Notes:
(1) Measured at 1.0MHz and applied reverse voltage of 4.0 VDC
(2) Thermal resistance from junction to ambient on P.C. Board Mounted
Characteristic
Symbols
DF005
DF01
DF02
DF04
DF06
DF08
DF10
Units
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
V
DC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
at T
A
=40
I
(AV)
1.0
Amp
Peak forward surge current
8.3mS single half sine-wave superimposed
on rated load
I
FSM
50.0
Amps
Maximum forward voltage at
forward current perelement 1.0A
V
F
1.1
Volts
I
2
t-rating for fusion (t<8.3mS)
I
2
t
10.0
A
2
S
Maximum DC reverse current T
A
=25
at rated DC blocking voltage T
A
=125
I
R
10.0
500.0
A
Typical junction capacitance (Note 1)
C
J
25.0
F
Typical thermal resistance (Note 2)
R
JA
40.0
/W
Operating temperature range
T
J
-55 to +125
Storage temperature range
T
STG
-55 to +150
Features
Mechanical Data
DF005 THRU DF10
GLASS PASSIVATED CHIP SINGLE-PHASE BRIDGE RECTIFIER
Reverse Voltage -
50 to 1000 Volts
Forward Current -
1.0 Ampere
Ideal for printed circuit board
Glass passivated chip junction
High temperature soldering guaranteed:
260 /10 seconds at 5 lbs tension
Terminals: Plated leads, solderable per
MIL-STD-202, method 208
Case: Molded with UL-94Class V-0 recognized
flame retartant epoxy
Polarity: Polarity symbol marked on body
Mounting Position: Any
Maximum Ratings and Electrical Characteristics
1
Single-phase, half-wave, 60Hz, resistive or inductive load.
Ratings at 25
unless otherwise stated.
For capacitive load, Derate current by 20%.
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