1N5615 thru 1N5623
Vishay Semiconductors
formerly General Semiconductor
Document Number 88521
www.vishay.com
28-Feb-02
1
Glass Passivated Fast
Switching Rectifier
Reverse Voltage 200 to 1000V
Forward Current 1.0A
Patented*
0.034 (0.86)
0.028 (0.71)
DIA.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
1.0 (25.4)
MIN.
Maximum Ratings & Thermal Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Parameter
Symbol 1N5615 1N5617 1N5619 1N5621 1N5623
Unit
*Maximum repetitive peak reverse voltage
V
RRM
200
400
600
800
1000
V
Maximum RMS voltage
V
RMS
140
280
420
560
700
V
*Maximum DC blocking voltage
V
DC
200
400
600
800
1000
V
*Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
= 55C
I
F(AV)
1.0
A
*Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
I
FSM
50
A
Typical thermal resistance
(Note 1)
R
JA
55
C/W
*Operating junction temperature range
T
J
65 to +175
C
*Storage temperature range
T
STG
65 to +200
C
Electrical Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
*Minimum reverse breakdown voltage at 50
A
V
(BR)
220
440
660
880
1100
V
*Maximum instantaneous forward voltage at 1.0A
V
F
1.2
V
*Maximum DC reverse current
T
A
= 25C
0.5
at rated DC blocking voltage
T
A
= 100C
I
R
25
A
T
A
= 200C
1500
*Maximum reverse recovery time
at I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A
t
rr
150
150
250
300
500
ns
*Maximum junction capacitance at 12V, 1MHz
C
J
45
35
25
20
15
pF
Note: (1) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
*JEDEC registered values
Features
High temperature metallurgically bonded construction
Hermetically sealed package
Cavity-free glass passivated junction
1.0 ampere operation at T
A
=55C with no thermal runaway
Typical I
R
less than 0.1
A
Capable of meeting environmental standards of
MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed: 350C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-204AP Solid glass body
Terminals: Solder plated axial leads,
solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 oz., 0.56 g
*
Brazed-lead assembly
is covered by
Patent No. 3,930,306
Dimensions in inches
and (millimeters)
DO204AP
1N5615 thru 1N5623
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88521
2
28-Feb-02
Ratings and
Characteristic Curves
(T
A
= 25C unless otherwise noted)
0
20
10
30
40
50
1
100
10
Fig. 2 Maximum Non-Repetitive Peak
Forward Surge Current
Instantaneous Surge Current (A)
Number of Cycles at 60 H
Z
0
0.75
1.0
25
50
75
100
125
150
175
Fig. 1 Maximum Forward Current
Derating Curve
A
v
er
age F
orw
ard Rectified Current (A)
Ambient Temperature (
C)
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
Fig. 3 Typical Instantaneous
Forward Characteristics
0
20
60
40
100
80
Fig. 4 Typical Reverse Leakage
Characteristics
Instantaneous Re
v
erse Leakage Current
(
A)
Percent of Rated Peak Reverse Voltage (%)
0.5
0.25
Resistive or Inductive Load
0.375" (9.5mm) Lead Length
T
J
= T
J
max.
8.3ms Single Half Sine-Wave
(JEDEC Method)
0.01
0.1
10
1
Instantaneous F
orw
ard Current (A)
T
J
= 125
C
T
J
= 25
C
Reverse Voltage (V)
J
unction Capacitance (pF)
1
10
100
30
10
1
0.01
0.1
10
20
1
T
J
= 75
C
Fig. 5 Typical Junction Capacitance
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