DC20 GH
Z
MMIC SPDT N
ON
-R
EFLECTIVE
S
WITCH
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website:
www.filtronic.com
1
Preliminary Datasheet v2.2
FMS2027
F
UNCTIONAL
S
CHEMATIC
:
YPICAL
A
PPLICATIONS
:
s
(ECM, ESM)
LECTRICAL
S
PECIFICATIONS
(based on on-wafer measurements):
F
EATURES
:
Available in die form
Non-Reflective design
Low Insertion loss 2.2 dB at 20GHz typical
Very high isolation 40 dB at 20GHz typical
Excellent low control voltage performance
G
ENERAL
D
ESCRIPTION
:
The FMS2027 is a low loss high isolation
broadband single pole single throw Gallium
Arsenide switch designed for use in broadband
communications instrumentation and electronic
warfare applications. The die is fabricated
using the Filtronic FL05 0.5
m switch process
technology that offers leading edge
performance optimised for switch applications.
RFIN
RFO1
RFO2
T
Broadband communication
Instrumentation
Electronic warfare
E
P
ARAMETER
C
ONDITIONS
M
IN
T
YP
M
AX
U
NITS
Insertion Loss
(DC
al
-10) GHz, Small Sign
1.4
dB
Insertion Loss
(10-15) GHz, Small Signal
1.7
dB
Insertion Loss
(15-20) GHz, Small Signal
2.2
dB
Isolation
(DC-10) GHz, Small Signal
40
dB
Isolation
(10-15) GHz, Small Signal
35
dB
Isolation
(15-20) GHz, Small Signal
40
dB
Return
state)
Loss (on
(DC-20) GHz, Small Signal
14
dB
Return Loss (of state)
(DC-20) GHz, Small Signal
25
dB
Switching speed
50% control to 10% / 90% RF
10
ns
P1dB
-5V control
25
dBm
ote: T
AMBIENT
= 25C, Vctrl = 0V/-5V, Z
IN
= Z
OUT
= 50
N
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website:
www.filtronic.com
2
Preliminary Datasheet v2.2
FMS2027
A
BSOLUTE
M
AXIMUM
R
ATINGS
:
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
P
AD
L
AYOUT
:
Note:
1
Co-ordinates are referenced from the bottom left
hand corner of the die to the centre of bond pad
opening
2
Only one control line A and one control line B
require connection
T
RUTH
T
ABLE
:
Note: -5V
0.2V; 0V
0.2V
P
ARAMETER
S
YMBOL
A
BSOLUTE
M
AXIMUM
Max Input Power
Pin
+38dBm
Control Voltage
Vctrl
+XV
Operating Temp
Toper
-40C to +100C
Storage Temp
Tstor
-55C to +150C
C
ONTROL
L
INE
RF P
ATH
A
B
RFIN-RFO1
RFIN-RFO2
-5V
0V
ON
OFF
0V
-5V
OFF
ON
P
AD
N
AME
D
ESCRIPTION
P
IN
C
OORDINATES
(m)
RFIN
RFIN
(653, 776)
RFO1
RFOUT1
(125, 333)
RFO2
RFOUT2
(125, 776)
A
VA1
(125, 626)
A
VA2
(504, 176)
A
VA3
(807, 176)
A
VA4
(1183, 776)
B
VB1
(125, 776)
B
VB2
(654, 176)
B
VB3
(1183, 626)
RFIN
A
B
A
B
RFO1
RFO2
A B A
D
IE
S
IZE
(
m)
D
IE
T
HICKNESS
(
m)
M
IN
. B
OND
P
AD
P
ITCH
(
m)
M
IN
. B
OND PAD
O
PENING
(
m x
m )
1910 x 1110 (pizza mask)
1300 x 800 (production mask)
100
150
96 x 96
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website:
www.filtronic.com
3
Preliminary Datasheet v2.2
FMS2027
T
YPICAL
M
EASURED
P
ERFORMANCE
O
N
W
AFER
:
Note: Measurement Conditions V
CTRL
= -5V (low) & 0V (high), T
AMBIENT
= 25C unless otherwise stated
1
6
11
16
20
Frequency (GHz)
Insertion Loss (dB)
-5
-4
-3
-2
-1
0
RFIN_RFO1
RFIN_RFO2
1
6
11
16
20
Frequency (GHz)
Isolation (dB)
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
RFIN_RFO1
RFIN_RFO2
1
6
11
16
20
Frequency (GHz)
Return Loss on State (dB)
-40
-35
-30
-25
-20
-15
-10
-5
0
1
6
11
16
20
Frequency (GHz)
Return Loss off State (dB)
-40
-35
-30
-25
-20
-15
-10
-5
0
Large signal measurement
0
1
2
3
4
11
13
15
17
19
21
23
25
27
Input Power (dBm)
Los
s(
dB
)
10GHz
20GHz
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website:
www.filtronic.com
4
Preliminary Datasheet v2.2
FMS2027
P
REFERRED
A
SSEMBLY
I
NSTRUCTIONS
:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of solder or conductive epoxy. If epoxy is
selected then it should be applied to the
attachment surface uniformly and sparingly to
avoid encroachment of epoxy on to the top
face of the die and ideally should not exceed
half the chip height. For automated dispense
Ablestick LMISR4 is recommended and for
manual dispense Ablestick 84-1 LMI or 84-1
LMIT are recommended. These should be
cured at a temperature of 150
C for 1 hour in
an oven especially set aside for epoxy curing
only. If possible the curing oven should be
flushed with dry nitrogen.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4
m diameter gold wire
be used. Thermosonic ball bonding is
preferred. A nominal stage temperature of
150
C and a bonding force of 40g has been
shown to give effective results for 25
m wire.
Ultrasonic energy shall be kept to a minimum.
For this bonding technique, stage temperature
should not be raised above 200C and bond
force should not be raised above 60g.
Thermosonic wedge bonding and
thermocompression wedge bonding can also
be used to achieve good wire bonds.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
H
ANDLING
P
RECAUTIONS
:
To avoid damage to the devices care should
be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing. These
devices should be treated as Class 1A (0-500
V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
A
PPLICATION
N
OTES
& D
ESIGN
D
ATA
:
Application Notes and design data including S-
parameters are available; please contact
Filtronic Compound Semiconductors Ltd.
D
ISCLAIMERS
:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
RDERING
I
NFORMATION
:
P
ART
N
UMBER
D
ESCRIPTION
FMS2027-000
Die in Waffle-pack
(Gel-pak available on request)
PDF 
ZIP