Preliminary Data Sheet
FMA500
OC-192
M
ODULATOR
P
RE
-D
RIVER
A
MPLIFIER
Phone: (408) 988-1845
http:// www.filss.com
Revised: 3/15/02
Fax: (408) 970-9950
Email: sales@filss.com
FEATURES
DC 23 GHz Frequency Bandwidth
13 dB Small Signal Gain
4 Vpp Output Voltage
-12 dB input/output return loss
Chip Size: 1.18 x 1.50 mm
DESCRIPTION AND APPLICATIONS
The Filtronic Solid State FMA500 is a high-gain pre-driver pHEMT amplifier that operates from DC
to 23 GHz. This five-stage travelling wave amplifier provides 13 dB nominal small signal gain and
4 V peak-to-peak NRZ output at bit rates to 12.5 Gb/sec. The FMA500 is designed as the pre-driver
stage for OC-192 MZ modulator driver amplifiers for optical data communication applications, and
can be cascaded with the FMA501 Driver MMIC to provide 30 dB of voltage gain. The FMA500
can also be used as an EA driver amplifier or as a transimpedance amplifier (TIA) for photoreceiver
applications.
ELECTRICAL SPECIFICATIONS @ T
Ambient
= 25C
(V
DD
= +4.0V, V
GG
= -3.0V; V
GC
= +1.5V; Z
IN
= Z
OUT
= 50
)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
3dB Operating Bandwidth
BW
23
GHz
Small Signal Gain
S
21
13
dB
Operating Current
I
OP
100
mA
Input Return Loss
S
11
-12
dB
Output Return Loss
S
22
-12
dB
Gain Control
GC
V
GC
= 0V to 1.5V
6
dB
Group Delay Variation
grp
Over Bandwidth
20
ps
Rise/Fall time, 20%-80%
R/F
20
30
ps
Output Voltage at Saturation
V
OUT
10Gb/sec, NRZ, V
IN
= 2Vpp
4
V
Saturated Output Power
P
SAT
V
IN
= 2Vpp
20
dBm
Preliminary Data Sheet
FMA500
OC-192
M
ODULATOR
P
RE
-D
RIVER
A
MPLIFIER
Phone: (408) 988-1845
http:// www.filss.com
Revised: 3/15/02
Fax: (408) 970-9950
Email: sales@filss.com
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Min
Max
Units
Drain Voltage
V
DD
T
Ambient
= 22
3 C
5.0
V
Operating Current
I
OP
T
Ambient
= 22
3 C
150
mA
RF Input Power
P
IN
T
Ambient
= 22
3 C
12
dBm
Channel Operating Temperature
T
CH
T
Ambient
= 22
3 C
150
C
Storage Temperature
T
STG
--
-65
165
C
Maximum Assembly Temperature
(1 min. max.)
T
MAX
--
300
C
Notes:
Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
Recommended Continuous Operating Limits should be observed for reliable device operation.
This PHEMT is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these
devices.
MEASURED PERFORMANCE: 10 Gb/s NRZ Eye Test
(V
DD
= +4.0V, V
GG
= -3.0V; V
GC
= +1.5V; Z
IN
= Z
OUT
= 50
)
Preliminary Data Sheet
FMA500
OC-192
M
ODULATOR
P
RE
-D
RIVER
A
MPLIFIER
Phone: (408) 988-1845
http:// www.filss.com
Revised: 3/15/02
Fax: (408) 970-9950
Email: sales@filss.com
ASSEMBLY DIAGRAM
Notes:
Apply VGG first, then VGC and VDD.
Disconnect VGC first, then VDD and VGG when turning off.
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes.
Bond on bond or stitch bonds acceptable.
Conductor over conductor acceptable. Conductors must not short.
Gate bias: VGG = -3.0 V
Gain control: VGC = +1.5 V
Inductor for
drain = 300uH
Chip capacitor: 100nF
GND
VDD=3~5V
Preliminary Data Sheet
FMA500
OC-192
M
ODULATOR
P
RE
-D
RIVER
A
MPLIFIER
Phone: (408) 988-1845
http:// www.filss.com
Revised: 3/15/02
Fax: (408) 970-9950
Email: sales@filss.com
MECHANICAL OUTLINE
Notes:
All units are in microns (m).
All pads are 100 X 100 m
2
.
HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control
measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.
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