Ver: 2.5
Dec 14, 2004
TEL: 886-3-5788833
http://www.gmt.com.tw
1
G767
Global Mixed-mode Technology Inc.
Remote/Local Temperature Sensor with SMBus
Serial Interface
Features
Two Channels: Measures Both Remote and
Local Temperatures
No Calibration Required
SMBus 2-Wire Serial Interface
Programmable Under/Overtemperature Alarms
Supports SMBus Alert Response
Accuracy:
2C (+60C to + 100C, local)
3C (-40C to +125C, local)
3C (+60C to +100C, remote)
3A (typ) Standby Supply Current
70A (max) Supply Current in Auto- Convert
Mode
+3V to +5.5V Supply Range
Small, 16-Pin SSOP Package
Applications
Desktop and Notebook
Central Office
Computers Telecom
Equipment
Smart Battery Packs
Test and Measurement
LAN Servers
Multi-Chip Modules
Industrial Controls
General Description
The G767 is a precise digital thermometer that reports
the temperature of both a remote sensor and its own
package. The remote sensor is a diode-connected
transistor typically a low-cost, easily mounted 2N3904
NPN type-that replace conventional thermistors or
thermocouples. Remote accuracy is 3C for multiple
transistor manufacturers, with no calibration needed.
The remote channel can also measure the die tem-
perature of other ICs, such as microprocessors, that
contain an on-chip, diode-connected transistor.
The 2-wire serial interface accepts standard System
Management Bus (SMBus
TM
) Write Byte, Read Byte,
Send Byte, and Receive Byte commands to program
the alarm thresholds and to read temperature data.
The data format is 7 bits plus sign, with each bit cor-
responding to 1C, in two's-complement format.
Measurements can be done automatically and
autonomously, with the conversion rate programmed
by the user or programmed to operate in a single-shot
mode. The adjustable rate allows the user to control
the supply-current drain.
The G767 is available in a small, 16-pin SSOP sur-
face-mount package.
Ordering Information
ORDER
NUMBER
ORDER NUMBER
(Pb free)
TEMP.
RANGE
PACKAGE
G767
G767f
-55C to +125C
SSOP-16
Pin Configuration
Typical Operating Circuit
0.1 F
200
3V TO 5.5V
Vcc
STBY
DXP
DXN
SMBCLK
SMBDATA
ALERT
10k EACH
CLOCK
DATA
INTERRUPT
TO C
ADD0 ADD1 GND
2200pF
2N3904
SMBDATA
1
2
3
4
5
6
7
8
N.C.
Vcc
DXP
DXN
N.C.
ADD1
GND
GND
16
15
14
13
12
11
10
9
N.C
STBY
SMBCLK
N.C.
ALERT
ADD0
N.C.
SSOP-16
G767
0.1 F
200
3V TO 5.5V
Vcc
STBY
DXP
DXN
SMBCLK
SMBDATA
ALERT
10k EACH
CLOCK
DATA
INTERRUPT
TO C
ADD0 ADD1 GND
2200pF
2N3904
0.1 F
200
3V TO 5.5V
Vcc
STBY
DXP
DXN
SMBCLK
SMBDATA
ALERT
10k EACH
CLOCK
DATA
INTERRUPT
TO C
ADD0 ADD1 GND
2200pF
2N3904
SMBDATA
1
2
3
4
5
6
7
8
N.C.
Vcc
DXP
DXN
N.C.
ADD1
GND
GND
16
15
14
13
12
11
10
9
N.C
STBY
SMBCLK
N.C.
ALERT
ADD0
N.C.
SSOP-16
G767
Ver: 2.5
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2
G767
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
Vcc to GND......................................-0.3V to +6V
DXP, ADD to GND....................-0.3V to (Vcc + 0.3V)
DXN to GND..................................-0.3V to +0.8V
SMBCLK, SMBDATA,
ALERT ,
STBY to GND............
.........................................................-0.3V to +6V
SMBDATA, ALERT Current.............-1mA to +50mA
DXN Current................................................1mA
ESD Protection (SMBCLK, SMBDATA, ALERT ,
human body model)......................................4000V
ESD Protection (other pins, human body model)..2000V
Continuous Power Dissipation (T
A
= +70C)
SSOP(derate 8.30mW/C above +70C).........667mW
Operating Temperature Range..........-55C to +125C
Junction Temperature.................................+150C
Storage temperature Range.............-65C to +165C
Reflow Temperature (soldering, 10sec)................260C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the opera-
tional sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Electrical Characteristics
(Vcc = + 3.3V, T
A
= 0C to +85C, unless otherwise noted.)
PARAMETER CONDITIONS
MIN
TYP
MAX UNITS
ADC and power supply
Temperature Resolution (Note 1) Monotonicity guaranteed
8
---
---
Bits
T
A
= +60C to +100C
-2
---
2
Initial Temperature Error,
Local Diode (Note 2)
T
A
= 0C to +85C
-3
---
3
C
T
R
= +60C to +100C
-3
---
3
Temperature Error, Remote Di-
ode (Notes 2 and 3)
T
R
= -55C to +125C
-5
---
5
C
T
A
= +60C to +100C
-2.5
---
2.5
Temperature Error, Local Diode
(Notes 1 and 2)
Including long-term drift
T
A
= 0C to +85C
-3.5
---
3.5
C
Supply-Voltage
Range
3.0 --- 5.5
V
Undervoltage Lockout Threshold Vcc input, disables A/D conversion, rising edge
2.6 2.8 2.95
V
Undervoltage Lockout Hysteresis
---
50
---
mV
Power-On Reset Threshold
Vcc , falling edge
1.0 1.7 2.5
V
POR Threshold Hysteresis
---
50
---
mV
SMBus static
---
3
10
Standby Supply Current
Logic inputs forced
to Vcc or GND
Hardware or software
standby, SMBCLK at 10kHz
--- 4 ---
A
0.25 conv/sec
---
35
70
Average Operating Supply
Current
Auto-convert mode,average meas-
ured over 4sec. Logic inputs forced
to Vcc or GND
2.0 conv/sec
---
120 180
A
Conversion Time
From stop bit to conversion complete(both channels)
94 125 156
ms
Conversion Rate Timing Error
Auto-convert mode
-25
---
25
%
High level
80 100 120
Remote-Diode Source Current
DXP forced to 1.5V
Low level
8
10
12
A
Address Pin Bias Current
ADD0, ADD1; momentary upon power-on reset
---
160
---
A
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G767
Global Mixed-mode Technology Inc.
Electrical Characteristics
(continued)
(Vcc = + 3.3V, T
A
= 0 to +85C, unless otherwise noted.)
PARAMETER CONDITIONS
MIN
TYP
MAX UNITS
SMBus Interface
Logic Input High Voltage
STBY
, SMBCLK, SMBDATA; Vcc = 3V to 5.5V
2.2 --- ---
V
Logic Input Low Voltage
STBY
, SMBCLK, SMBDATA; Vcc = 3V to 5.5V
--- --- 0.8
V
Logic Output Low Sink Current
ALERT
, SMBDATA forced to 0.4V
6 --- ---
mA
ALERT
Output High Leakage Current
ALERT
forced to 5.5V
--- --- 1 A
Logic Input Current
Logic inputs forced to Vcc or GND
-1
---
1
A
SMBus Input Capacitance
SMBCLK, SMBDATA
---
5
---
pF
SMBus Clock Frequency
(Note 4)
DC
---
100
kHz
SMBCLK Clock Low Time
t
LOW
, 10% to 10% points
4.7
---
---
s
SMBCLK Clock High Time
t
HIGH
, 90% to 90% points
4
---
---
s
SMBus Start-Condition Setup Time
4.7
---
---
s
SMBus Repeated Start-Condition Setup Time t
SU :
STA ,
90% to 90% points
500
---
---
ns
SMBus Start-Condition Hold Time
t
HD: STA ,
10% of SMBDATA to 90% of SMBCLK
4
---
---
s
SMBus Start-Condition Setup Time
t
SD: STO ,
90% of SMBDATA to 10% of SMBDATA
4
---
---
s
SMBus Data Valid to SMBCLK Rising-Edge
Time
t
SU: DAT ,
10% or 90% of SMBDATA to 10% of
SMBCLK
800 --- ---
ns
SMBus Data-Hold Time
t
HD : DAT
(Note 5)
0
---
---
s
SMBCLK Falling Edge to SMBus Data-Valid
Time
Master clocking in data
---
---
1
s
Electrical Characteristics
(Vcc = + 3.3V, T
A
= -5.5 to + 125C, unless otherwise noted.) (Note 6)
PARAMETER CONDITIONS
MIN
TYP
MAX UNITS
ADC and power supply
Temperature Resolution (Note 1)
Monotonicity guaranteed
8
---
---
Bits
T
A
= +60C to +100C
-2
---
2
Initial Temperature Error, Local
Diode (Note 2)
T
A
= -55C to +125C
-3
---
3
C
T
R
= +60C to +100C
-3
---
3
Temperature Error, Remote Diode
(Notds2 and 3)
T
R
= -55C to +125C
-5
---
5
C
Supply-Voltage
Range
3.0 --- 5.5
V
Conversion Time
From stop bit to conversion complete (both channels) 94 125 156
ms
Conversion Rate Timing Error
Auto-convert mode
-25
---
25
%
SMBus Interface
Vcc = 3V
2.2
---
---
Logic Input High Voltage
STBY, SMBCLK, SMBDATA
Vcc = 5.5V
2.4
---
---
V
Logic Input Low Voltage
STBY, SMBCLK, SMBDATA; Vcc = 3V to 5.5V
---
---
0.8
V
Logic Output Low Sink Current
ALERT, SMBDATA forced to 0.4V
6
---
---
mA
ALERT
Output High Leakage Current
ALERT forced to 5.5V
---
---
1
A
Logic Input Current
Logic inputs forced to Vcc or GND
-2
---
2
A
Note1: Guaranteed but not 100% tested.
Note2: Quantization error is not included in specifications for temperature accuracy. For example, if the G767 de-
vice temperature is exactly +66.7C, or +68C (due to the quantization error plus the +1/2C offset used
for rounding up) and still be within the guaranteed 1C error limits for the +60C to 100C temperature
range. See Table2.
Note3: A remote diode is any diode-connected transistor from Table1. T
R
is the junction temperature of the re-
mote of the remote diode. See Remote Diode Selection for remote diode forward voltage requirements.
Note4: The SMBus logic block is a static design that works with clock frequencies down to DC. While slow operation is
possible, it violates the 10kHz minimum clock frequency and SMBus specifications, and may monopolize the bus.
Note5: Note that a transition must internally provide at least a hold time in order to bridge the undefined region
(300ns max) of SMBCLK's falling edge.
Note6: Specifications from -55C to +125C are guaranteed by design, not production tested.
Ver: 2.5
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G767
Global Mixed-mode Technology Inc.
Pin Description
PIN NAME
FUNCTION
1,5,9,13,16 N.C. No
Connection. Not internally connected. May be used for PC board trace routing
2 Vcc
Supply Voltage Input , 3V to 5.5V. Bypass to GND with a 0.1F capacitor. A 200
series resistor is
recommended but not required additional noise filtering.
3 DXP
Combined Current Source and A/D Positive Input for remote-diode channel. Do not leave DXP float-
ing; tie DXP to DXN if no remote diode is used. Place a 2200pF capacitor between DXP and DXN for
noise filtering.
4
DXN
Combined Current Sink and A/D Negative Input.
6 ADD1
SMBus Address Select pin (Table 8). ADD0 and ADD1 are sampled upon power-up. Excess capaci-
tance (>50pF) at the address pins when floating may cause address-recognition problems.
7,8 GND
Ground
10
ADD0
SMBus Slave Address Select pin
11
ALERT
SMBus Alert (interrupt) Output, open drain
12
SMBDATA SMBus Serial-Data Input / Output , open drain
14 SMBCLK
SMBus
Serial-Clock
Input
15
STBY
Hardware Standby Input. Temperature and comparison threshold data are retained in standby mode.
Low = standby mode, high = operate mode.
Detailed Description
The G767 is a temperature sensor designed to work in
conjunction with an external microcontroller (C) or
other intelligence in thermostatic, process-control, or
monitoring applications. The C is typically a
power-management or keyboard controller, generating
SMBus serial commands by "bit-banging" gen-
eral-purpose input-output (GPIO) pins or via a dedi-
cated SMBus interface block.
Essentially an 8-bit serial analog-to digital converter
(ADC) with a sophisticated front end, the G767 con-
tains a switched current source, a multiplexer, an ADC,
an SMBus interface, and associated control logic (Fig-
ure 1). Temperature data from the ADC is loaded into
two data registers, where it is automatically compared
with data previously stored in four over/under- tem-
perature alarm registers.
ADC and Multiplexer
The ADC is an averaging type that integrates over a
60ms period (each channel, typical), with excellent
noise rejection.
The multiplexer automatically steers bias currents
through the remote and local diodes, measures their
forward voltages, and computes their temperatures.
Both channels are automatically converted once the
conversion process has started, either in free-running
or single-shot mode. If one of the two channels is not
used, the device still performs both measurements,
and the user can simply ignore the results of the un-
used channel. If the remote diode channel is unused,
tie DXP to DXN rather than leaving the pins open.
The worst-case DXP-DXN differential input voltage
range is 0.25V to 0.95V.
Excess resistance in series with the remote diode
causes about +1/2C error per ohm. Likewise, 200V
of offset voltage forced on DXP-DXN causes about
1C error.
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G767
Global Mixed-mode Technology Inc.
Figure 1. Functional Diagram
A/D Conversion Sequence
If a Start command is written (or generated automati-
cally in the free-running auto-convert mode), both
channels are converted, and the results of both meas-
urements are available after the end of conversion. A
BUSY status bit in the status byte shows that the de-
vice is actually performing a new conversion; however,
even if the ADC is busy, the results of the previous
conversion are always available.
Remote-Diode Selection
Temperature accuracy depends on having a
good-quality, diode-connected small-signal transistor.
Accuracy has been experimentally verified for all of the
devices listed in Table 1. The G767 can also directly
measure the die temperature of CPUs and other inte-
grated circuits having on-board temperature-sensing
diodes.
The transistor must be a small-signal type with a rela-
tively high forward voltage; otherwise, the A/D input
voltage range can be violated. The forward voltage
must be greater than 0.25V at 10A; check to ensure
this is true at the highest expected temperature. The
forward voltage must be less than 0.95V at 100A;
check to ensure this is true at the lowest expected
temperature. Large power transistors don't work at all.
Also, ensure that the base resistance is less than
100
. Tight specifications for forward-current gain
(+50 to +150, for example) indicate that the manufac-
turer has good process controls and that the devices
have consistent VBE characteristics.
Thermal Mass and Self-Heating
Thermal mass can seriously degrade the G767's ef-
fective accuracy. The thermal time constant of the
SSOP-16 package is about 140sec in still air. For the
G767 junction temperature to settle to within +1C
after a sudden +100C change requires about five
time constants or 12 minutes. The use of smaller
packages for remote sensors, such as SOT23s, im-
proves the situation. Take care to account for thermal
gradients between the heat source and the sensor,
and ensure that stray air currents across the sensor
package do not interfere with measurement accuracy.
V
CC
DXP
DXN
MUX
+
+
+
REMOTE
LOCAL
ADC
CONTROL
LOGIC
STBY ADD0 ADD1
ADDRESS
DECODER
SMBUS
7
SMBDATA
SMBCLK
READ WRITE
DIODE
FAULT
2
8
8
COMMAND BYTE
(INDEX) REGISTER
STATUS BYTE
REGISTER
CONFIGURATION
BYTE REGISTER
CONVERSION RATE
REGISTER
ALERT RESPONSE
ADDRESS REGISTER
8
8
LOCAL EMPERATURE
DATA REGISTER
HIGH-TEMPETATURE
THRESHOLD (LOCALT
HIGH
)
LOW-TEMPETATURE
THRESHOLD (LOCAL T
LOW
)
8
DIGITAL COMPARATOR
(LOCAL)
SELECTED VIA
SLAVE ADD = 0001 100
8
8
ALERT
Q
S
R
REMOTE TEMPERATURE
DATA REGISTER
HIGH-TEMPETATURE
THRESHOLD (REMOTE
HIGH
)
LOW-TEMPETATURE
THRESHOLD (REMOTE
LOW
)
DIGITAL COMPARATOR
(REMOTE)
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G767
Global Mixed-mode Technology Inc.
Self-heating does not significantly affect measurement
accuracy. Remote-sensor self-heating due to the diode
current source is negligible. For the local diode, the
worst-case error occurs when auto-converting at the
fastest rate and simultaneously sinking maximum cur-
rent at the ALERT output. For example, at an 8Hz rate
and with ALERT sinking 1mA, the typical power dissi-
pation is Vcc x 450A plus 0.4V x 1mA. Package theta
J-A is about 150C /W, so with Vcc = 5V and no copper
PC board heat-sinking, the resulting temperature rise is:
dT = 2.7mW x 150C /W = 0.4C
Even with these contrived circumstances, it is difficult
to introduce significant self-heating errors.
Table 1. Remote-Sensor Transistor Manufacturers
MANUFACTURER MODEL
NUMBER
Philips PMBS3904
Motorola(USA) MMBT3904
National Semiconductor(USA)
MMBT3904
Note:Transistors must be diode-connected (base
shorted to collector).
ADC Noise Filtering
The ADC is an integrating type with inherently good
noise rejection, especially of low-frequency signals
such as 60Hz/120Hz power-supply hum. Micropower
operation places constraints on high-frequency noise
rejection; therefore, careful PC board layout and prop-
er external noise filtering are required for
high-accuracy remote measurements in electrically
noisy environments.
High-frequency EMI is best filtered at DXP and DXN
with an external 2200pF capacitor. This value can be
increased to about 3300pF(max), including cable ca-
pacitance. Higher capacitance than 3300pF introduces
errors due to the rise time of the switched current
source.
Nearly all noise sources tested cause the ADC meas-
urements to be higher than the actual temperature,
typically by +1C to 10C, depending on the frequency
and amplitude (see Typical Operating Characteristics).
PC Board Layout
Place the G767 as close as practical to the remote
diode. In a noisy environment, such as a computer
motherboard, this distance can be 4 in. to 8 in. (typical)
or more as long as the worst noise sources (such as
CRTs, clock generators, memory buses, and ISA/PCI
buses) are avoided.
Do not route the DXP-DXN lines next to the deflection
coils of a CRT. Also, do not route the traces across a
fast memory bus, which can easily introduce +30C
error, even with good filtering, Otherwise, most noise
sources are fairly benign.
Route the DXP and DXN traces in parallel and in close
proximity to each other, away from any high-voltage
traces such as +12V
DC
. Leakage currents from PC
board contamination must be dealt with carefully,
since a 20M
leakage path from DXP to ground
causes about +1C error.
Connect guard traces to GND on either side of the
DXP-DXN traces (Figure 2). With guard traces in place,
routing near high-voltage traces is no longer an issue.
Route through as few vias and crossunders as
possible to minimize copper/solder thermocouple ef-
fects.
When introducing a thermocouple, make sure that
both the DXP and the DXN paths have matching
thermocouples. In general, PC board-induced ther-
mocouples are not a serious problem, A copper-solder
thermocouple exhibits 3V/C, and it takes about
200V of voltage error at DXP-DXN to cause a +1C
measurement error. So, most parasitic thermocouple
errors are swamped out.
Use wide traces. Narrow ones are more inductive and
tend to pick up radiated noise. The 10 mil widths and
spacing recommended on Figure 2 aren't absolutely
necessary (as they offer only a minor improvement in
leakage and noise), but try to use them where practi-
cal.
Keep in mind that copper can't be used as an EMI
shield, and only ferrous materials such as steel work
will. Placing a copper ground plane between the
DXP-DXN traces and traces carrying high-frequency
noise signals does not help reduce EMI.
PC Board Layout Checklist
Place the G767 close to a remote diode.
Keep traces away from high voltages (+12V bus).
Keep traces away from fast data buses and CRTs.
Use recommended trace widths and spacing.
Place a ground plane under the traces
Use guard traces flanking DXP and DXN and con
necting to GND.
Place the noise filter and the 0.1F Vcc bypass
capacitors close to the G767.
Add a 200
resistor in series with Vcc for best
noise filtering (see Typical Operating Circuit).
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G767
Global Mixed-mode Technology Inc.
Figure 2. Recommended DXP/DXN PC Traces
Twisted Pair and Shielded Cables
For remote-sensor distances longer than 8 in., or in
particularly noisy environments, a twisted pair is rec-
ommended. Its practical length is 6 feet to 12feet (typi-
cal) before noise becomes a problem, as tested in a
noisy electronics laboratory. For longer distances, the
best solution is a shielded twisted pair like that used
for audio microphones. Connect the twisted pair to
DXP and DXN and the shield to GND, and leave the
shield's remote end unterminated.
Excess capacitance at DX_limits practical remote
sensor distances (see Typical Operating Characteris-
tics), For very long cable runs, the cable's parasitic
capacitance often provides noise filtering, so the
2200pF capacitor can often be removed or reduced in
value. Cable resistance also affects remote-sensor
accuracy; 1
series resistance introduces about + 1C
error.
Low-Power Standby Mode
Standby mode disables the ADC and reduces the
supply-current drain to less than 10A. Enter standby
mode by forcing the STBY pin low or via the
RUN/STOP bit in the configuration byte register.
Hardware and software standby modes behave almost
identically: all data is retained in memory, and the
SMB interface is alive and listening for reads and
writes. The only difference is that in hardware standby
mode, the one-shot command does not initiate a con-
version.
Standby mode is not a shutdown mode. With activity
on the SMBus, extra supply current is drawn (see
Typical Operating Characteristics). In software
standby mode, the G767 can be forced to perform A/D
conversions via the one-shot command, despite the
RUN/STOP bit being high.
Activate hardware standby mode by forcing the
STBY pin low. In a notebook computer, this line may
be connected to the system SUSTAT# suspend-state
signal.
The STBY pin low state overrides any software con-
version command. If a hardware or software standby
command is received while a conversion is in progress,
the conversion cycle is truncated, and the data from
that conversion is not latched into either temperature
reading register. The previous data is not changed and
remains available.
Supply-current drain during the 125ms conversion
period is always about 450A. Slowing down the con-
version rate reduces the average supply current (see
Typical Operating Characteristics). In between con-
versions, the instantaneous supply current is about
25A due to the current consumed by the conversion
rate timer. In standby mode, supply current drops to
about 3A. At very low supply voltages (under the
power-on-reset threshold), the supply current is higher
due to the address pin bias currents. It can be as high
as 100A, depending on ADD0 and ADD1 settings.
SMBus Digital Interface
From a software perspective, the G767 appears as a
set of byte-wide registers that contain temperature
data, alarm threshold values, or control bits, A stan-
dard SMBus 2-wire serial interface is used to read
temperature data and write control bits and alarm
threshold data.
Each A/D channel within the device responds to the
same SMBus slave address for normal reads and
writes.
The G767 employs four standard SMBus protocols:
Write Byte, Read Byte, Send Byte, and Receive Byte
(Figure 3). The shorter Receive Byte protocol allows
quicker transfers, provided that the correct data regis-
ter was previously selected by a Read Byte instruction.
Use caution with the shorter protocols in multi-master
systems, since a second master could overwrite the
command byte without informing the first master.
The temperature data format is 7bits plus sign in
twos-complement form for each channel, with each
data bit representing 1C (Table 2), transmitted MSB
first. Measurements are offset by +1/2C to minimize
internal rounding errors; for example, +99.6C is re-
ported as +100C.
GND
DXP
DXN
GND
10 MILS
MINIMUM
10 MILS
10 MILS
10 MILS
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G767
Global Mixed-mode Technology Inc.
Write Byte Format
S ADDRESS WR ACK COMMAND
ACK DATA ACK P
7 bits
8 bits
8 bits
1
Slave Address: equivalent to chip- select line of a 3-wire interface
Command Byte: selects which register you are writing to
Data byte: data goes into the register set by the command byte (to set thresholds, configuration masks, and sam
pling rate)
Read Byte Format
S ADDRESS WR ACK COMMAND
ACK
S
ADDRESS RD
ACK
DATA ///
P
7
bits 8bits
7bits 8
bits
Slave Address: equivalent to chip- select line
Command Byte: selects which register you are reading from
Slave Address: repeated due to change in data-flow direction
Data byte: reads from the register set by the command byte
Send Byte Format
S ADDRESS
WR
ACK COMMAND ACK P
7 bits
8 bits
Command Byte: sends command with no data , usually used for one-shot command
Receive Byte Format
S ADDRESS
RD
ACK
DATA /// P
7 bits
8 bits
Data Byte: reads data from the register commanded by the last Read Byte or Write Byte transmission; also used
for SMBus Alert Response return address
S = Start condition Shaded = Slave transmission P = Stop condition /// = Not acknowledged
Figure 3. SMBus Protocols
Table 2. Data Format (Twos-Complement)
DIGITAL OUTPUT
DATA BITS
TEMP.
(C)
ROUND
TEMP.
(C)
SIGN MSB LSB
+130.00 +127 0 111 1111
+127.00 +127 0 111 1111
+126.50 +127 0 111 1111
+126.00 +126 0 111 1110
+25.25 +25 0 001 1001
+0.50 +1 0 000
0001
+0.25 +0 0 000
0000
+0.00 +0 0 000
0000
-0.25 +0 0 000
0000
-0.50 +0 0 000
0000
-0.75 -1 1 111
1111
-1.00 -1 1 111
1111
-25.00 -25 1 110
0111
-25.50 -25 1 110
0110
-54.75 -55 1 100
1001
-55.00 -55 1 100
1001
-65.00 -65 1 011
1111
-70.00 -65 1 011
1111
Alarm Threshold Registers
Four registers store alarm threshold data, with
high-temperature (T
HIGH
) and low-temperature (T
LOW
)
registers for each A/D channel. If either measured
temperature equals or exceeds the corresponding
alarm threshold value, an ALERT interrupt is as-
serted.
The power-on-reset (POR) state of both T
HIGH
registers
is full scale (0111 1111, or +127
C). The POR state of
both T
LOW
registers is 1100 1001 or -55
C.
Diode Fault Alarm
There is a continuity fault detector at DXP that detects
whether the remote diode has an open-circuit condi-
tion. At the beginning of each conversion, the diode
fault is checked, and the status byte is updated. This
fault detector is a simple voltage detector; if DXP rises
above V
CC
1V (typical) due to the diode current
source, a fault is detected. Note that the diode fault
isn't checked until a conversion is initiated, so immedi-
ately after power-on reset the status byte indicates no
fault is present, even if the diode path is broken.
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If the remote channel is shorted (DXP to DXN or DXP
to GND), the ADC reads 0000 0000 so as not to trip
either the T
HIGH
or T
LOW
alarms at their POR settings.
In applications that are never subjected to 0
C in nor-
mal operation, a 0000 0000 result can be checked to
indicate a fault condition in which DXP is accidentally
short circuited. Similarly, if DXP is short circuited to
V
CC
, the ADC reads +127
C for both remote and local
channels, and the device alarms.
Table 3. Read Format for Alert Response Address
(0001 100)
BIT NAME FUNCTION
7(MSB) ADD7
6 ADD6
5 ADD5
4 ADD4
3 ADD3
2 ADD2
1 ADD1
Provide the current G767
slave address that was
latched at POR (Table 8)
0(LSB) 1
Logic
1
ALERT
Interrupts
The ALERT interrupt output signal is latched and
can only be cleared by reading the Alert Response
address. Interrupts are generated in response to T
HIGH
and T
LOW
comparisons and when the remote diode is
disconnected (for continuity fault detection). The inter-
rupt does not halt automatic conversions; new tem-
perature data continues to be available over the
SMBus interface after ALERT is asserted. The in-
terrupt output pin is open-drain so that devices can
share a common interrupt line. The interrupt rate can
never exceed the conversion rate.
The interface responds to the SMBus Alert Response
address, an interrupt pointer return-address feature
(see Alert Response Address section). Prior to taking
corrective action, always check to ensure that an in-
terrupt is valid by reading the current temperature.
Alert Response Address
The SMBus Alert Response interrupt pointer provides
quick fault identification for simple slave devices that
lack the complex, expensive logic needed to be a bus
master. Upon receiving an ALERT interrupt signal,
the host master can broadcast a Receive Byte trans-
mission to the Alert Response slave address (0001
100). Then any slave device that generated an inter-
rupt attempts to identify itself by putting its own ad-
dress on the bus (Table 3).
Table 4. Command-Byte Bit Assignments
REGISTER COMMAND POR
STATE
FUNCTINON
RLTS
00h
0000 0000*
Read local temperature: returns latest temperature
RRTE
01h
0000 0000*
Read remote temperature: returns latest temperature
RSL
02h
N/A
Read status byte (flags, busy signal)
RCL
03h
0000 0000
Read configuration byte
RCRA
04h
0000 0010
Read conversion rate byte
RLHN
05h
0111 1111
Read local T
HIGH
limit
RLLI
06h
1100 1001
Read local T
LOW
limit
RRHI
07h
0111 1111
Read remote T
HIGH
limit
RRLS
08h
1100 1001
Read remote T
LOW
limit
WCA 09h N/A
Write
configuration byte
WCRW
0Ah
N/A
Write conversion rate byte
WLHO 0Bh N/A
Write
local
T
HIGH
limit
WLLM 0Ch N/A
Write
local
T
LOW
limit
WRHA
0Dh
N/A
Write remote T
HIGH
limit
WRLN
0Eh
N/A
Write remote T
LOW
limit
OSHT
0Fh
N/A
One-shot command (use send-byte format)
*If the device is in hardware standby mode at POR, both temperature registers read 0
C.
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The Alert Response can activate several different
slave devices simultaneously, similar to the SMBus
General Call. If more than one slave attempts to re-
spond, bus arbitration rules apply, and the device with
the lower address code wins. The losing device does
not generate an acknowledge and continues to hold
the ALERT line low until serviced (implies that the
host interrupt input is level-sensitive). Successful
reading of the alert response address clears the inter-
rupt latch.
Command Byte Functions
The 8-bit command byte register (Table 4) is the mas-
ter index that points to the various other registers
within the G767. The register's POR state is 0000
0000, so that a Receive Byte transmission (a protocol
that lacks the command byte) that occurs immediately
after POR returns the current local temperature data.
The one-shot command immediately forces a new
conversion cycle to begin. In software standby mode
(RUN/STOP bit = high), a new conversion is begun,
after which the device returns to standby mode. If a
conversion is in progress when a one-shot command
is received in auto-convert mode (RUN/STOP bit = low)
between conversions, a new conversion begins, the
conversion rate timer is reset, and the next automatic
conversion takes place after a full delay elapses.
Configuration Byte Functions
The configuration byte register (Table 5) is used to
mask (disable) interrupts and to put the device in
software standby mode. The lower six bits are inter-
nally set to (XX1111), making them "don't care" bits.
Write zeros to these bits. This register's contents can
be read back over the serial interface.
Status Byte Functions
The status byte register (Table 6) indicates which (if
any) temperature thresholds have been exceeded.
This byte also indicates whether or not the ADC is
converting and whether there is an open circuit in the
remote diode DXP-DXN path. After POR, the normal
state of all the flag bits is zero, assuming none of the
alarm conditions are present. The status byte is
cleared by any successful read of the status, unless
the fault persists. Note that the ALERT interrupt
latch is not automatically cleared when the status flag
bit is cleared.
When reading the status byte, you must check for in-
ternal bus collisions caused by asynchronous ADC
timing, or else disable the ADC prior to reading the
status byte (via the RUN/STOP bit in the configuration
byte). In one-shot mode, read the status byte only af-
ter the conversion is complete, which is 150ms max
after the one-shot conversion is commanded.
Table 5. Configuration-Byte Bit Assignments
BIT NAME
POR
STATE
FUNCTION
7 (MSB)
MASK
0
Masks all
ALERT
interrupts when high.
6
RUN /
STOP
0
Standby mode control bit. If high, the device immediately stops converting and en-
ters standby mode. If low, the device converts in either one-shot or timer mode.
5-0
RFU
0
Reserved for future use
Table 6. Status-Byte Bit Assignments
BIT NAME
FUNCTION
7 (MSB)
BUSY
A high indicates that the ADC is busy converting.
6
LHIGH*
A high indicates that the local high-temperature alarm has activated.
5
LLOW*
A high indicates that the local low-temperature alarm has activated.
4
RHIGH*
A high indicates that the remote high-temperature alarm has activated.
3
RLOW*
A high indicates that the remote low-temperature alarm has activated.
2
OPEN*
A high indicates a remote-diode continuity (open-circuit) fault.
1
RFU
Reserved for future use (returns 0)
0 (LSB)
RFU
Reserved for future use (returns 0)
*These flags stay high until cleared by POR, or until the status byte register is read.
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Table 7. Conversion-Rate Control Byte
DATA
CONVERSION RATE (Hz)
AVERAGE SUPPLY CURRENT (A TYP, at Vcc = 3.3V)
00h 0.0625
30
01h 0.125
33
02h 0.25
35
03h 0.5
48
04h 1
70
05h 2
128
06h 4
225
07h 8
425
08h to FFh
RFU
-
Table 8. RLTS and RRTE Temp Register Update Timing Chart
OPERATING MODE
CONVERSION
INITIATED BY:
NEW CONVERSION RATE
(CHANGED VIA WRITE TO WCRW)
TIME UNTIL RLTS AND
RRTE ARE UPDATED
Auto-Convert
Power-on reset
N/A (0.25Hz)
156ms max
Auto-Convert
1-shot command, while idling be-
tween automatic conversions
N/A 156ms
max
Auto-Convert
1-shot command that occurs dur-
ing a conversion
N/A
When current conversion is
complete (1-shot is ignored)
Auto-Convert Rate
timer
0.0625Hz
20sec
Auto-Convert Rate
timer
0.125Hz
10sec
Auto-Convert Rate
timer
0.25Hz
5sec
Auto-Convert Rate
timer
0.5Hz
2.5sec
Auto-Convert Rate
timer
1Hz
1.25sec
Auto-Convert Rate
timer
2Hz
625ms
Auto-Convert Rate
timer
4Hz
312.5ms
Auto-Convert Rate
timer
8Hz
237.5ms
Hardware Standby
STBY
pin
N/A 156ms
Software Standby
RUN/STOP bit
N/A
156ms
Software Standby
1-shot command
N/A
156ms
To check for internal bus collisions, read the status
byte. If the least significant seven bits are ones, dis-
card the data and read the status byte again. The
status bits LHIGH, LLOW, RHIGH, and RLOW are
refreshed on the SMBus clock edge immediately fol-
lowing the stop condition, so there is no danger of los-
ing temperature-related status data as a result of an
internal bus collision. The OPEN status bit (diode con-
tinuity fault) is only refreshed at the beginning of a
conversion, so OPEN data is lost. The ALERT in-
terrupt latch is independent of the status byte register,
so no false alerts are generated by an internal bus
collision.
When auto-converting, if the THIGH and TLOW limits
are close together, it's possible for both high-temp and
low-temp status bits to be set, depending on the
amount of time between status read operations (espe-
cially when converting at the fastest rate). In these
circumstances, it's best not to rely on the status bits to
indicate reversals in long-term temperature changes
and instead use a current temperature reading to es-
tablish the trend direction.
Conversion Rate Byte
The conversion rate register (Table 7) programs the
time interval between conversions in free-running
auto-convert mode. This variable rate control reduces
the supply current in portable-equipment applications.
The conversion rate byte's POR state is 02h (0.25Hz).
The G767 looks only at the 3 LSB bits of this register,
so the upper 5 bits are "don't care" bits, which should
be set to zero. The conversion rate tolerance is
25%
at any rate setting.
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Valid A/D conversion results for both channels are
available one total conversion time (125ms nominal,
156ms maximum) after initiating a conversion, whether
conversion is initiated via the RUN/STOP bit, hard-
ware STBY pin, one-shot command, or initial power-up.
Changing the conversion rate can also affect the delay
until new results are available. See Table 8.
Slave Addresses
The G767 appears to the SMBus as one device hav-
ing a common address for both ADC channels. The
device address can be set to one of nine different val-
ues by pin-strapping ADD0 and ADD1 so that more
than one G767 can reside on the same bus without
address conflicts (Table 9).
The address pin states are checked at POR only, and
the address data stays latched to reduce quiescent
supply current due to the bias current needed for
high-Z state detection.
The G767 also responds to the SMBus Alert Re-
sponse slave address (see the Alert Response Ad-
dress section).
POR AND UVLO
The G767 has a volatile memory. To prevent ambiguous
power-supply conditions from corrupting the data in
memory and causing erratic behavior, a POR voltage
detector monitors Vcc and clears the memory if Vcc falls
below 1.7V (typical, see Electrical Characteristics table).
When power is first applied and Vcc rises above 1.75V
(typical), the logic blocks begin operating, although reads
and writes at V
CC
levels below 3V are not recommended.
A second Vcc comparator, the ADC UVLO comparator,
prevents the ADC from converting until there is sufficient
headroom (Vcc = 2.8V typical).
Table 9.Slave Address Decoding (ADD0 and ADD1)
ADD0 ADD1
ADDRESS
GND GND
0011
000
GND High-Z
0011
001
GND Vcc
0011
010
High-Z GND
0101
001
High-Z High-Z
0101
010
High-Z Vcc
0101
011
Vcc GND
1001
100
Vcc High-Z
1001
101
Vcc Vcc
1001
110
Note: High-Z means that the pin is left unconnected
and floating.
Power-Up Defaults:
Interrupt latch is cleared.
Address select pins are sampled.
ADC begins auto-converting at a 0.25Hz rate.
Command byte is set to 00h to facilitate quick re-
mote Receive Byte queries.
T
HIGH
and T
LOW
registers are set to max and min
limits, respectively.
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G767
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Figure 4. SMBus Write Timing Diagram
A = start condition
H = LSB of data clocked into slave
B = MSB of address clocked into slave
I = slave pulls SMBDATA line low
C = LSB of address clocked into slave
J = acknowledge clocked into master
D = R/W bit clocked into slave
K = acknowledge clocked pulse
E = slave pulls SMBDATA line low
L = stop condition data executed by slave
F = acknowledge bit clocked into master
M = new start condition
G = MSB of data clocked into slave
Figure 5. SMBus Read Timing Diagram
A = start condition
G = MSB of data clocked into master
B = MSB of address clocked into slave
H = LSB of data clocked into master
C = LSB of address clocked into slave
I = acknowledge clocked pulse
D = R/ W bit clocked into slave
J = stop condition
E = slave pulls SMBDATA line low
K= new start condition
F =acknowledge bit clocked into master
SMBCLK
SMBDATA
A
B
C
D
E F
G
H
I J
K
L
M
t
SU:STA
t
HD:STA
t
SU:DAT
t
HD:DAT
t
SU:STO
t
BUF
t
LOW
t
HIGH
SMBCLK
SMBDATA
A
B
C
D
E F
G
H
I
J
K
t
SU:STA
t
HD:STA
t
SU:DAT
t
SU:STO
t
BUF
t
LOW
t
HIGH
SMBCLK
SMBDATA
A
B
C
D
E F
G
H
I
J
K
t
SU:STA
t
HD:STA
t
SU:DAT
t
SU:STO
t
BUF
t
LOW
t
HIGH
Ver: 2.5
Dec 14, 2004
TEL: 886-3-5788833
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G767
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Package Information
Note:
1. Package body sizes exclude mold flash and gate burrs
2. Dimension L is measured in gage plane
3. Tolerance 0.10mm unless otherwise specified
4.
Controlling dimension is millimeter converted inch dimensions are not necessarily exact.
DIMENSION IN MM
DIMENSION IN INCH
SYMBOL
MIN. NOM. MAX. MIN. NOM. MAX.
A 1.35 1.60 1.75 0.053 0.064 0.069
A1 0.10 ----- 0.25 0.004 ----- 0.010
A2 ----- 1.45 ----- ----- 0.057 -----
b 0.20 0.25 0.30 0.008 0.010 0.012
C 0.19 ----- 0.25 0.007 ----- 0.010
D 4.80 ----- 5.00 0.189 ----- 0.197
E 5.80 ----- 6.20 0.228 ----- 0.244
E1 3.80 ----- 4.00 0.150 ----- 0.157
e ----- 0.64 ----- ----- 0.025 -----
L 0.40 ----- 1.27 0.016 ----- 0.050
y ----- ----- 0.10 ----- ----- 0.004
0 ----- 8 0 ----- 8
Taping Specification
PACKAGE Q'TY/REEL
SSOP-16 2,500
ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
D
E1
E
7
(4X)
A1
A2
A
e
b
y
C
L
F e e d D ire c tio n
T y p ic a l S S O P P a c k a g e O r ie n ta tio n
F e e d D ire c tio n
T y p ic a l S S O P P a c k a g e O r ie n ta tio n
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