Fairchild Semiconductor Product Package Material Disclosure
Package Type
TSSOP-28
Weight of
Package (grams)
Maximum
Minimum
1.21E-01
1.14E-01
Component
Material Weight
in
grams
Substance in
material
Wt% in
finished
product min
Wt% in
finished
product max
CAS #
37.99
40.34
Copper 36.54
38.60
7440-50-8
Nickel 1.14
1.21
7440-02-0
Silicon 0.25
0.26
7440-21-3
Magnesium 0.06
0.06 7439-95-4
Silver (DP)
0.00
0.20
7440-22-4
Lead Frame
Copper alloy
4.61E-02
49.60
52.67
Silica 30.68
40.91
Carbon Black
0.00
0.77
Resin 7.67
17.64
Antimony
Compound
0.26 1.53 1309-64-4
Brominated
Compound
0.77 2.05 68541-56-0
Encapsulation
Epoxy 6.02E-02
1.65
8.25
Tin 1.40
7.01
7440-31-5
Solder 5.83E-03
Lead 0.25
1.24
7439-92-1
1.65
8.25
Tin 1.65
8.25
7440-31-5
Plating
or
Lead-free
Solder
5.83E-03
3.21
3.55
Silicon and trace
metals
3.21 3.55 7440-21-3
Chip
Silicon and
inorganic
compounds
3.98E-03
0.35
0.38
Silver 0.26
0.29
7440-22-4
Resin 0.09
0.10
Die Attach
Adhesive 4.31E-04
0.96
1.06
Gold 0.96
1.06
7440-57-5
Wire Bond
Gold Wire
1.19E-03
Materials Disclosure Disclaimer
The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness
or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in
this statement regarding the minute amounts of dopant and metal materials contained
within the electrically active or passive devices
contained within the finished product.
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