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Электронный компонент: GI1102

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GI1101 THRU GI1104
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage - 50 to 200 Volts Forward Current - 2.5 Amperes
FEATURES
High temperature metallurgically bonded construction
Glass passivated cavity-free junction
Superfast recovery time for high efficiency
Low forward voltage, high current capability
Capable of meeting environmental standards
of MIL-S-19500
Hermetically sealed package
Low Leakage
High surge capability
High temperature soldering guaranteed:
350C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-204AP solid glass body
Terminals: Plated axial leads, solderable per MIL-STD 750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 ounce, 0.56 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
GI1101
GI1102
GI1103
GI1104
UNITS
Maximum repetitive peak reverse voltage
V
RRM
50
100
150
200
Volts
Maximum RMS voltage
V
RMS
35
70
105
140
Volts
Maximum DC blocking voltage
V
DC
50
100
150
200
Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length
(SEE FIG.1)
I
(AV)
2.5
2.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
I
FSM
50.0
Amps
on rated load (JEDEC Method) at rated T
L
Maximum instantaneous forward voltage at 2.0A
V
F
0.975
1.25
Volts
(NOTE 5)
Maximum DC reverse current
T
A
=25C
2.0
10.0
at rated DC blocking voltage
T
A
=100C
I
R
50.0
200.0
A
Maximum reverse recovery time
(NOTE 1)
t
rr
25.0
50.0
ns
Typical junction capacitance
(NOTE 2)
C
J
45.0
pF
Typical thermal resistance
(NOTE 1)
R
JA
65.0
(NOTE 4)
R
JL
20.0
C/W
Operating junction and storage temperature range
T
J
, T
STG
-65 to +175
-65 to +150
C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5" (12 x 12mm) copper pads
(4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heat sinks
(5) Tested at I
F
=1.0A
4/98
0.034 (0.86)
0.028 (0.71)
DIA.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
1.0 (25.4)
MIN.
DO-204AP
Dimensions in inches and (millimeters)
*
Brazed lead assembly is covered by Patent No. 3,930,306
P
A
TENTED*
RATINGS AND CHARACTERISTIC CURVES GI1101 THRU GI1104
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.01
0.1
1
10
50
1
10
100
0
10
20
30
40
50
60
90
0.1
1
10
100
0
15
30
45
60
75
0
25
50
75 100 125 150 175
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
20
40
60
80
100
0.01
0.1
1
10
100
1,000
FIG. 1 - MAXIMUM FORWARD CURRENT
DERATING CURVE
LEAD TEMPERATURE, C
A
VERA
GE FOR
W
ARD RECTIFIED
CURRENT
, AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
NUMBER OF CYCLES AT 60 H
Z
PEAK FOR
W
ARD SURGE CURRENT
,
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
INST
ANT
ANEOUS FOR
W
ARD CURRENT
,
AMPERES
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAP
A
CIT
ANCE, pF
REVERSE VOLTAGE, VOLTS
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method) at RATED T
L
T
J
=25C
PULSE WIDTH=300
s
1% DUTY CYCLE
T
J
=25C
f=1.0 MH
Z
Vsig=50mVp-p
0.8 x 0.8 x 0.04" THK
(20 x 20 x 1.0mm)
COPPER HEATSINKS
T
L
0.375" (9.5mm) LEAD LENGTH
GI1104
GI1101 - GI1103
FIG. 4 - TYPICAL REVERSE LEAKAGE
CHARACTERISTICS
INST
ANT
ANEOUS REVERSE LEAKA
GE CURRENT
,
MICR
O
AMPERES
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
T
J
=125C
T
J
=100C
T
J
=25C
L
RESISTIVE OR INDUCTIVE LOAD