Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10
A (Max.) @ V
DS
= -250V
Lower R
DS(ON)
: 1.65
(Typ.)
Advanced Power MOSFET
Thermal Resistance
Junction-to-Case
Junction-to-Ambient
Junction-to-Ambient
R
JC
R
JA
R
JA
o
C/W
Characteristic
Max.
Units
Symbol
Typ.
FEATURES
*
*
When mounted on the minimum pad size recommended (PCB Mount).
Absolute Maximum Ratings
Drain-to-Source Voltage
Continuous Drain Current (T
C
=25
o
C)
Continuous Drain Current (T
C
=100
o
C)
Drain Current-Pulsed
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (T
A
=25
o
C)
Total Power Dissipation (T
C
=25
o
C)
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 " from case for 5-seconds
Characteristic
Value
Units
Symbol
I
DM
V
GS
E
AS
I
AR
E
AR
dv/dt
P
D
I
D
T
J
, T
STG
T
L
A
V
mJ
A
mJ
V/ns
W
W
W/
o
C
A
o
C
V
DSS
V
*
D-PAK
1. Gate 2. Drain 3. Source
1
2
3
I-PAK
1
3
2
O
1
O
2
O
3
O
1
O
1
SFR/U9224
BV
DSS
= -250 V
R
DS(on)
= 2.4
I
D
= -2.5 A
-250
-2.5
-1.5
-10
156
-2.5
3.0
-4.8
2.5
30
0.24
- 55 to +150
300
4.17
50
110
--
--
--
30
+
_
1999 Fairchild Semiconductor Corporation
Rev. B
P-CHANNEL
POWER MOSFET
Electrical Characteristics
(T
C
=25
o
C unless otherwise specified)
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coeff.
Gate Threshold Voltage
Gate-Source Leakage , Forward
Gate-Source Leakage , Reverse
Characteristic
Symbol
Max. Units
Typ.
Min.
Test Condition
Static Drain-Source
On-State Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain( " Miller " ) Charge
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
BV
DSS
BV/
T
J
V
GS(th)
R
DS(on)
I
GSS
I
DSS
V
V/
o
C
V
nA
A
pF
ns
nC
--
--
--
--
--
--
--
--
--
--
--
--
--
V
GS
=0V,I
D
=-250
A
I
D
=-250
A See Fig 7
V
DS
=-5V,I
D
=-250
A
V
GS
=-30V
V
GS
=30V
V
DS
=-250V
V
DS
=-200V,T
C
=125
o
C
V
GS
=-10V,I
D
=-1.3A
V
DS
=-40V,I
D
=-1.3A
V
DD
=-125V,I
D
=-2.7A,
R
G
=18
See Fig 13
V
DS
=-200V,V
GS
=-10V,
I
D
=-2.7A
See Fig 6 & Fig 12
Drain-to-Source Leakage Current
V
GS
=0V,V
DS
=-25V,f =1MHz
See Fig 5
Source-Drain Diode Ratings and Characteristics
Continuous Source Current
Pulsed-Source Current
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
I
S
I
SM
V
SD
t
rr
Q
rr
Characteristic
Symbol
Max. Units
Typ.
Min.
Test Condition
--
--
--
--
--
A
V
ns
C
Integral reverse pn-diode
in the MOSFET
T
J
=25
o
C,I
S
=-2.4A,V
GS
=0V
T
J
=25
o
C,I
F
=-2.7A
di
F
/dt=100A/
s
O
4
O
4
O
5
O
4
O
4
O
5
O
4
O
1
O
4
SFR/U9224
-250
--
-2.0
--
--
--
--
--
-0.22
--
--
--
--
--
65
24
11
19
34
15
16
3.3
7.8
--
--
-4.0
-100
100
-10
-100
2.4
--
540
95
35
30
50
80
40
20
--
--
1.9
415
--
--
--
140
0.7
-2.5
-10
-5.0
--
--
Notes ;
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
L=40mH, I
AS
=-2.5A, V
DD
=-50V, R
G
=27
*
, Starting T
J
=25
o
C
I
SD
-2.7A, di/dt 300A/
s, V
DD
BV
DSS
, Starting T
J
=25
o
C
Pulse Test : Pulse Width = 250
s, Duty Cycle 2%
Essentially Independent of Operating Temperature
O
1
O
2
O
3
O
4
O
5
<
_
<
_
<
_
<
_
P-CHANNEL
POWER MOSFET
Fig 1. Output Characteristics
Fig 2. Transfer Characteristics
Fig 6. Gate Charge vs. Gate-Source Voltage
Fig 5. Capacitance vs. Drain-Source Voltage
Fig 4. Source-Drain Diode Forward Voltage
Fig 3. On-Resistance vs. Drain Current
SFR/U9224
10
-1
10
0
10
1
10
-1
10
0
10
1
@ Notes :
1. 250
s Pulse Test
2. T
C
= 25
o
C
V
GS
Top : - 15 V
- 10 V
- 8.0 V
- 7.0 V
- 6.0 V
- 5.5 V
- 5.0 V
Bottom : - 4.5 V
-I
D
, Drain Current [A]
-V
DS
, Drain-Source Voltage [V]
2
4
6
8
10
10
-1
10
0
10
1
25
o
C
150
o
C
- 55
o
C
@ Notes :
1. V
GS
= 0 V
2. V
DS
= -40 V
3. 250
s Pulse Test
-I
D
, Drain Current [A]
-V
GS
, Gate-Source Voltage [V]
0
2
4
6
8
10
0
1
2
3
4
5
6
@ Note : T
J
= 25
o
C
V
GS
= -20 V
V
GS
= -10 V
R
DS(on)
, [
]
Drain-Source On-Resistance
-I
D
, Drain Current [A]
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
10
-1
10
0
10
1
150
o
C
25
o
C
@ Notes :
1. V
GS
= 0 V
2. 250
s Pulse Test
-I
DR
, Reverse Drain Current [A]
-V
SD
, Source-Drain Voltage [V]
0
3
6
9
12
15
18
0
5
10
V
DS
= -200 V
V
DS
= -125 V
V
DS
= -50 V
@ Notes : I
D
=-2.7 A
-V
GS
, Gate-Source Voltage [V]
Q
G
, Total Gate Charge [nC]
10
0
10
1
0
200
400
600
800
C
iss
= C
gs
+ C
gd
( C
ds
= shorted )
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
@ Notes :
1. V
GS
= 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capacitance [pF]
-V
DS
, Drain-Source Voltage [V]
P-CHANNEL
POWER MOSFET
Fig 7. Breakdown Voltage vs. Temperature
Fig 8. On-Resistance vs. Temperature
Fig 11. Thermal Response
Fig 10. Max. Drain Current vs. Case Temperature
Fig 9. Max. Safe Operating Area
P
DM
.
t
1.
t
2.
SFR/U9224
-75
-50
-25
0
25
50
75
100
125
150
175
0.0
0.5
1.0
1.5
2.0
2.5
3.0
@ Notes :
1. V
GS
= -10 V
2. I
D
= -1.4 A
R
DS(on)
, (Normalized)
Drain-Source On-Resistance
T
J
, Junction Temperature [
o
C]
10
0
10
1
10
2
10
-2
10
-1
10
0
10
1
10 ms
DC
1 ms
0.1 ms
@ Notes :
1. T
C
= 25
o
C
2. T
J
= 150
o
C
3. Single Pulse
Operation in This Area
is Limited by R
DS(on)
-I
D
, Drain Current [A]
-V
DS
, Drain-Source Voltage [V]
-75
-50
-25
0
25
50
75
100
125
150
175
0.8
0.9
1.0
1.1
1.2
@ Notes :
1. V
GS
= 0 V
2. I
D
= -250
A
-BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
T
J
, Junction Temperature [
o
C]
25
50
75
100
125
150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-I
D
, Drain Current [A]
T
c
, Case Temperature [
o
C]
10
- 5
10
- 4
10
- 3
10
- 2
10
- 1
10
0
10
1
10
- 1
10
0
single pulse
0.2
0.1
0.01
0.02
0.05
D=0.5
@ Notes :
1. Z
J C
(t)=4.17
o
C/W Max.
2. Duty Factor, D=t
1
/t
2
3. T
J M
-T
C
=P
D M
*Z
J C
(t)
Z
JC
(t) , Thermal Response
t
1
, Square Wave Pulse Duration [sec]
P-CHANNEL
POWER MOSFET
Fig 12. Gate Charge Test Circuit & Waveform
Fig 13. Resistive Switching Test Circuit & Waveforms
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms
E
AS
=
L
L
I
AS
2
----
2
1
--------------------
BV
DSS
-- V
DD
BV
DSS
V
in
V
out
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
Charge
V
GS
-10V
Q
g
Q
gs
Q
gd
Vary t
p
to obtain
required peak I
D
-10V
V
DD
C
L
L
V
DS
I
D
R
G
t
p
DUT
BV
DSS
t
p
V
DD
I
AS
V
DS
(t)
I
D
(t)
Time
V
DD
( 0.5 rated V
DS
)
-10V
V
out
V
in
R
L
DUT
R
G
-3mA
V
GS
Current Sampling (I
G
)
Resistor
Current Sampling (I
D
)
Resistor
DUT
V
DS
300nF
50K
200nF
12V
Same Type
as DUT
" Current Regulator "
R
1
R
2
SFR/U9224
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