ChipFind - документация

Электронный компонент: TIS75

Скачать:  PDF   ZIP
www.docs.chipfind.ru
background image
2004 Fairchild Semiconductor Corporation
Rev. A, June 2004
TIS75
TO-92
Absolute Maximum Ratings *
T
a
=25
C unless otherwise noted
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1. These ratings are based on a maximum junction temperature of 150 degrees C.
2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics
T
a
=25
C unless otherwise noted
* Pulse Test: Pulse Width
300
s, Duty Cycle
3.0%
Symbol
Parameter
Value
Units
V
DG
Drain-Gate Voltage
30
V
V
GS
Gate-Source Voltage
-30
V
I
GF
Forward Gate Current
10
mA
T
J
, T
STG
Operating and Storage Junction Temperature Range
-55 ~ +150
C
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Units
Off Characteristics
V
(BR)GSS
Gate-Source Breakdown Voltage
I
G
= 1.0
A, V
DS
= 0
-30
V
I
GSS
Gate Reverse Current
V
GS
= 15V, V
DS
= 0
V
GS
= 15V, V
DS
= 0, T
a
= 100
C
-2.0
-5.0
nA
A
I
D
(off)
Drain Cutoff Leakage Current
V
DS
= 15V, V
GS
= -10V
V
DS
= 15V, V
GS
= -10V,
T
a
= 100
C
-2.0
-5.0
nA
A
V
GS
(off)
Gate-Source Cutoff Voltage
V
DS
= 20V, I
D
= 4.0nA
-0.8
-4.0
V
On Characteristics *
I
DSS
Zero-Gate Voltage Drain Current *
V
DS
= 15V, V
GS
= 0
8
80
mA
r
DS
(on)
Drain-Source On Resistance
V
DS
0.1V, V
GS
= 0
60
Small Signal Characteristics
C
iss
Input Capacitance
V
DS
= 0, V
GS
= -10V, f = 1.0MHz
18
pF
C
rss
Reverse Transfer Capacitance
V
DS
= 0, V
GS
= -10V, f = 1.0MHz
8.0
pF
Switching Characteristics
t
r
Rise Time
V
GS
(off) = -4.0V, V
GS
(on) = 0,
I
D
= 5.0mA, V
DS
= 10V
10
ns
t
on
Turn-On Time
10
ns
t
off
Turn-Off Time
100
ns
TIS75
N-Channel General Purpose Amplifier
This device is designed for low level analog switching, sample and
hold circuits and chopper stabilized amplifiers.
Sourced from process 54.
1. Gate 2. Source 3. Drain
1
background image
2004 Fairchild Semiconductor Corporation
Rev. A, June 2004
TIS75
Thermal Characteristics
T
a
=25
C unless otherwise noted
Symbol
Parameter
Max.
Units
P
D
Total Device Dissipation
Derate above 25
C
350
2.8
mW
mW/
C
R
JC
Thermal Resistance, Junction to Case
125
C/W
R
JA
Thermal Resistance, Junction to Ambient
357
C/W
background image
0.46
0.10
1.27TYP
(R2.29)
3.86MAX
[1.27
0.20
]
1.27TYP
[1.27
0.20
]
3.60
0.20
14.47
0.40
1.02
0.10
(0.25)
4.58
0.20
4.58
+0.25
0.15
0.38
+0.10
0.05
0.38
+0.10
0.05
TO-92
Package Dimensions
TIS75
Dimensions in Millimeters
Rev. A, June 2004
2004 Fairchild Semiconductor Corporation
background image
2004 Fairchild Semiconductor Corporation
Rev. I11
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
FAST
FASTrTM
FPSTM
FRFETTM
GlobalOptoisolatorTM
GTOTM
HiSeCTM
I
2
CTM
i-LoTM
ImpliedDisconnectTM
ISOPLANARTM
LittleFETTM
MICROCOUPLERTM
MicroFETTM
MicroPakTM
MICROWIRETM
MSXTM
MSXProTM
OCXTM
OCXProTM
OPTOLOGIC
OPTOPLANARTM
PACMANTM
POPTM
Power247TM
PowerSaverTM
PowerTrench
QFET
QSTM
QT OptoelectronicsTM
Quiet SeriesTM
RapidConfigureTM
RapidConnectTM
SerDesTM
SILENT SWITCHER
SMART STARTTM
SPMTM
StealthTM
SuperFETTM
SuperSOTTM-3
SuperSOTTM-6
SuperSOTTM-8
SyncFETTM
TinyLogic
TINYOPTOTM
TruTranslationTM
UHCTM
UltraFET
VCXTM
A
CExTM
ActiveArrayTM
BottomlessTM
CoolFETTM
CROSSVOLTTM
DOMETM
EcoSPARKTM
E
2
CMOSTM
EnSignaTM
FACTTM
FACT Quiet SeriesTM
Across the board. Around the world.TM
The Power Franchise
Programmable Active DroopTM