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Электронный компонент: MRF5S21130HSR3

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MRF5S21130HR3 MRF5S21130HSR3
1
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
Designed for W-CDMA base station applications at frequencies from 2110
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-
tions. To be used in Class AB for PCN - PCS/cellular radio and WLL
applications.
Typical 2-carrier W-CDMA Performance: V
DD
= 28 Volts, I
DQ
= 1200 mA,
P
out
= 28 Watts Avg., Full Frequency Band, Channel Bandwidth =
3.84 MHz, Peak/Avg. = 8.5 dB @ 0.01% Probability on CCDF.
Power Gain -- 13.5 dB
Efficiency -- 26%
IM3 @ 10 MHz Offset -- -37 dBc @ 3.84 MHz Channel Bandwidth
ACPR @ 5 MHz Offset -- -39 dBc @ 3.84 MHz Channel Bandwidth
Capable of Handling 10:1 VSWR, @ 28 Vdc, 2140 MHz, 92 Watts CW
Output Power
Characterized with Series Equivalent Large-Signal Impedance Parameters
Internally Matched, Controlled Q, for Ease of Use
Qualified Up to a Maximum of 32 V
DD
Operation
Integrated ESD Protection
Lower Thermal Resistance Package
Low Gold Plating Thickness on Leads, 40
Nominal.
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain-Source Voltage
V
DSS
-0.5, +65
Vdc
Gate-Source Voltage
V
GS
-0.5, +15
Vdc
Total Device Dissipation @ T
C
= 25C
Derate above 25C
P
D
372
2.13
W
W/C
Storage Temperature Range
T
stg
- 65 to +150
C
Operating Junction Temperature
T
J
200
C
CW Operation
CW
92
W
Table 2. Thermal Characteristics
Characteristic
Symbol
Value
(1,2)
Unit
Thermal Resistance, Junction to Case
Case Temperature 80C, 92 W CW
Case Temperature 76C, 28 W CW
R
JC
0.44
0.47
C/W
1. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access
the MTTF calculators by product.
2. Refer to AN1955/D, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
MRF5S21130H
Rev. 2, 1/2005
Freescale Semiconductor
Technical Data
MRF5S21130HR3
MRF5S21130HSR3
2170 MHz, 28 W AVG., 28 V
2 x W-CDMA
LATERAL N-CHANNEL
RF POWER MOSFETs
CASE 465C-02, STYLE 1
NI-880S
MRF5S21130HSR3
CASE 465B-03, STYLE 1
NI-880
MRF5S21130HR3
Freescale Semiconductor, Inc., 2005. All rights reserved.
2
RF Device Data
Freescale Semiconductor
MRF5S21130HR3 MRF5S21130HSR3
Table 3. ESD Protection Characteristics
Test Conditions
Class
Human Body Model
2 (Minimum)
Machine Model
M4 (Minimum)
Charge Device Model
C7 (Minimum)
Table 4. Electrical Characteristics
(T
C
= 25C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
= 65 Vdc, V
GS
= 0 Vdc)
I
DSS
--
--
10
Adc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 28 Vdc, V
GS
= 0 Vdc)
I
DSS
--
--
1
Adc
Gate-Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
I
GSS
--
--
1
Adc
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 300 Adc)
V
GS(th)
2.5
2.7
3.5
Vdc
Gate Quiescent Voltage
(V
DS
= 28 Vdc, I
D
= 1200 mAdc)
V
GS(Q)
--
3.7
--
Vdc
Drain-Source On-Voltage
(V
GS
= 10 Vdc, I
D
= 3 Adc)
V
DS(on)
--
0.26
0.3
Vdc
Forward Transconductance
(V
DS
= 10 Vdc, I
D
= 3 Adc)
g
fs
--
7.5
--
S
Dynamic Characteristics
(1)
Reverse Transfer Capacitance
(V
DS
= 28 Vdc 30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
C
rss
--
2.6
--
pF
Functional Tests (In Freescale Test Fixture, 50 ohm system) V
DD
= 28 Vdc, I
DQ
= 1200 mA, P
out
= 28 W Avg., f1 = 2112.5 MHz,
f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz, 2-carrier W-CDMA, 3.84 MHz Channel Bandwidth Carriers, ACPR measured in
3.84 MHz Channel Bandwidth @ 5 MHz Offset. IM3 measured in 3.84 MHz Channel Bandwidth @ 10 MHz Offset. Peak/Avg. = 8.5 dB @
0.01% Probability on CCDF.
Power Gain
G
ps
12
13.5
--
dB
Drain Efficiency
D
24
26
--
%
Intermodulation Distortion
IM3
-37
-35
dBc
Adjacent Channel Power Ratio
ACPR
--
-39
-37
dBc
Input Return Loss
IRL
--
-12
-9
dB
1. Part is internally matched both on input and output.
MRF5S21130HR3 MRF5S21130HSR3
3
RF Device Data
Freescale Semiconductor
R1
V
BIAS
Z7
RF
INPUT
Z9
C15
+
C20
C11
+
C13
+
V
SUPPLY
RF
OUTPUT
DUT
C1
C3
R2
C9
C5
C10
C6
Z6
Z10
C8
C7
Z1
Z2
Z3
Z4
Z5
Z11
Z16
Z15
Z14
Z13
Z12
Z8
C17
C18
C19
C16
+
C12
+
C14
C2
+
C4
+
Figure 1. MRF5S21130HR3(SR3) Test Circuit Schematic
Z9, Z10
0.709 x 0.083 Microstrip
Z11
0.415 x 1.000 Microstrip
Z12
0.531 x 0.083 Microstrip
Z13
0.994 x 0.083 Microstrip
Z14, Z15
0.070 x 0.220 Microstrip
Z16
0.430 x 0.083 Microstrip
PCB
Taconic TLX8, 0.030,
r
= 2.55
Z1
0.500 x 0.083 Microstrip
Z2
0.995 x 0.083 Microstrip
Z3
0.905 x 0.083 Microstrip
Z4
0.159 x 1.024 Microstrip
Z5
0.117 x 1.024 Microstrip
Z6, Z7
0.749 x 0.083 Microstrip
Z8
0.117 x 1.000 Microstrip
Table 5. MRF5S21130HR3(SR3) Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2, C13, C14, C15, C16
10 F, 35 V Tantalum Capacitors
293D1106X9035D
Vishay -Sprague
C3, C4, C11, C12
220 nF Chip Capacitors (1812)
1812Y224KXA
Vishay -Vitramon
C5, C6, C7, C9, C10, C18, C19
6.8 pF 100B Chip Capacitors
100B6R8CW
ATC
C8
0.1 pF 100B Chip Capacitor
100B0R1BW
ATC
C17
0.5 pF 100B Chip Capacitor
100B0R5BW
ATC
C20
220 F, 63 V Electrolytic Capacitor, Radial
13668221
Philips
R1, R2
1 kW, 1/4 W Chip Resistors
4
RF Device Data
Freescale Semiconductor
MRF5S21130HR3 MRF5S21130HSR3
Figure 2. MRF5S21130HR3(SR3) Test Circuit Component Layout
MRF5S21130
C1
R1
R2
C7
C8
C3
C5
C4
C6
C9
C11
C13 C15
C10
C12
C14 C16
C17
C19
C18
C20
C2
CUT
OUT

AREA
Rev 0
Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor
signature/logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will have
no impact on form, fit or function of the current product.
MRF5S21130HR3 MRF5S21130HSR3
5
RF Device Data
Freescale Semiconductor
TYPICAL CHARACTERISTICS
2220
2060
IRL
G
ps
ACPR
IM3
f, FREQUENCY (MHz)
Figure 3. 2-Carrier W-CDMA Broadband Performance
IM3 (dBc),
ACPR
(dBc)
G
ps
, POWER GAIN (dB)
-30
-10
-15
-20
-25
INPUT
RETURN LOSS (dB)
IRL,
V
DD
= 28 Vdc, P
out
= 28 W (Avg.), I
DQ
= 1200 mA
2-Carrier W-CDMA, 10 MHz Carrier Spacing,
3.84 MHz Channel Bandwidth, Peak/Avg. = 8.5 dB
@ 0.01% Probability (CCDF)
2200
2180
2160
2140
2120
2100
2080
6
14
13
12
11
10
9
8
7
-44
35
30
25
20
-28
-32
-36
-40
1000
11
15
1
I
DQ
= 1600 mA
1400 mA
P
out
, OUTPUT POWER (WATTS) PEP
Figure 4. Two-Tone Power Gain versus
Output Power
G
ps
, POWER GAIN (dB)
V
DD
= 28 Vdc
f1 = 2135 MHz, f2 = 2145 MHz
Two-Tone Measurement, 10 MHz Tone Spacing
800 mA
1200 mA
1000 mA
10
100
14.5
14
13.5
13
12.5
12
11.5
1000
-65
-25
1
P
out
, OUTPUT POWER (WATTS) PEP
Figure 5. Third Order Intermodulation Distortion
versus Output Power
IMD, THIRD
ORDER
INTERMODULA
TION DIST
ORTION
(dBc)
100
10
-30
-35
-40
-45
-50
-55
-60
1000 mA
800 mA
I
DQ
= 1600 mA
1200 mA
1400 mA
V
DD
= 28 Vdc
f1 = 2135 MHz,
f2 = 2145 MHz
Two-Tone Measurement,
10 MHz Tone Spacing
100
-60
-25
0.1
TWO-TONE SPACING (MHz)
Figure 6. Intermodulation Distortion Products
versus Tone Spacing
INTERMODULA
TION DIST
ORTION
(dBc)
IMD,
1
10
-30
-35
-40
-45
-50
-55
47
57
33
Ideal
P1dB = 51.88 dBm (154.17 W)
Actual
P
in
, INPUT POWER (dBm)
Figure 7. Pulse CW Output Power versus
Input Power
P out
,
OUTPUT
POWER (dBm)
V
DD
= 28 Vdc, I
DQ
= 1200 mA
Pulsed CW, 5
sec(on), 1 msec(off)
Center Frequency = 2140 MHz
P3dB = 52.58 dBm (181.1 W)
55
53
49
34
38
40
42
45
V
DD
= 28 Vdc, P
out
= 130 W (PEP), I
DQ
= 1200 mA
Two-Tone Measurements, Center Frequency = 2140 MHz
3rd Order
5th Order
7th Order
D
, DRAIN
EFFICIENCY (%)
D
51
35
36
37
39
41
43
44
46
6
RF Device Data
Freescale Semiconductor
MRF5S21130HR3 MRF5S21130HSR3
TYPICAL CHARACTERISTICS
0
35
5
-55
-20
G
ps
ACPR
P
out
, OUTPUT POWER (WATTS) AVG. (W-CDMA)
Figure 8. 2-Carrier W-CDMA ACPR, IM3, Power
Gain and Drain Efficiency versus Output Power
IM3 (dBc),
ACPR
(dBc)
10
15
20
25
30
35
40
45
30
-25
25
-30
20
-35
15
-40
10
-45
5
-50
IM3
V
DD
= 28 Vdc, I
DQ
= 1200 mA, f1 = 2135 MHz,
f2 = 2145 MHz, 2 x W-CDMA, 10 MHz @
3.84 MHz Bandwidth, Peak/Avg. = 8.5 dB
@ 0.01% Probability (CCDF)
TYPICAL CHARACTERISTICS
W-CDMA TEST SIGNAL
D
D
,
, DRAIN EFFICIENCY

(%),
G
ps
, POWER GAIN (dB)
220
10
9
100
T
J
, JUNCTION TEMPERATURE (
C)
Figure 9. MTTF Factor versus Junction Temperature
This above graph displays calculated MTTF in hours x ampere
2
drain current. Life tests at elevated temperatures have correlated to
better than
10% of the theoretical prediction for metal failure. Divide
MTTF factor by I
D
2
for MTTF in a particular application.
10
8
10
7
10
6
120
140
160
180
200
MTTF
F
ACT
OR
(HOURS
x
AMPS )
2
10
0.0001
100
0
PEAK-TO-AVERAGE (dB)
Figure 10. CCDF W-CDMA 3GPP, Test Model 1,
64 DPCH, 67% Clipping, Single Carrier Test Signal
PROBABILITY
(%)
10
1
0.1
0.01
0.001
2
4
6
8
20
5
15
10
0
-5
-10
-15
-20
-25
25
Figure 11. 2-Carrier W-CDMA Spectrum
f, FREQUENCY (MHz)
-110
-120
-70
-20
-80
-60
-50
(dB)
-90
-100
-40
-30
3.84 MHz
Channel BW
-IM3 @
3.84 MHz BW
+IM3 @
3.84 MHz BW
-ACPR @
3.84 MHz BW
+ACPR @
3.84 MHz BW
MRF5S21130HR3 MRF5S21130HSR3
7
RF Device Data
Freescale Semiconductor
Figure 12. Series Equivalent Source and Load Impedance
f
MHz
Z
source
Z
load
2080
2110
2140
1.51 - j2.97
1.59 - j2.68
1.52 - j2.54
2.87 - j9.49
3.13 - j9.86
4.05 - j10.90
V
DD
= 28 Vdc, I
DQ
= 1200 mA, P
out
= 28 W Avg.
Z
o
= 25
Z
load
f = 2080 MHz
f = 2200 MHz
Z
source
f = 2080 MHz
f = 2200 MHz
2170
2200
1.54 - j3.13
1.62 - j2.70
4.80 - j11.75
5.55 - j11.87
Z
source
= Test circuit impedance as measured from
gate to ground.
Z
load
= Test circuit impedance as measured
from drain to ground.
Z source
Z load
Input
Matching
Network
Device
Under
Test
Output
Matching
Network
8
RF Device Data
Freescale Semiconductor
MRF5S21130HR3 MRF5S21130HSR3
NOTES
MRF5S21130HR3 MRF5S21130HSR3
9
RF Device Data
Freescale Semiconductor
NOTES
10
RF Device Data
Freescale Semiconductor
MRF5S21130HR3 MRF5S21130HSR3
NOTES
MRF5S21130HR3 MRF5S21130HSR3
11
RF Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 465B-03
ISSUE B
NI-880
MRF5S21130HR3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M-1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
4. DELETED
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.335
1.345
33.91
34.16
B
0.535
0.545
13.6
13.8
C
0.147
0.200
3.73
5.08
D
0.495
0.505
12.57
12.83
E
0.035
0.045
0.89
1.14
F
0.003
0.006
0.08
0.15
G
1.100 BSC
27.94 BSC
H
0.057
0.067
1.45
1.70
K
0.170
0.210
4.32
5.33
N
0.871
0.889
19.30
22.60
Q
.118
.138
3.00
3.51
R
0.515
0.525
13.10
13.30
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
1
3
2
D
G
K
C
E
H
F
Q
2X
M
A
M
bbb
B
M
T
M
A
M
bbb
B
M
T
B
B
(FLANGE)
SEATING
PLANE
M
A
M
ccc
B
M
T
M
A
M
bbb
B
M
T
A
A
(FLANGE)
T
N
(LID)
M
(INSULATOR)
S
M
A
M
aaa
B
M
T
(INSULATOR)
R
M
A
M
ccc
B
M
T
(LID)
S
0.515
0.525
13.10
13.30
M
0.872
0.888
22.15
22.55
aaa
0.007 REF
0.178 REF
bbb
0.010 REF
0.254 REF
ccc
0.015 REF
0.381 REF
CASE 465C-02
ISSUE A
NI-880S
MRF5S21130HSR3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M-1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.905
0.915
22.99
23.24
B
0.535
0.545
13.60
13.80
C
0.147
0.200
3.73
5.08
D
0.495
0.505
12.57
12.83
E
0.035
0.045
0.89
1.14
F
0.003
0.006
0.08
0.15
H
0.057
0.067
1.45
1.70
K
0.170
0.210
4.32
5.33
N
0.871
0.889
19.30
22.60
R
0.515
0.525
13.10
13.30
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
1
SEATING
PLANE
2
D
K
C
E
H
F
M
A
M
bbb
B
M
T
B
B
(FLANGE)
M
A
M
ccc
B
M
T
M
A
M
bbb
B
M
T
A
A
(FLANGE)
T
N
(LID)
M
(INSULATOR)
M
A
M
ccc
B
M
T
M
A
M
aaa
B
M
T
R
(LID)
S
(INSULATOR)
S
0.515
0.525
13.10
13.30
M
0.872
0.888
22.15
22.55
bbb
0.010 REF
0.254 REF
ccc
0.015 REF
0.381 REF
aaa
0.007 REF
0.178 REF
12
RF Device Data
Freescale Semiconductor
MRF5S21130HR3 MRF5S21130HSR3
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MRF5S21130H
Rev. 2, 1/2005
Document Number: