MPXV5050VC6T1
Rev 1, 05/2005
Freescale Semiconductor
Technical Data
MPXV5050VC6T1
Sensors
Freescale Semiconductor
1
High Temperature Accuracy
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV5050VC6T1 sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make the Freescale Semiconductor, Inc. pressure sensor a logical and
economical choice for the system designer.
The MPXV5050VC6T1 piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1
shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
Features
2.5% Maximum Error over 0
to 85C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from Over 40
to +125C
Patented Silicon Shear Stress Strain Gauge
Durable Thermoplastic (PPS) Surface Mount Package
Easy-to-Use Chip Carrier Option
Ideal for Automotive and Non-Automotive Applications
Typical Applications
Vacuum Pump Monitoring
Figure 1. Fully Integrated Pressure Sensor Schematic
ORDERING INFORMATION
Device
Type
Options
Case
No.
MPX Series
Order No.
Packing
Options
Device Marking
Ported
Element
Vacuum,
Axial Port
482A
MPXV5050VC6T1
Tape & Reel MPXV5050VC6T1
MPXV5050VC6T1
INTEGRATED
PRESSURE SENSOR
50 to 0 kPa (7.25 to 0 psi)
0.1 to 4.6 Volts Output
MPXV5050VC6T1
CASE 482A-01
SMALL OUTLINE PACKAGE
PIN NUMBER
(1)
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1
N/C
5
N/C
2
V
S
6
N/C
3
GND
7
N/C
4
V
OUT
8
N/C
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
S
V
out
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
MPXV5050VC6T1
Sensors
2
Freescale Semiconductor
Table 1. Maximum Ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol
Value
Units
Maximum Pressure (P1 > P2)
P
max
200
kPa
Storage Temperature
T
stg
40 to +125
C
Operating Temperature
T
A
40 to +125
C
Table 2. Operating Characteristics
(
V
S
= 5.0 Vdc, T
A
= 25C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
P
OP
50
--
0
kPa
Supply Voltage
(1)
1. Device is ratiometric within this specified excitation range.
V
S
4.75
5.0
5.25
Vdc
Supply Current
I
o
--
7.0
10
mAdc
Full Scale Output
(2)
(0 to 85
C)
@ V
S
= 5.0 Volts
(P
diff
= 0 kPa)
2. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
V
FSO
4.488
4.6
4.713
Vdc
Full Scale Span
(3)
(0 to 85
C)
@ V
S
= 5.0 Volts
3. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
V
FSS
--
4.5
--
Vdc
Accuracy
(4)
(0 to 85
C)
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25C due to all sources of errors, including the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25C.
TcSpan:
Output deviation over the temperature range of 0 to 85C, relative to 25C.
TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C.
--
--
--
2.5
%V
FSS
Sensitivity
V/P
--
90
---
mV/kPa
Response Time
(5)
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
t
R
--
1.0
---
ms
Warm-Up Time
(6)
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
--
--
20
---
ms
Offset Stability
(7)
7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
--
--
0.5
---
%V
FSS
Pressure Offset
(8)
(0 to 85
C)
8. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
V
off
0
0.1
0.213
Vdc
MPXV5050VC6T1
Sensors
Freescale Semiconductor
3
Figure 2. Cross-Sectional Diagram
(not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
TRANSFER FUNCTION MPXV5050VC6T1
Figure 4. Output versus Absolute Pressure
Figure 4
shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85
C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The
MPXV5050VC6T1 pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information
regarding media compatibility in your application.
DIFFERENTIAL SENSING ELEMENT
P2
WIRE BOND
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
DIE BOND
LEAD
FRAME
DIE
FLUOROSILICONE
GEL DIE COAT
P1
+5 V
1.0
F
0.01
F
470 pF
GND
V
s
V
out
IPS
OUTPUT
0
10
20
30
40
50
Pressure (kPa)
1
2
3
4
5
0
Outp
ut Volt
age (V)
Offset
(Typ)
Span
Ra
nge
(Typ)
Ou
tpu
t
Rang
e
(Ty
p
)
Transfer Function:
V
out
= V
S
x (0.018 x P + 0.92) (PE x TM x 0.018 x V
s
)
V
s
= 5.0 0.25 vdc
PE = 1.25
TM = 1
Temperature = 0 to 85
C
MAX
MIN
TYPICAL
Transfer Function MPXV5050VC Series
MPXV5050VC6T1
Sensors
4
Freescale Semiconductor
Nominal Transfer Value:
V
out
= V
S
x (0.018 x P + 0.92)
(Pressure Error x Temp Multi x 0.018 x V
S
)
V
S
= 5.0
0.25 V
Transfer Function (MPXV5050VC6T1
Temp
Multiplier
40
3
0 to 85
1
+125
3
Temperature in C
4.0
3.0
2.0
0.0
1.0
40
20
0
20
40
60
140
120
100
80
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0C to 40C and from 85C to 125C.
Temperature Error Band
Pressure
Error (Max)
Pressure Error Band
50 to 0 kPa
1.25 kPa
MPXV5050V
50
0
Pressure (in kPa)
Pres
sur
e
Error
(k
Pa)
40
30
20
10
1.25
1.25
0
0.75
1.00
0.75
1.00
MPXV5050V
Error Limits for Pressure
MPXV5050V
Break Points
MPXV5050VC6T1
Sensors
Freescale Semiconductor
5
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint (Case 482A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP
2.54
0.300
7.62
inch
mm
PACKAGE DIMENSIONS
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.444
0.448
11.28
11.38
S
0.709
0.725
18.01
18.41
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010)
A
T
-A-
-B-
N
S
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV5050VC6T1
Sensors
6
Freescale Semiconductor
MPXV5050VC6T1
Sensors
Freescale Semiconductor
7
NOTES
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MPXV5050VC6T1
Rev. 1
05/2005
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