC
Thermal Resistance, Junction-to-Case
1.15
C/W
R
JA
Thermal Resistance, Junction-to-Ambient
62.5
C/W
Note:
1. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%.
NDP7061 Rev. C / NDB7061 Rev. D
NDP7061 Rev. C / NDB7061 Rev. D
-50
-25
0
2 5
5 0
7 5
100
125
150
175
0.5
0.75
1
1.25
1.5
1.75
2
T , JUNCTION TEMPERATURE (C)
DRAIN-SOURCE ON-RESISTANCE
J
V = 10V
GS
I = 35A
D
R , NORMALIZED
DS(ON)
-50
-25
0
25
50
75
100
125
150
175
0.4
0.6
0.8
1
1.2
1.4
T , JUNCTION TEMPERATURE (C)
GATE-SOURCE THRESHOLD VOLTAGE
J
V , NORMALIZED
GS(th)
I = 250A
D
V = V
GS
DS
0
20
40
60
80
100
0.5
1
1.5
2
2.5
3
I , DRAIN CURRENT (A)
DRAIN-SOURCE ON-RESISTANCE
V = 5.0V
GS
D
R , NORMALIZED
DS(on)
7.0
6.0
10
20
12
8.0
0
20
40
60
80
100
0.5
0.75
1
1.25
1.5
1.75
2
I , DRAIN CURRENT (A)
DRAIN-SOURCE ON-RESISTANCE
T = 125C
J
25C
-55C
D
V =10V
GS
R , NORMALIZED
DS(on)
2
3
4
5
6
7
0
10
20
30
40
50
60
V , GATE TO SOURCE VOLTAGE (V)
I , DRAIN CURRENT (A)
25C
125C
V = 10V
DS
GS
D
T = -55C
J
Typical Electrical Characteristics
Figure 1. On-Region Characteristics
Figure 2. On-Resistance Variation with Gate
Voltage and Drain Current
Figure 3. On-Resistance Variation
with Temperature
Figure 4. On-Resistance Variation with Drain
Current and Temperature
Figure 5. Transfer Characteristics
Figure 6. Gate Threshold Variation with
Temperature
0
1
2
3
4
0
20
40
60
80
100
V , DRAIN-SOURCE VOLTAGE (V)
I , DRAIN-SOURCE CURRENT (A)
8.0
V =20V
GS
DS
D
6.0
12
7.0
4.5
5.0
10
NDP7061 Rev. C / NDB7061 Rev. D
-50
-25
0
25
50
75
100
125
150
175
0.9
0.95
1
1.05
1.1
1.15
T , JUNCTION TEMPERATURE (C)
DRAIN-SOURCE BREAKDOWN VOLTAGE
I = 250A
D
BV , NORMALIZED
DSS
J
0.2
0.3
0.5
1
2
0.001
0.01
0.1
1
10
50
100
V , BODY DIODE FORWARD VOLTAGE (V)
I , REVERSE DRAIN CURRENT (A)
V = 0V
GS
T = 125C
J
25C
-55C
SD
S
0
20
40
60
80
100
120
0
5
10
15
20
Q , GATE CHARGE (nC)
V , GATE-SOURCE VOLTAGE (V)
g
GS
48V
I = 64A
D
V = 12V
DS
24V
0.1
0.2
0.5
1
2
5
10
20
50
200
300
500
1000
2000
3000
4000
5000
V , DRAIN TO SOURCE VOLTAGE (V)
CAPACITANCE (pF)
DS
f = 1 MHz
V = 0V
GS
C
oss
C
iss
C
rss
G
D
S
V
DD
R
L
V
V
IN
OUT
V
GS
DUT
R
GEN
1 0 %
5 0 %
9 0 %
1 0 %
9 0 %
9 0 %
5 0 %
V
IN
V
O U T
o n
off
d(off)
f
r
d(on)
t
t
t
t
t
t
INVERTED
1 0 %
PULSE W IDTH
Figure 7. Breakdown Voltage Variation with
Temperature
Figure 8. Body Diode Forward Voltage
Variation with Current and Temperature
Figure 9. Capacitance Characteristics
Figure 10. Gate Charge Characteristics
Figure 11. Switching Test Circuit
Figure 12. Switching Waveforms
Typical Electrical Characteristics
(continued)