The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
FUJITSU SEMICONDUCTOR
DATA SHEET
THIN SHRINK SMALL OUTLINE PACKAGE
20 PIN PLASTIC
20-pin plastic TSSOP
Lead pitch
0.65 mm
Package width
package length
4.40
6.50 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.20 mmMAX
Weight
0.08g
Code
(Reference)
P-TSSOP20-4.4
6.5-0.65
20-pin plastic TSSOP
(FPT-20P-M04)
(FPT-20P-M04)
C
2003 FUJITSU LIMITED F20014S-c-3-6
6.500.10(.256.004)
4.400.10
6.400.20
(.252.008)
(.173.004)
(Mounting height)
0.10(.004)
0.65(.026)
0.240.08
(.009.003)
1
10
20
11
"A"
0.050.05
(Stand off)
0.170.03
(.007.001)
M
0.13(.005)
(.002.002)
Details of "A" part
0~8
(.024.006)
0.600.15
(.020.008)
0.500.20
0.25(.010)
LEAD No.
INDEX
1.100.10
(.043.004)
*
1
*
2
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
FPT-20P-M04
0212
Note 1)
*
1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2)
*
2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
PDF 
ZIP