EGP50A THRU EGP50G
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage - 50 to 400 Volts Forward Current - 5.0 Amperes
FEATURES
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
Glass passivated cavity-free junction
Superfast recovery time for high efficiency
Low forward voltage, high
current capability
Low leakage current
High surge current capability
High temperature metallurgically bonded construction
High temperature soldering guaranteed:
300C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic over solid glass body
Terminals: Axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.03 ounce, 0.8 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
EGP
EGP
EGP
EGP
EGP
EGP
SYMBOLS
50A
50B
50C
50D
50F
50G
UNITS
Maximum recurrent peak reverse voltage
V
RRM
50
100
150
200
300
400
Volts
Maximum RMS voltage
V
RMS
35
70
105
140
210
280
Volts
Maximum DC blocking voltage
V
DC
50
100
150
200
300
400
Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
L
=55C
I
(AV)
5.0 Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load
I
FSM
150.0
Amps
Maximum instantaneous forward voltage at 5.0A
V
F
0.95 1.25
Volts
Maximum DC reverse current
T
A
=25C 5.0
at rated DC blocking voltage
T
A
=125C
I
R
50.0
A
Maximum reverse recovery time
(NOTE 1)
trr
50.0
ns
Typical thermal resistance
(NOTE 2)
R
JA
20.0
R
JL
5.0
C\W
Typical junction capacitance
(NOTE 3)
C
J
95
75
pF
Operating junction and storage temperature range
T
J,
T
STG
-65 to +150
C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, Irr=0.25A
(2) Thermal resistance from junction to ambient and from junction of lead at 0.375" (9.5mm) lead length,
both leads measured attached to heat sinks
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
4/98
Case Style GP20
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306
P
A
TENT
ED*
0.210 (5.3)
0.190 (4.8)
DIA.
0.042 (1.07)
0.037 (0.94)
DIA.
1.0 (25.4)
MIN.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
MIN.
175
1
10
100
0
25
50
75
100
125
150
6.0
0
25
50
75
100
125
150
175
0
1.0
2.0
3.0
4.0
5.0
0.4
0.6
0.8
1.2
1.4
1.6
1.8
1.0
0.01
0.1
1
10
50
0.2
0.01
0.1
1
10
100
0.1
1.0
10
100
0.1
1
10
100
1,000
0
30
60
90
120
150
180
210
0
20
40
60
80
100
0.001
0.01
0.1
1
10
100
FIG. 1 - MAXIMUM FORWARD CURRENT
DERATING CURVE
LEAD TEMPERATURE, C
A
VERA
GE FOR
W
ARD RECTIFIED
CURRENT
, AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
NUMBER OF CYCLES AT 60 H
Z
PEAK FOR
W
ARD SURGE CURRENT
,
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE LEAKAGE
CHARACTERISTICS
INST
ANT
ANEOUS FOR
W
ARD CURRENT
,
AMPERES
INST
ANT
ANEOUS REVERSE LEAKA
GE CURRENT
,
MICR
O
AMPERES
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAP
A
CIT
ANCE, pF
REVERSE VOLTAGE, VOLTS
T
J
=T
J
max.
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
T
J
=150C
T
J
=125C
T
J
=75C
T
J
=25C
T
J
=25C
T
J
=150C
PULSE WIDTH=300
s
1% DUTY CYCLE
T
J
=25C
f=1.0 MH
Z
Vsig=50mVp-p
RESISTIVE OR
INDUCTIVE LOAD
COPPER HEATSINKS
0.375" (9.5mm)
T
L
RATINGS AND CHARACTERISTIC CURVES EGP50A THRU EGP50G
EGP50A - EGP50D
EGP50F & EGP50G
EGP50A-EGP50D
EGP50F & EGP50G
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
TRANSIENT THERMAL
IMPED
ANCE,
CW
t, PULSE DURATION, sec.
L
1
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