Document Number: MPXV7002
Rev 0, 09/2005
Freescale Semiconductor
Technical Data
Freescale Semiconductor, Inc., 2005. All rights reserved.
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7002 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
2.5% Typical Error over +10
C to +60C with Auto Zero
6.25% Maximum Error over +10
C to +60C without Auto Zero
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Thermoplastic (PPS) Surface Mount Package
Temperature Compensated over +10
to +60C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
Typical Applications
Hospital Beds
HVAC
Respiratory Systems
Process Control
ORDERING INFORMATION
Device
Type
Options
Case
No.
MPX Series
Order No.
Packing
Options
Device
Marking
SMALL OUTLINE PACKAGE (MPXV7002 SERIES)
Ported
Elements
Gauge, Axial Port, SMT
482A
MPXV7002GC6U
Rails MPXV7002G
Gauge, Axial Port, SMT
482A
MPXV7002GC6T1 Tape &
Reel
MPXV7002G
Gauge, Side Port, SMT
1369
MPXV7002GP
Trays MPXV7002G
Differential, Dual Port,
SMT
1351
MPXV7002DP
Trays MPXV7002G
Differential, Dual Port,
SMT
1351
MPXV7002DPT1
Tape &
Reel
MPXV7002G
MPXV7002
SERIES
INTEGRATED
PRESSURE SENSOR
-2 to 2 kPa (-0.3 to 0.3 psi)
0.5 to 4.5 V OUTPUT
SMALL OUTLINE PACKAGE
PIN NUMBERS
(1)
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1
N/C
5
N/C
2
V
S
6
N/C
3
Gnd
7
N/C
4
V
out
8
N/C
MPXV7002DP
CASE 1351-01
MPXV7002GP
CASE 1369-01
SMALL OUTLINE PACKAGE
MPXV7002GC6U
CASE 482A-01
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
S
V
out
GND
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
MPXV7002
Sensors
2
Freescale Semiconductor
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
P
max
8.0
kPa
Storage Temperature
T
stg
30 to +100
C
Operating Temperature
T
A
10 to +60
C
Table 2. Operating Characteristics
(
V
S
= 5.0 Vdc, T
A
= 25C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
(1)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
P
OP
2.0
--
2.0
kPa
Supply Voltage
(2)
2. Device is ratiometric within this specified excitation range.
V
S
4.75
5.0
5.25
Vdc
Supply Current
I
o
--
--
10
mAdc
Pressure Offset
(3)
(10 to 60
C)
@ V
S
= 5.0 Volts
3. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
V
off
2.25
2.5
2.75
Vdc
Full Scale Output
(4)
(10 to 60
C)
@ V
S
= 5.0 Volts
4. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
V
FSO
4.25
4.5
4.75
Vdc
Full Scale Span
(5)
(10 to 60
C)
@ V
S
= 5.0 Volts
5. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
V
FSS
3.5
4.0
4.5 V
Vdc
Accuracy
(6)
(10 to 60
C)
6. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25
C.
TcSpan:
Output deviation over the temperature range of 10
to 60C, relative to 25C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10
to 60C, relative to
25
C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
, at 25
C.
--
--
2.5
(7)
7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can
affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the
device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum
temperature change of 5
C between autozero and measurement.
6.25
%V
FSS
Sensitivity
V/P
--
1.0
---
V/kPa
Response Time
(8)
8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
t
R
--
1.0
---
ms
Output Source Current at Full Scale Output
I
O+
--
0.1
---
mAdc
Warm-Up Time
(9)
9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
--
--
20
---
ms
MPXV7002
Sensors
Freescale Semiconductor
3
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPXV7002 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3
shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
10
to 60C using the decoupling circuit shown in
Figure 3
.
The output will saturate outside of the specified pressure
range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Figure 4. Output versus Pressure Differential
Fluoro Silicone
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
+5 V
1.0
F
0.01
F
470 pF
GND
V
s
V
out
IPS
OUTPUT
Lead
Frame
Differential Pressure (kPa)
Ou
tpu
t
Volt
age (V)
5.0
4.0
3.0
2.0
1.0
0
0
2
TYPICAL
MIN
-2
-1
1
Transfer Function:
V
out
= V
S
(0.2 P(kPa)+0.5) 6.25% V
FSS
V
S
= 5.0 Vdc
T
A
= 10 to 60C
MAX
MPXV7002
Sensors
4
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. Small Outline Package Footprint
Part Number
Case Type
Pressure (P1)
Side Identifier
MPXV7002GC6U/GC6T1
482A-01
Vertical Port Attached
MPXV7002GP
1369-01
Side with Port Attached
MPXV7002DP
1351-01
Side with Dual Port Attached
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
MPXV7002
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.444
0.448
11.28
11.38
S
0.709
0.725
18.01
18.41
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010)
A
T
-A-
-B-
N
S
MPXV7002
Sensors
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Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPXV7002
Sensors
Freescale Semiconductor
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PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
MPXV7002
Sensors
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PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPXV7002
Sensors
Freescale Semiconductor
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PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
MPXV7002
Rev. 0
09/2005
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