Filtronic
2-26 GHz PHEMT Amplifier
Solid State
LMA208C
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Features
9dB Typical Gain
18dBm 1-dB Gain Compression Power
15dB
Input/Output Return Loss Typical
2-26GHz Frequency Bandwidth
DC Decoupled RF Input and Output
Chip Size : 1.986
mm
X1.082
mm
(.078"X.043")
Chip Thickness : 100
m
Pad Dimension : 100
m
2
Description
The Filtronic LMA208C is a medium power PHEMT amplifier that operates from 2 to 26GHz. This 5-stage travelling wave amplifier provides
10dB nominal gain and 1-dB gain compression power output of greater than 19dBm. The LMA208C is designed for use as wideband driver
amplifer in ECM (Electronic Counter-Measure) and commercial communication system applications. Ground is provided to the circuitry
through vias to the backside metallization.
Electrical Specifications at T
a
=25
C
(V
DD
=+4.0V, Zin=Zout=50
)
Absolute Maximum Ratings
Note
s:
1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
2. Specifications subject to change without notice.
DSS 009 WC
Limit
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
BW
Operating Bandwidth
2
26
GHz
S21
Small Signal Gain (2-20GHz)
@ .5Idss
7
9
dB
S21
Small Signal Gain (20-26GHz)
@ .5Idss
6
7
dB
Idss
Drain Current at Saturation
Idss @ Vg=0 V
75
162
225
mA
S21
Small Signal Gain Flatness
1.5
2.0
dB
RLin
Input Return Loss
-13
dB
RLout
Output Return Loss
-14
dB
S12
Reverse Isolation
-30
dB
P-1dB
1-dB Gain Compression Power
@ .5Idss
16
18
dBm
Psat
Saturated Output Power
21
dBm
Symbol
Parameter/Conditions
Min.
Max.
Units
Vdd
Drain Supply Voltage
7
Volts
Idd
Total Drain Current
225
mA
Pin
RF Input Power
12
dBm
Pt
Power Dissipation
1.6
W
Tch
Operating Channel Temperature
150
C
Tstg
Storage Temperature
-65
165
C
Tmax.
Max. Assembly Temp.
(1 min. max.)
300
C
Filtronic
2-26 GHz PHEMT Amplifier
Solid State
LMA208C
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Assembly Diagram
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290C. Maximum
time at temperature is 1 minute. Use of forming gas (90% N
2
, 10% H
2
) for best results.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
DSS 009 WC
Filtronic
2-26 GHz PHEMT Amplifier
Solid State
LMA208C
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Mechanical Outline
Notes:
1.) Unless Otherwise specified.
2.) All units are in micron (m).
3.) All bond pads are 100 X 100 m
2
.
4.) Bias pad (V
DD
) size is 100 X 121.5 m
2
.
DSS 009 WC
PDF 
ZIP