MPVZ5004G
Rev 1, 01/2006
Freescale Semiconductor
Technical Data
Freescale Semiconductor, Inc., 2006. All rights reserved.
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPVZ5004G series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for the appliance, consumer,
healthcare and industrial market. The analog output can be read directly into the A/
D input of Freescale microcontrollers. This transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure. The axial port has been modified to accommodate industrial
grade tubing.
Features
1.5% Maximum Error for 0 to 100 mm H
2
O over +10
to +60C with Auto Zero
2.5% Maximum Error for 100 to 400 mm H
2
O over +10
to +60C with Auto Zero
6.25% Maximum Error for 0 to 400 mm H
2
O over +10
to +60C without Auto Zero
Temperature Compensated over +10
to +60C
Available in Surface Mount (SMT) or Through-hole (DIP) Configurations
Application Examples
Washing Machine Water Level Measurement (Reference AN1950)
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Appliance Liquid Level and Pressure Measurement
Respiratory Equipment
ORDERING INFORMATION
Device
Type
Case
No.
MPVZ Series
Order No.
Packing
Options
Device
Marking
Surface Mount
1735-01
MPVZ5004GW6U
Rails
MZ5004GW
Through-Hole
1560-02
MPVZ5004GW7U
Rails
MZ5004GW
Surface Mount
482-01
MPVZ5004G6U
Rails
MZ5004G
Surface Mount
482-01
MPVZ5004G6T1
Tape & Reel
MZ5004G
Through-Hole
482B-03
MPVZ5004G7U
Rails
MZ5004G
MPVZ5004G
SERIES
PIN NUMBERS
(1)
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1
N/C
5
N/C
2
V
S
6
N/C
3
GND
7
N/C
4
V
OUT
8
N/C
INTEGRATED
PRESSURE SENSOR
0 to 3.92 kPA
(0 to 400 mm H
2
O)
1.0 to 4.9 V OUTPUT
SMALL OUTLINE PACKAGE
SURFACE MOUNT
SMALL OUTLINE PACKAGE
THROUGH-HOLE
MPVZ5004GW6U
CASE 1735-01
MPVZ5004G6U/T1
CASE 482-01
J
MPVZ5004G7U
CASE 482B-03
MPVZ5004GW7U
CASE 1560-02
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Freescale Semiconductor
MPVZ5004G
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
P
MAX
16
kPa
Storage Temperature
T
STG
30 to +100
C
Operating Temperature
T
A
0 to +85
C
Table 2. Operating Characteristics (V
S
= 5.0 V
DC
, T
A
= 25C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
Pressure Range
P
OP
0
--
3.92
400
kPa
mm H
2
O
Supply Voltage
(1)
1. Device is ratiometric within this specified excitation range.
V
S
4.75
5.0
5.25
V
DC
Supply Current
I
S
--
--
10
mAdc
Full Scale Span
(2)
@ V
S
= 5.0 Volts
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
V
FSS
--
4.0
--
V
Offset
(3)
(4)
3. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25
C.
Offset Stability:
Output deviation, after 1000 temperature cycles, -30 to 100
C, and 1.5 million pressure cycles, with minimum
rated pressure applied.
TcSpan:
Output deviation over the temperature range of 10 to 60
C, relative to 25C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60
C, relative to 25C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
, at 25
C.
V
OFF
0.75
1.0
1.25
V
Sensitivity
V/P
--
1.0
9.8
--
V/kPa
mV/mm H
2
O
Accuracy
(4) (5)
0 to 100 mm H
2
O (10 to 60
C)
100 to 400 mm H
2
O (10 to 60
C)
0 to 400 mm H
2
O (10 to 60
C)
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect
the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's
output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature
change of 5
C between autozero and measurement.
--
--
--
--
--
--
--
--
--
1.5
2.5
6.25
%V
FSS
with
auto zero
%V
FSS
with
auto zero
%V
FSS
without
auto zero
V
OUT
V
S
Sensing
Element
GND
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package device.
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Freescale Semiconductor
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MPVZ5004G
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPVZ5004G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3
shows the recommended decoupling circuit for
interfacing the output of the MPVZ5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4
and
Figure 5
shows the sensor output signal
relative to pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 10
C to 60C using the decoupling circuit shown in
Figure 3
The output will saturate outside of the specified
pressure range.
Figure 2. Cross-Sectional Diagram (Not to Scale)
Figure 3. Recommended Power Supply Decoupling and
Output Filtering.
(For additional output filtering, please refer to Application
Note AN1646.)
Figure 4. Output versus Pressure Differential
at 6.25% V
FSS
(without auto zero, note 5 in
Operating Characteristics)
Figure 5. Output versus Pressure Differential
at 2.5% V
FSS
(with auto zero, note 5 in
Operating Characteristics)
Fluorosilicone
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
Lead Frame
+5 V
1.0
F
0.01
F
470 pF
GND
V
s
V
out
IPS
OUTPUT
Differential Pressure (kPa)
Ou
tp
u
t
(
V
)
4.0
3.0
2.0
1.0
0
0
2.0
3.0
4.0
5.0
1.0
TRANSFER FUNCTION:
V
out
= V
S
*[(0.2*P) + 0.2]
6.25% V
FSS
V
S
= 5.0 Vdc
TEMP = 10 to 60
C
Differential Pressure (kPa)
Out
put
(V)
4.0
3.0
2.0
1.0
0
0
2.0
3.0
4.0
5.0
1.0
MIN
TYPICAL
TRANSFER FUNCTION:
V
out
= V
S
*[(0.2*P) + 0.2]
2.5% V
FSS
V
S
= 5.0 Vdc
TEMP = 10 to 60
C
MAX
MIN
TYPICAL
MAX
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Freescale Semiconductor
MPVZ5004G
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing a gel
die coat which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 6. SOP Footprint (Case 482)
Part Number
Case Type
Pressure (P1) Side Identifier
MPVZ5004GW6U
1735-01
Vertical Port Attached
MPVZ5004GW7U
1560-02
Vertical Port Attached
MPVZ5004G6U/T1
482-01
Stainless Steel Cap
MPVZ5004G7U
482B-03
Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
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MPVZ5004G
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 1 OF 3
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MPVZ5004G
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 2 OF 3
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MPVZ5004G
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 3 OF 3
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PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
PAGE 1 OF 3
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MPVZ5004G
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
PAGE 2 OF 3
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PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
PAGE 3 OF 3
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MPVZ5004G
PACKAGE DIMENSIONS
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010)
A
S
T
-A-
-B-
N
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
5.38
0.230
0.212
5.84
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.405
0.415
10.29
10.54
S
0.709
0.725
18.01
18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
MILLIMETERS
INCHES
0.100 BSC
2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
MIN
0.415
0.415
0.210
0.026
0.009
0.100
0
0.405
0.540
MAX
0.425
0.425
0.220
0.034
0.011
0.120
15
0.415
0.560
MIN
10.54
10.54
5.33
0.66
0.23
2.54
0
10.29
13.72
MAX
10.79
10.79
5.59
0.864
0.28
3.05
15
10.54
14.22
PIN 1 IDENTIFIER
K
SEATING
PLANE
-T-
DETAIL X
S
G
4
5
8
1
-A-
-B-
C
M
J
N
D
8 PL
S
B
M
0.25 (0.010)
A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
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MPVZ5004G
Rev. 1
01/2006
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