Features
For surface mounted applications
Low profile package
Ideal for automated placement
High temperature soldering:
250
C/10 seconds at terminals
Maximum Ratings and Thermal Characteristics
(T
C
= 25C unless otherwise noted)
Parameter
Symbol
ES07B
ES07D
Unit
Device marking code
EB
ED
Maximum repetitive peak reverse voltage
V
RRM
100
200
V
Maximum RMS voltage
V
RMS
70
140
V
Maximum DC blocking voltage
V
DC
100
200
V
Maximum average forward rectified current
I
F(AV)
0.7
A
Peak forward surge current 8.3ms single half sine-wave
I
FSM
30
A
T
L
= 25C
Typical thermal resistance (on ceramic substrate)
R
JA
55
(on epoxy substrate)
120
C/W
Operating junction and storage temperature range
T
J
, T
STG
55 to +125
C
Electrical Characteristics
(T
C
= 25C unless otherwise noted)
Parameter
Symbol
Value
Unit
Maximum instantaneous forward voltage at 1.0A
V
F
0.98
V
Maximum DC reverse current
T
A
= 25C
10
A
at Rated DC blocking voltage
T
A
= 100C
I
R
50
mA
Typical reverse recovery time at I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
t
rr
25
ns
Typical capacitance at 4V, 1 MH
Z
C
J
TBD
pf
Mechanical Data
Case: SMF Plastic Case
Polarity: Color band denotes cathode end
Weight: approx. 0.01g
Packaging codes/options: TBD
ES07B thru ES07D
Small Surface Mount Ultrafast Rectifiers
Forward Current 0.7A
Reverse Voltage 100 to 200V
Detail Z
enlarged
0.00 0.10
Top View
1.0
0.2
1.8
0.1
2.8
0.1
0.98
0.1
0.16
3.7
0.2
0.81
0.15
5
5
Z
Mounting Pad Layout
11/6/00
DO-219 (SMF)
Preliminar
y
Patented
1.6
1.2
1.2
Dimensions in
millimeters
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