1N5550 THRU 1N5552
GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 200 to 1000 Volts
Forward Current - 3.0 Amperes
FEATURES
Glass passivated cavity-free junction
High temperature metallurgically bonded construction
Hermetically sealed package
Capable of meeting
environmental
standards of
MIL-S-19500
Medium switching for
improved efficiency
High temperature soldering guaranteed:
350C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Solid glass body
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.037 ounce, 1.04 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
1N5550
1N5551
1N5552
UNITS
*Maximum repetitive peak reverse voltage
V
RRM
200
400
600
Volts
Maximum RMS voltage
V
RMS
140
280
420
Volts
*Maximum DC blocking voltage
V
DC
200
400
600
Volts
*Minimum reverse breakdown voltage at 50
A
V
(BR)
240
460
660
Volts
*Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55C
I
(AV
)
3.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
I
FSM
100.0
Amps
Maximum instantaneous forward voltage at 9.0A
V
F
1.2
Volts
*Maximum DC reverse current
T
A
=25C 1.0
at rated DC blocking voltage
T
A
=100C
I
R
25.0
A
T
A
=200C
1500.0
*Maximum junction capacitance
(NOTE 1
)
C
J
150
120
100
pF
*Maximum reverse recovery time
(NOTE 2)
t
rr
2.0
s
Typical thermal resistance
(NOTE 3
)
R
JA
22.0
C/W
R
JL
12.0
*Operating and storage temperature range
T
J
, T
STG
-65 to +200
C
NOTES:
(1) Measured at 1.0 MH
Z
and applied reverse voltage of 12.0 Volts
(2) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length,
with both leads mounted between heat sinks.
*JEDEC registered values
4/98
PA
TENTED*
0.180 (4.6)
0.115 (2.9)
0.042 (1.07)
0.038 (0.962)
DIA.
DIA.
MAX.
0.300 (7.6)
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
Case Style G4
Dimensions in inches and (millimeters)
*
Brazed-lead assembly is covered by Patent No. 3,930,306
0
25
50
75
100
125
150
175
200
0
1.0
2.0
3.0
4.0
5.0
1
10
100
10
100
200
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01
0.1
1
10
50
10
100
1
10
100
0
20
40
60
80
100
0.01
0.1
1
10
20
RATINGS AND CHARACTERISTIC CURVES 1N5550 THRU 1N5552
FIG. 1 - FORWARD CURRENT DERATING CURVE
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
RESISTIVE OR INDUCTIVE LOAD
T
A
, AMBIENT
TEMPERATURE
T
L,
LEAD TEMPERATURE
P.C.B. MOUNTED,
0.375" (9.5mm) LEAD LENGTH
T
J
=150
C
T
J
=25
C
PULSE WIDTH=300
s
1% DUTY CYCLE
TEMPERATURE,
C
NUMBER OF CYCLES AT 60 H
z
INSTANTANEOUS FORWARD REVERSE VOLTAGE,
VOLTS
AVERAGE FORWARD CURRENT,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
AVERAGE FORWARD CURRENT,
AMPERES
INSTANTANEOUS FORWARD CURRENT,
AMPERES
L = 0.375" (9.5mm)
0.8 x 0.8 x .040"
(20 x 20 x 1mm)
COPPER
HEATSINKS
T
J
=T
J
max.
8.3ms SINGLE HALF
SINE-WAVE(JEDEC Method)
REVERSE VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION
CAPACITANCE, pF
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
FIG. 4 -TYPICAL REVERSE CHARACTERISTICS
AVERAGE FORWARD CURRENT,
AMPERES
T
J
=75
C
T
J
=125
C
T
J
=25
C
f=1.0 MHz
Vsig=50mVp-p
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