ChipFind - документация

Электронный компонент: GS881E18B

Скачать:  PDF   ZIP

Document Outline

Rev: 1.00b 12/2002
1/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ByteSafe is a Trademark of Giga Semiconductor, Inc. (GSI Technology).
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
512K x 18, 256K x 32, 256K x 36
9Mb Sync Burst SRAMs
250 MHz133 MHz
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
100-Pin TQFP & 165-bump BGA
Commercial Temp
Industrial Temp
Features
FT pin for user-configurable flow through or pipeline opera-
tion
Dual Cycle Deselect (DCD) operation
IEEE 1149.1 JTAG-compatible Boundary Scan
2.5 V or 3.3 V +10%/10% core power supply
2.5 V or 3.3 V I/O supply
LBO pin for Linear or Interleaved Burst mode
Internal input resistors on mode pins allow floating mode pins
Default to Interleaved Pipeline mode
Byte Write (BW) and/or Global Write (GW) operation
Internal self-timed write cycle
Automatic power-down for portable applications
JEDEC-standard 100-lead TQFP and 165-bump BGA
packages
Functional Description
Applications
The GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D) is a
9,437,184-bit high performance synchronous SRAM with a 2-
bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPUs, the device now finds application in
synchronous SRAM applications, ranging from DSP main
store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be
initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode pin
low places the RAM in Flow Through mode, causing output
data to bypass the Data Output Register. Holding FT high
places the RAM in Pipeline mode, activating the rising-edge-
triggered Data Output Register.
DCD Pipelined Reads
The GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D) is a
DCD (Dual Cycle Deselect) pipelined synchronous SRAM.
SCD (Single Cycle Deselect) versions are also available. DCD
SRAMs pipeline disable commands to the same degree as read
commands. DCD RAMs hold the deselect command for one
full cycle and then begin turning off their outputs just after the
second rising edge of clock.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V
and 2.5 V compatible. Separate output power (V
DDQ
) pins are
used to decouple output noise from the internal circuits and are
3.3 V and 2.5 V compatible.
-250 -225 -200 -166 -150 -133 Unit
Pipeline
3-1-1-1
t
KQ
tCycle
2.5
4.0
2.7
4.4
3.0
5.0
3.4
6.0
3.8
6.7
4.0
7.5
ns
ns
3.3 V
Curr
(x18)
Curr
(x32/x36)
280
330
255
300
230
270
200
230
185
215
165
190
mA
mA
2.5 V
Curr
(x18)
Curr
(x32/x36)
275
320
250
295
230
265
195
225
180
210
165
185
mA
mA
Flow
Through
2-1-1-1
t
KQ
tCycle
5.5
5.5
6.0
6.0
6.5
6.5
7.0
7.0
7.5
7.5
8.5
8.5
ns
ns
3.3 V
Curr
(x18)
Curr
(x32/x36)
175
200
165
190
160
180
150
170
145
165
135
150
mA
mA
2.5 V
Curr
(x18)
Curr
(x32/x36)
175
200
165
190
160
180
150
170
145
165
135
150
mA
mA
Rev: 1.00b 12/2002
2/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
GS881E18B 100-Pin TQFP Pinout
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
V
DDQ
V
SS
DQ
B1
DQ
B2
V
SS
V
DDQ
DQ
B3
DQ
B4
FT
V
DD
NC
V
SS
DQ
B5
DQ
B6
V
DDQ
V
SS
DQ
B7
DQ
B8
DQ
B9
V
SS
V
DDQ
V
DDQ
V
SS
DQ
A8
DQ
A7
V
SS
V
DDQ
DQ
A6
DQ
A5
V
SS
NC
V
DD
ZZ
DQ
A4
DQ
A3
V
DDQ
V
SS
DQ
A2
DQ
A1
V
SS
V
DDQ
LBO
A
5
A
4
A
3
A
2
A
1
A
0
TM
S
TDI
V
SS
V
DD
TD
O

TC
K
A
10
A
11
A
12
A
13
A
14
A
16
A
6
A
7
E
1
E
2
NC
NC
B
B
B
A
A
17
CK
GW
BW
V
DD
V
SS
G
ADSC
ADSP
ADV
A
8
A
9
A
15
512K x 18
Top View
DQ
A9
A
18
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Rev: 1.00b 12/2002
3/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
GS881E36B 100-Pin TQFP Pinout
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
V
DDQ
V
SS
DQ
C4
DQ
C3
V
SS
V
DDQ
DQ
C2
DQ
C1
FT
V
DD
NC
V
SS
DQ
D1
DQ
D2
V
DDQ
V
SS
DQ
D3
DQ
D4
DQ
D5
V
SS
V
DDQ
V
DDQ
V
SS
DQ
B4
DQ
B3
V
SS
V
DDQ
DQ
B2
DQ
B1
V
SS
NC
V
DD
ZZ
DQ
A1
DQ
A2
V
DDQ
V
SS
DQ
A3
DQ
A4
V
SS
V
DDQ
LBO
A
5
A
4
A
3
A
2
A
1
A
0
V
SS
V
DD
A
10
A
11
A
12
A
13
A
14
A
16
A
6
A
7
E
1
E
2
B
D
B
C
B
B
B
A
A
17
CK
GW
BW
V
DD
V
SS
G
ADSC
ADSP
ADV
A
8
A
9
A
15
256K x 36
Top View
DQ
B5
DQ
B9
DQ
B7
DQ
B8
DQ
B6
DQ
A6
DQ
A5
DQ
A8
DQ
A7
DQ
A9
DQ
C7
DQ
C8
DQ
C6
DQ
D6
DQ
D8
DQ
D7
DQ
D9
DQ
C5
DQ
C9
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
TMS
TD
I
TD
O

TC
K
Rev: 1.00b 12/2002
4/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
TQFP Pin Description
Symbol
Type
Description
A
0
, A
1
I
Address field LSBs and Address Counter preset Inputs
A
2
A
17
I
Address Inputs
A
18
I
Address Input
DQ
A1
DQ
A9
DQ
B1
DQ
B9
DQ
C1
DQ
C9
DQ
D1
DQ
D9
I/O
Data Input and Output pins
NC
--
No Connect
BW
I
Byte Write--Writes all enabled bytes; active low
B
A
, B
B,
B
C
, B
D
I
Byte Write Enable for DQ Data I/Os; active low
NC
--
No Connect
CK
I
Clock Input Signal; active high
GW
I
Global Write Enable--Writes all bytes; active low
E
2
I
Chip Enable; active high
E
1
I
Chip Enable; active low
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable; active low
ADSP, ADSC
I
Address Strobe (Processor, Cache Controller); active low
ZZ
I
Sleep Mode control; active high
LBO
I
Linear Burst Order mode; active low
V
DD
I
Core power supply
V
SS
I
I/O and Core Ground
V
DDQ
I
Output driver power supply
Rev: 1.00b 12/2002
5/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
165 Bump BGA--x18 Commom I/O--Top View (Package D)
1
2
3
4
5
6
7
8
9
10
11
A
NC
A
E1
BB
NC
E3
BW
ADSC
ADV
A
A18
A
B
NC
A
E2
NC
BA
CK
GW
G
ADSP
A
NC
B
C
NC
NC
V
DDQ
V
SS
V
SS
V
SS
V
SS
V
SS
V
DDQ
NC
DQA
C
D
NC
DQB
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
NC
DQA
D
E
NC
DQB
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
NC
DQA
E
F
NC
DQB
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
NC
DQA
F
G
NC
DQB
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
NC
DQA
G
H
FT
MCL
NC
V
DD
V
SS
V
SS
V
SS
V
DD
NC
NC
ZZ
H
J
DQB
NC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
NC
J
K
DQB
NC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
NC
K
L
DQB
NC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
NC
L
M
DQB
NC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
NC
M
N
DQB
NC
V
DDQ
V
SS
NC
NC
NC
V
SS
V
DDQ
NC
NC
N
P
NC
NC
A
A
TDI
A1
TDO
A
A
A
A17
P
R
LBO
NC
A
A
TMS
A0
TCK
A
A
A
A
R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
Rev: 1.00b 12/2002
6/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
165 Bump BGA--x32 Common I/O--Top View (Package D)
1
2
3
4
5
6
7
8
9
10
11
A
NC
A
E1
BC
BB
E3
BW
ADSC
ADV
A
NC
A
B
NC
A
E2
BD
BA
CK
GW
G
ADSP
A
NC
B
C
NC
NC
V
DDQ
V
SS
V
SS
V
SS
V
SS
V
SS
V
DDQ
NC
NC
C
D
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
D
E
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
E
F
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
F
G
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
G
H
FT
MCL
NC
V
DD
V
SS
V
SS
V
SS
V
DD
NC
ZQ
ZZ
H
J
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
J
K
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
K
L
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
L
M
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
M
N
NC
NC
V
DDQ
V
SS
NC
NC
NC
V
SS
V
DDQ
NC
NC
N
P
NC
NC
A
A
TDI
A1
TDO
A
A
A
A17
P
R
LBO
NC
A
A
TMS
A0
TCK
A
A
A
A
R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
Rev: 1.00b 12/2002
7/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
165 Bump BGA--x36 Common I/O--Top View (Package D)
1
2
3
4
5
6
7
8
9
10
11
A
NC
A
E1
BC
BB
E3
BW
ADSC
ADV
A
NC
A
B
NC
A
E2
BD
BA
CK
GW
G
ADSP
A
NC
B
C
DQC
NC
V
DDQ
V
SS
V
SS
V
SS
V
SS
V
SS
V
DDQ
NC
DQB
C
D
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
D
E
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
E
F
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
F
G
DQC
DQC
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQB
DQB
G
H
FT
MCL
NC
V
DD
V
SS
V
SS
V
SS
V
DD
NC
NC
ZZ
H
J
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
J
K
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
K
L
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
L
M
DQD
DQD
V
DDQ
V
DD
V
SS
V
SS
V
SS
V
DD
V
DDQ
DQA
DQA
M
N
DQD
NC
V
DDQ
V
SS
NC
NC
NC
V
SS
V
DDQ
NC
DQA
N
P
NC
NC
A
A
TDI
A1
TDO
A
A
A
A17
P
R
LBO
NC
A
A
TMS
A0
TCK
A
A
A
A
R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
Rev: 1.00b 12/2002
8/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
GS881E18/32/36BD 165-Bump BGA Pin Description
Symbol
Type
Description
A
0
, A
1
I
Address field LSBs and Address Counter Preset Inputs
An
I
Address Inputs
A
17,
A
18
I
Address Input
DQ
A1
DQ
A9
DQ
B1
DQ
B9
DQ
C1
DQ
C9
DQ
D1
DQ
D9
I/O
Data Input and Output pins
B
A
, B
B
, B
C
, B
D
I
Byte Write Enable for DQ
A
, DQ
B
, DQ
C
, DQ
D
I/Os; active low
NC
--
No Connect
CK
I
Clock Input Signal; active high
BW
I
Byte Write--Writes all enabled bytes; active low
GW
I
Global Write Enable--Writes all bytes; active low
E
1
I
Chip Enable; active low
E
3
I
Chip Enable; active low
E
2
I
Chip Enable; active high
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable; active l0w
ADSC, ADSP
I
Address Strobe (Processor, Cache Controller); active low
ZZ
I
Sleep mode control; active high
FT
I
Flow Through or Pipeline mode; active low
LBO
I
Linear Burst Order mode; active low
TMS
I
Scan Test Mode Select
TDI
I
Scan Test Data In
TDO
O
Scan Test Data Out
TCK
I
Scan Test Clock
MCL
--
Must Connect Low
V
DD
I
Core power supply
V
SS
I
I/O and Core Ground
V
DDQ
I
Output driver power supply
Rev: 1.00b 12/2002
9/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
GS881E18/32/36B Block Diagram
A1
A0
A0
A1
D0
D1
Q1
Q0
Counter
Load
D
Q
D
Q
Register
Register
D
Q
Register
D
Q
Register
D
Q
Register
D
Q
Register
D
Q
Register
D
Q
Register
D
Q
Reg
i
ster
D
Q
Re
giste
r
A0
An
LBO
ADV
CK
ADSC
ADSP
GW
BW
E
1
FT
G
ZZ
Power Down
Control
Memory
Array
36
36
4
A
Q
D
DQx1
DQx9
NC
Parity
NC
Parity
Encode
Compare
36
4
36
36
4
32
Note: Only x36 version shown for simplicity.
0
36
36
DQ
Regist
er
4
B
A
B
B
B
C
B
D
Rev: 1.00b 12/2002
10/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Note:
There is a are pull-up devices on the ZQ, SCD FT pin and a pull-down devices on the PE and ZZ pins, so those input pins can be
unconnected and the chip will operate in the default states as specified in the above tables.
Enable / Disable Parity I/O Pins
This SRAM allows the user to configure the device to operate in Parity I/O active (x18, x36, or x72) or in Parity I/O inactive (x16,
x32, or x64) mode. Holding the PE bump low or letting it float will activate the 9th I/O on each byte of the RAM. Grounding PE
deactivates the 9th I/O of each byte, although the bit in each byte of the memory array remains active to store and recall parity bits
generated and read into the ByteSafe parity circuits.
Burst Counter Sequences
BPR 1999.05.18
Mode Pin Functions
Mode Name
Pin
Name
State
Function
Burst Order Control
LBO
L
Linear Burst
H
Interleaved Burst
Output Register Control
FT
L
Flow Through
H or NC
Pipeline
Power Down Control
ZZ
L or NC
Active
H
Standby, I
DD
= I
SB
Linear Burst Sequence
Note: The burst counter wraps to initial state on the 5th clock.
I
nterleaved Burst Sequence
Note: The burst counter wraps to initial state on the 5th clock.
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
2nd address
01
10
11
00
3rd address
10
11
00
01
4th address
11
00
01
10
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
2nd address
01
00
11
10
3rd address
10
11
00
01
4th address
11
10
01
00
Rev: 1.00b 12/2002
11/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Byte Write Truth Table
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs.
2. Byte Write Enable inputs B
A
, B
B
, B
C
and/or B
D
may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes "
C
" and "
D
" are only available on the x36 version.
Function
GW
BW
B
A
B
B
B
C
B
D
Notes
Read
H
H
X
X
X
X
1
Read
H
L
H
H
H
H
1
Write byte a
H
L
L
H
H
H
2, 3
Write byte b
H
L
H
L
H
H
2, 3
Write byte c
H
L
H
H
L
H
2, 3, 4
Write byte d
H
L
H
H
H
L
2, 3, 4
Write all bytes
H
L
L
L
L
L
2, 3, 4
Write all bytes
L
X
X
X
X
X
Rev: 1.00b 12/2002
12/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Synchronous Truth Table
Operation
Address Used
State
Diagram
Key
5
E
1
ADSP
ADSC
ADV
W
3
DQ
4
Deselect Cycle, Power Down
None
X
H
X
L
X
X
High-Z
Read Cycle, Begin Burst
External
R
L
L
X
X
X
Q
Read Cycle, Begin Burst
External
R
L
H
L
X
F
Q
Write Cycle, Begin Burst
External
W
L
H
L
X
T
D
Read Cycle, Continue Burst
Next
CR
X
H
H
L
F
Q
Read Cycle, Continue Burst
Next
CR
H
X
H
L
F
Q
Write Cycle, Continue Burst
Next
CW
X
H
H
L
T
D
Write Cycle, Continue Burst
Next
CW
H
X
H
L
T
D
Read Cycle, Suspend Burst
Current
X
H
H
H
F
Q
Read Cycle, Suspend Burst
Current
H
X
H
H
F
Q
Write Cycle, Suspend Burst
Current
X
H
H
H
T
D
Write Cycle, Suspend Burst
Current
H
X
H
H
T
D
Notes:
1. X = Don't Care, H = High, L = Low
2. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.
3. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as "Q" in the Truth Table above).
4. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
5. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.
6. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.00b 12/2002
13/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
First Write
First Read
Burst Write
Burst Read
Deselect
R
W
CR
CW
X
X
W
R
R
W
R
X
X
X
Simple Synchronous Operation
Simple Burst Synchronou
s Operation
CR
R
CW
CR
CR
Simplified State Diagram
Notes:
1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (B
A
, B
B
, B
C
, B
D
, BW, and GW) control inputs, and
that ADSP is tied high and ADSC is tied low.
3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and
assumes ADSP is tied high and ADV is tied low.
Rev: 1.00b 12/2002
14/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
First Write
First Read
Burst Write
Burst Read
Deselect
R
W
CR
CW
X
X
W
R
R
W
R
X
X
X
CR
R
CW
CR
CR
W
CW
W
CW
Simplified State Diagram with G
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of "Dummy Reads" (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing
through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.
3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM's drivers off and for incoming data to meet
Data Input Set Up Time.
Rev: 1.00b 12/2002
15/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Absolute Maximum Ratings
(All voltages reference to V
SS
)
Symbol
Description
Value
Unit
V
DD
Voltage on V
DD
Pins
0.5 to 4.6
V
V
DDQ
Voltage in V
DDQ
Pins
0.5 to 4.6
V
V
I/O
Voltage on I/O Pins
0.5 to V
DDQ
+0.5 (
4.6 V max.)
V
V
IN
Voltage on Other Input Pins
0.5 to V
DD
+0.5 (
4.6 V max.)
V
I
IN
Input Current on Any Pin
+/20
mA
I
OUT
Output Current on Any I/O Pin
+/20
mA
P
D
Package Power Dissipation
1.5
W
T
STG
Storage Temperature
55 to 125
o
C
T
BIAS
Temperature Under Bias
55 to 125
o
C
Rev: 1.00b 12/2002
16/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Power Supply Voltage Ranges
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
3.3 V Supply Voltage
V
DD3
3.0
3.3
3.6
V
2.5 V Supply Voltage
V
DD2
2.3
2.5
2.7
V
3.3 V V
DDQ
I/O Supply Voltage
V
DDQ3
3.0
3.3
3.6
V
2.5 V V
DDQ
I/O Supply Voltage
V
DDQ2
2.3
2.5
2.7
V
Notes:
1.
The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2.
Input Under/overshoot voltage must be 2 V > Vi < V
DDn
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
V
DDQ3
Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
V
DD
Input High Voltage
V
IH
2.0
--
V
DD
+ 0.3
V
1
V
DD
Input Low Voltage
V
IL
0.3
--
0.8
V
1
V
DDQ
I/O Input High Voltage
V
IHQ
2.0
--
V
DDQ
+ 0.3
V
1,3
V
DDQ
I/O Input Low Voltage
V
ILQ
0.3
--
0.8
V
1,3
Notes:
1.
The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2.
Input Under/overshoot voltage must be 2 V > Vi < V
DDn
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
3.
V
IHQ
(max) is voltage on V
DDQ
pins plus 0.3 V.
V
DDQ2
Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
V
DD
Input High Voltage
V
IH
0.6*V
DD
--
V
DD
+ 0.3
V
1
V
DD
Input Low Voltage
V
IL
0.3
--
0.3*V
DD
V
1
V
DDQ
I/O Input High Voltage
V
IHQ
0.6*V
DD
--
V
DDQ
+ 0.3
V
1,3
V
DDQ
I/O Input Low Voltage
V
ILQ
0.3
--
0.3*V
DD
V
1,3
Notes:
1.
The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2.
Input Under/overshoot voltage must be 2 V > Vi < V
DDn
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
3.
V
IHQ
(max) is voltage on V
DDQ
pins plus 0.3 V.
Rev: 1.00b 12/2002
17/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Note: These parameters are sample tested.
Notes:
1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-
ature air flow, board density, and PCB thermal resistance.
2. SCMI G-38-87
3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1
Recommended Operating Temperatures
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Ambient Temperature (Commercial Range Versions)
T
A
0
25
70
C
2
Ambient Temperature (Industrial Range Versions)
T
A
40
25
85
C
2
Note:
1.
The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2.
Input Under/overshoot voltage must be 2 V > Vi < V
DDn
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Capacitance
(T
A
= 25
o
C, f = 1 MH
Z
, V
DD
= 2.5 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
C
IN
V
IN
= 0 V
4
5
pF
Input/Output Capacitance
C
I/O
V
OUT
= 0 V
6
7
pF
Package Thermal Characteristics
Rating
Layer Board
Symbol
Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
R
JA
40
C/W
1,2
Junction to Ambient (at 200 lfm)
four
R
JA
24
C/W
1,2
Junction to Case (TOP)
--
R
JC
9
C/W
3
20% tKC
V
SS
2.0 V
50%
V
SS
V
IH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
V
DD
+ 2.0 V
50%
V
DD
V
IL
Rev: 1.00b 12/2002
18/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
AC Test Conditions
Parameter
Conditions
Input high level
V
DD
0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
V
DD
/2
Output reference level
V
DDQ
/2
Output load
Fig. 1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
I
IL
V
IN
= 0 to V
DD
1 uA
1 uA
ZZ Input Current
I
IN1
V
DD
V
IN
V
IH
0 V
V
IN
V
IH
1 uA
1 uA
1 uA
100 uA
FT Input Current
I
IN2
V
DD
V
IN
V
IL
0 V
V
IN
V
IL
100 uA
1 uA
1 uA
1 uA
Output Leakage Current
I
OL
Output Disable, V
OUT
= 0 to V
DD
1 uA
1 uA
Output High Voltage
V
OH2
I
OH
= 8 mA, V
DDQ
= 2.375 V
1.7 V
--
Output High Voltage
V
OH3
I
OH
= 8 mA, V
DDQ
= 3.135 V
2.4 V
--
Output Low Voltage
V
OL
I
OL
= 8 mA
--
0.4 V
DQ
V
DDQ/2
50
30pF
*
Output Load 1
* Distributed Test Jig Capacitance
Rev: 1.00b 12/2002
19/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Operating Currents
Notes:
1.
I
DD
an
d I
DDQ
apply to any combination of V
DD3
, V
DD2
, V
DD
Q
3
, and V
DDQ2
operation.
2.
All pa
rameters listed are worst case scenario.
Par
a
meter
T
est
Co
nd
itio
ns
Mo
de
Sym
b
o
l
-250
-225
-200
-166
-150
-133
Un
it
0
to
70C
40
to
85C
0
to
70C

40
to
85C
0
to
70C
40
to
85C
0
to
70
C

40
to
85C
0
to
70C
40
to
85C
0
to
70C

40
to
85C
Operating
Current
3.3 V
Devi
ce Selec
t
ed;
All o
t
her

inpu
ts
V
IH

o
r
V
IL
Output

o
pen
(x32
x
36)
Pipeline
I
DD
I
DD
Q
29
0
40
300
40
265
35
275
35
240
30
250
30
205
25
215
25
190
25
20
0
25
170
20
180
20
mA
Flow
Through
I
DD
I
DD
Q
18
0
20
190
20
170
20
180
20
165
15
175
15
155
15
165
15
150
15
16
0
15
140
10
150
10
mA
(x18)
Pipeline
I
DD
I
DD
Q
26
0
20
270
20
235
20
245
20
215
15
225
15
185
15
195
15
170
15
18
0
15
155
10
165
10
mA
Flow
Through
I
DD
I
DD
Q
16
5
10
175
10
155
10
165
10
150
10
160
10
140
10
150
10
135
10
14
5
10
125
10
135
10
mA
Operating
Current
2.5 V
Devi
ce Selec
t
ed;
All o
t
her

inpu
ts
V
IH

o
r
V
IL
Output

o
pen
(x32
x
36)
Pipeline
I
DD
I
DD
Q
29
0
30
300
30
265
30
275
30
240
25
250
25
205
20
215
20
190
20
20
0
20
170
15
180
15
mA
Flow
Through
I
DD
I
DD
Q
18
0
20
190
20
170
20
180
20
165
15
175
15
155
15
165
15
150
15
16
0
15
140
10
150
10
mA
(x18)
Pipeline
I
DD
I
DD
Q
26
0
15
270
15
235
15
245
15
215
15
225
15
185
10
195
10
170
10
18
0
10
155
10
165
10
mA
Flow
Through
I
DD
I
DD
Q
16
5
10
175
10
155
10
165
10
150
10
160
10
140
10
150
10
135
10
14
5
10
125
10
135
10
mA
Standby
Current
ZZ
V
DD
0.2 V
--
Pipeline
I
SB
4
0
50
40
50
40
50
40
50
40
5
0
40
50
mA
Flow
Through
I
SB
4
0
50
40
50
40
50
40
50
40
5
0
40
50
mA
Des
e
lect
Current
Dev
i
ce D
e
selec
t
ed;
All o
t
her

inpu
ts
V
IH

or
V
IL
--
Pipeline
I
DD
8
5
90
80
85
75
80
64
70
60
6
5
50
55
mA
Flow
Through
I
DD
6
0
65
60
65
50
55
50
55
50
5
5
45
50
mA
Rev: 1.00b 12/2002
20/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
AC Electrical Characteristics
Notes:
1. These parameters are sampled and are not 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Parameter
Symbol
-250
-225
-200
-166
-150
-133
Unit
Min
Max
Min
Max
Min
Max
Min
Max Min Max Min Max
Pipeline
Clock Cycle Time
tKC
4.0
--
4.4
--
5.0
--
6.0
--
6.7
--
7.5
--
ns
Clock to Output Valid
tKQ
--
2.5
--
2.7
--
3.0
--
3.4
--
3.8
--
4.0
ns
Clock to Output Invalid
tKQX
1.5
--
1.5
--
1.5
--
1.5
--
1.5
--
1.5
--
ns
Clock to Output in Low-Z
tLZ
1
1.5
--
1.5
--
1.5
--
1.5
--
1.5
--
1.5
--
ns
Setup time
tS
1.2
--
1.3
--
1.4
--
1.5
--
1.5
--
1.5
--
ns
Hold time
tH
0.2
--
0.3
--
0.4
--
0.5
--
0.5
--
0.5
--
ns
Flow
Through
Clock Cycle Time
tKC
5.5
--
6.0
--
6.5
--
7.0
--
7.5
--
8.5
--
ns
Clock to Output Valid
tKQ
--
5.5
--
6.0
--
6.5
--
7.0
--
7.5
--
8.5
ns
Clock to Output Invalid
tKQX
3.0
--
3.0
--
3.0
--
3.0
--
3.0
--
3.0
--
ns
Clock to Output in Low-Z
tLZ
1
3.0
--
3.0
--
3.0
--
3.0
--
3.0
--
3.0
--
ns
Setup time
tS
1.5
--
1.5
--
1.5
--
1.5
--
1.5
--
1.5
--
ns
Hold time
tH
0.5
--
0.5
--
0.5
--
0.5
--
0.5
--
0.5
--
ns
Clock HIGH Time
tKH
1.3
--
1.3
--
1.3
--
1.3
--
1.5
--
1.7
--
ns
Clock LOW Time
tKL
1.5
--
1.5
--
1.5
--
1.5
--
1.7
--
2
--
ns
Clock to Output in
High-Z
tHZ
1
1.5 2.5
1.5 2.7
1.5 3.0
1.5
3.0
1.5 3.0
1.5 3.0
ns
G to Output Valid
tOE
--
2.5
--
2.7
--
3.2
--
3.5
--
3.8
--
4.0
ns
G to output in Low-Z
tOLZ
1
0
--
0
--
0
--
0
--
0
--
0
--
ns
G to output in High-Z
tOHZ
1
--
2.5
--
2.7
--
3.0
--
3.0
--
3.0
--
3.0
ns
ZZ setup time
tZZS
2
5
--
5
--
5
--
5
--
5
--
5
--
ns
ZZ hold time
tZZH
2
1
--
1
--
1
--
1
--
1
--
1
--
ns
ZZ recovery
tZZR
20
--
20
--
20
--
20
--
20
--
20
--
ns
Rev: 1.00b 12/2002
21/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Pipeline Mode Timing (DCD)
Begin
R
ead A
C
ont
Deselec
t
Deselect
Wr
ite
B
R
ead C
R
ead C+1
R
ead C+2
R
ead C+3
C
o
n
t
D
es
elect
Des
e
lect
tK
QX
tK
Q
tLZ
tH
tS
tO
HZ
tOE
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tS
tH
tS
tH
tS
tH
tS
tKC
tKC
tKL
tKL
tK
H
tK
H
Q(A)
D(B
)
Q
(
C
)
Q
(
C
+
1)
Q(C+2)
Q(C+3)
AB
C
Hi-Z
Dese
lected with
E
1
E2 a
nd E3 only
sample
d with
ADSC
ADSC i
n
itiated

read
CK
AD
SP
AD
SC
AD
V
A0An
GW
BW
B
aB
d
E1
E2
E3
G
DQa
D
Qd
Rev: 1.00b 12/2002
22/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Flow Through Mode Timing (DCD)
Begin
R
e
a
d A
C
ont
D
eselect
Wr
i
t
e B
R
ea
d C
R
ead
C+1
R
ead C+2
R
ead C+3
R
ead
C
D
eselect
tKQX
tHZ
tL
Z
tH
tS
tOHZ
tO
E
tK
Q
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tKC
tKC
tKL
tKL
tKH
tKH
AB
C
Q(A)
D(B)
Q(C
)
Q(C+1)
Q(C
+
2)
Q(C
+
3)
Q(C)
E2

and E3 only sampled with
A
D
SP
and ADSC
E1 m
a
sks

AD
S
P
ADSC initiated
rea
d
Des
e
lected with E1
E1 mas
k
s
ADSP
Fixed High
CK
ADSP
AD
S
C
AD
V
A0
A
n
GW
BW
B
aB
d
E1
E2
E3
G
DQaDQd
Rev: 1.00b 12/2002
23/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after ZZ recovery time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I
SB
2. The duration of
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, I
SB
2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
Application Tips
Single and Dual Cycle Deselect
SCD devices force the use of "dummy read cycles" (read cycles that are launched normally but that are ended with the output
drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance but their use usually assures there
will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs (like this one) do not waste
bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at
bank address boundary crossings) but greater care must be exercised to avoid excessive bus contention.
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V
DD
. The JTAG output
drivers are powered by V
DDQ
.
CK
ADSP
ADSC
tH
tKH tKL
tKC
tS
ZZ
tZZR
tZZH
tZZS
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
Snooze
Sleep Mode Timing Diagram
~ ~
~ ~
~ ~
~ ~
~ ~
Rev: 1.00b 12/2002
24/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either V
DD
or V
SS
. TDO should be left unconnected.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and
0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising
edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI
and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM's JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM's input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port's TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
TCK
Test Clock
In
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TMS
Test Mode Select
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
TDI
Test Data In
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
TDO
Test Data Out
Out
Output that is active depending on the state of the TAP state machine. Output changes in
response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
Rev: 1.00b 12/2002
25/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
ID Register Contents
Die
Revision
Code
Not Used
I/O
Configuration
GSI Technology
JEDEC Vendor
ID Code
Presence Registe
r
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
x36
X X X X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0 0 1 1 0 1 1 0 0 1
1
x18
X X X X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0 0 1 1 0 1 1 0 0 1
1
Instruction Register
ID Code Register
Boundary Scan Register
0
1
2
0
1
2
31 30 29
0
1
2
n
0
Bypass Register
TDI
TDO
TMS
TCK
Test Access Port (TAP) Controller
Rev: 1.00b 12/2002
26/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
JTAG Tap Controller State Diagram
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when
the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices
in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruc-
tion Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan
Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the
Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it
is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although
allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be
stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be
paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-
Select DR
Capture DR
Shift DR
Exit1 DR
Pause DR
Exit2 DR
Update DR
Select IR
Capture IR
Shift IR
Exit1 IR
Pause IR
Exit2 IR
Update IR
Test Logic Reset
Run Test Idle
0
0
1
0
1
1
0
0
1
1
1
0
0
1
1
0
0
0
0
1
1
0
0
1
1
0
0
0
1
1
1
1
Rev: 1.00b 12/2002
27/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
DR state then places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The
EXTEST command does not block or override the RAM's input pins; therefore, the RAM's internal state is still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST
command is used to output the Boundary Scan Register's contents, in parallel, on the RAM's data output drivers on the falling edge of TCK when
the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the
sate of all the RAM's input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in
parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM's output pins drive out the value of the
Boundary Scan Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID
register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any
time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-Z) and the Bound-
ary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
JTAG TAP Instruction Set Summary
Instruction
Code
Description
Notes
EXTEST
000
Places the Boundary Scan Register between TDI and TDO.
1
IDCODE
001
Preloads ID Register and places it between TDI and TDO.
1, 2
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
1
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
SAMPLE/
PRELOAD
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
1
GSI
101
GSI private instruction.
1
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
BYPASS
111
Places Bypass Register between TDI and TDO.
1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.00b 12/2002
28/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
Max.
Unit Notes
3.3 V Test Port Input High Voltage
V
IHJ3
2.0
V
DD3
+0.3
V
1
3.3 V Test Port Input Low Voltage
V
ILJ3
0.3
0.8
V
1
2.5 V Test Port Input High Voltage
V
IHJ2
0.6 * V
DD2
V
DD2
+0.3
V
1
2.5 V Test Port Input Low Voltage
V
ILJ2
0.3
0.3 * V
DD2
V
1
TMS, TCK and TDI Input Leakage Current
I
INHJ
300
1
uA
2
TMS, TCK and TDI Input Leakage Current
I
INLJ
1
100
uA
3
TDO Output Leakage Current
I
OLJ
1
1
uA
4
Test Port Output High Voltage
V
OHJ
1.7
--
V
5, 6
Test Port Output Low Voltage
V
OLJ
--
0.4
V
5, 7
Test Port Output CMOS High
V
OHJC
V
DDQ
100 mV
--
V
5, 8
Test Port Output CMOS Low
V
OLJC
--
100 mV
V
5, 9
Notes:
1. Input Under/overshoot voltage must be 2 V > Vi < V
DDn
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
2. V
ILJ
V
IN
V
DDn
3. 0 V
V
IN
V
ILJn
4. Output Disable, V
OUT
= 0 to V
DDn
5. The TDO output driver is served by the V
DDQ
supply.
6. I
OHJ
= 4 mA
7. I
OLJ
= + 4 mA
8. I
OHJC
= 100 uA
9. I
OHJC
= +100 uA
Notes:
1. Include scope and jig capacitance.
2. Test conditions as as shown unless otherwise noted.
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
V
DD
0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
V
DDQ
/2
Output reference level
V
DDQ
/2
DQ
V
DDQ
/2
50
30pF
*
JTAG Port AC Test Load
* Distributed Test Jig Capacitance
Rev: 1.00b 12/2002
29/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
JTAG Port Timing Diagram
JTAG Port AC Electrical Characteristics
Boundary Scan (BSDL Files)
For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications
Engineering Department at: apps@gsitechnology.com.
Parameter
Symbol
Min
Max
Unit
TCK Cycle Time
tTKC
50
--
ns
TCK Low to TDO Valid
tTKQ
--
20
ns
TCK High Pulse Width
tTKH
20
--
ns
TCK Low Pulse Width
tTKL
20
--
ns
TDI & TMS Set Up Time
tTS
10
--
ns
TDI & TMS Hold Time
tTH
10
--
ns
tTKQ
tTS
tTH
tTKH
tTKL
TCK
TMS
TDI
TDO
tTKC
Rev: 1.00b 12/2002
30/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
TQFP Package Drawing
D1
D
E1
E
Pin 1
b
e
c
L
L1
A2
A1
Y
100-Pin TQFP Package Drawing
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Symbol
Description
Min. Nom. Max
A1
Standoff
0.05
0.10
0.15
A2
Body Thickness
1.35
1.40
1.45
b
Lead Width
0.20
0.30
0.40
c
Lead Thickness
0.09
0.20
D
Terminal Dimension
21.9
22.0
22.1
D1
Package Body
19.9
20.0
20.1
E
Terminal Dimension
15.9
16.0
16.1
E1
Package Body
13.9
14.0
14.1
e
Lead Pitch
0.65
L
Foot Length
0.45
0.60
0.75
L1
Lead Length
1.00
Y
Coplanarity
0.10
Lead Angle
0
7
Rev: 1.00b 12/2002
31/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Package Dimensions--165-Bump FPBGA (Package D)
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
R
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1 2 3 4 5 6 7 8 9 10 11
11 10 9 8 7 6 5 4 3 2 1
A1 CORNER
TOP VIEW
A1 CORNER
BOTTOM VIEW
1.0
1.0
10.0
1.
0
1.
0
14
.
0
130.07
15
0
.0
7
A
B
0.20(4x)
0.10
0.25
C
C A B
M
M
0.40~0.50 (165x)
C
SEATING PLANE
0.
15
C
0.
25
~0.
4
0
1.
20 MAX.
0.
450.
05
0.
25
C
(0
.2
6)
Rev: 1.00b 12/2002
32/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
Ordering Information for GSI Synchronous Burst RAMs
Org
Part Number
1
Type
Package
Speed
2
(MHz/ns)
T
A
3
Status
512K x 18
GS881E18BT-250
DCD Pipeline/Flow Through
TQFP
250/5.5
C
512K x 18
GS881E18BT-225
DCD Pipeline/Flow Through
TQFP
225/6
C
512K x 18
GS881E18BT-200
DCD Pipeline/Flow Through
TQFP
200/6.5
C
512K x 18
GS881E18BT-166
DCD Pipeline/Flow Through
TQFP
166/7
C
512K x 18
GS881E18BT-150
DCD Pipeline/Flow Through
TQFP
150/7.5
C
512K x 18
GS881E18BT-133
DCD Pipeline/Flow Through
TQFP
133/8.5
C
256K x 36
GS881E36BT-250
DCD Pipeline/Flow Through
TQFP
250/5.5
C
256K x 36
GS881E36BT-225
DCD Pipeline/Flow Through
TQFP
225/6
C
256K x 36
GS881E36BT-200
DCD Pipeline/Flow Through
TQFP
200/6.5
C
256K x 36
GS881E36BT-166
DCD Pipeline/Flow Through
TQFP
166/7
C
256K x 36
GS881E36BT-150
DCD Pipeline/Flow Through
TQFP
150/7.5
C
256K x 36
GS881E36BT-133
DCD Pipeline/Flow Through
TQFP
133/8.5
C
512K x 18
GS881E18BT-250I
DCD Pipeline/Flow Through
TQFP
250/5.5
I
512K x 18
GS881E18BT-225I
DCD Pipeline/Flow Through
TQFP
225/6
I
512K x 18
GS881E18BT-200I
DCD Pipeline/Flow Through
TQFP
200/6.5
I
512K x 18
GS881E18BT-166I
DCD Pipeline/Flow Through
TQFP
166/7
I
512K x 18
GS881E18BT-150I
DCD Pipeline/Flow Through
TQFP
150/7.5
I
512K x 18
GS881E18BT-133I
DCD Pipeline/Flow Through
TQFP
133/8.5
I
256K x 36
GS881E36BT-250I
DCD Pipeline/Flow Through
TQFP
250/5.5
I
256K x 36
GS881E36BT-225I
DCD Pipeline/Flow Through
TQFP
225/6
I
256K x 36
GS881E36BT-200I
DCD Pipeline/Flow Through
TQFP
200/6.5
I
256K x 36
GS881E36BT-166I
DCD Pipeline/Flow Through
TQFP
166/7
I
256K x 36
GS881E36BT-150I
DCD Pipeline/Flow Through
TQFP
150/7.5
I
256K x 36
GS881E36BT-133I
DCD Pipeline/Flow Through
TQFP
133/8.5
I
512K x 18
GS881E18BD-250
DCD Pipeline/Flow Through
165 BGA
250/5.5
C
512K x 18
GS881E18BD-225
DCD Pipeline/Flow Through
165 BGA
225/6
C
512K x 18
GS881E18BD-200
DCD Pipeline/Flow Through
165 BGA
200/6.5
C
512K x 18
GS881E18BD-166
DCD Pipeline/Flow Through
165 BGA
166/7
C
512K x 18
GS881E18BD-150
DCD Pipeline/Flow Through
165 BGA
150/7.5
C
512K x 18
GS881E18BD-133
DCD Pipeline/Flow Through
165 BGA
133/8.5
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS881E18BT-150IT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00b 12/2002
33/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
256K x 32
GS881E32BD-250
DCD Pipeline/Flow Through
165 BGA
250/5.5
C
256K x 32
GS881E32BD-225
DCD Pipeline/Flow Through
165 BGA
225/6
C
256K x 32
GS881E32BD-200
DCD Pipeline/Flow Through
165 BGA
200/6.5
C
256K x 32
GS881E32BD-166
DCD Pipeline/Flow Through
165 BGA
166/7
C
256K x 32
GS881E32BD-150
DCD Pipeline/Flow Through
165 BGA
150/7.5
C
256K x 32
GS881E32BD-133
DCD Pipeline/Flow Through
165 BGA
133/8.5
C
256K x 36
GS881E36BD-250
DCD Pipeline/Flow Through
165 BGA
250/5.5
C
256K x 36
GS881E36BD-225
DCD Pipeline/Flow Through
165 BGA
225/6
C
256K x 36
GS881E36BD-200
DCD Pipeline/Flow Through
165 BGA
200/6.5
C
256K x 36
GS881E36BD-166
DCD Pipeline/Flow Through
165 BGA
166/7
C
256K x 36
GS881E36BD-150
DCD Pipeline/Flow Through
165 BGA
150/7.5
C
256K x 36
GS881E36BD-133
DCD Pipeline/Flow Through
165 BGA
133/8.5
C
512K x 18
GS881E18BD-250I
DCD Pipeline/Flow Through
165 BGA
250/5.5
I
512K x 18
GS881E18BD-225I
DCD Pipeline/Flow Through
165 BGA
225/6
I
512K x 18
GS881E18BD-200I
DCD Pipeline/Flow Through
165 BGA
200/6.5
I
512K x 18
GS881E18BD-166I
DCD Pipeline/Flow Through
165 BGA
166/7
I
512K x 18
GS881E18BD-150I
DCD Pipeline/Flow Through
165 BGA
150/7.5
I
512K x 18
GS881E18BD-133I
DCD Pipeline/Flow Through
165 BGA
133/8.5
I
256K x 32
GS881E32BD-250I
DCD Pipeline/Flow Through
165 BGA
250/5.5
I
256K x 32
GS881E32BD-225I
DCD Pipeline/Flow Through
165 BGA
225/6
I
256K x 32
GS881E32BD-200I
DCD Pipeline/Flow Through
165 BGA
200/6.5
I
256K x 32
GS881E32BD-166I
DCD Pipeline/Flow Through
165 BGA
166/7
I
256K x 32
GS881E32BD-150I
DCD Pipeline/Flow Through
165 BGA
150/7.5
I
256K x 32
GS881E32BD-133I
DCD Pipeline/Flow Through
165 BGA
133/8.5
I
256K x 36
GS881E36BD-250I
DCD Pipeline/Flow Through
165 BGA
250/5.5
I
256K x 36
GS881E36BD-225I
DCD Pipeline/Flow Through
165 BGA
225/6
I
256K x 36
GS881E36BD-200I
DCD Pipeline/Flow Through
165 BGA
200/6.5
I
256K x 36
GS881E36BD-166I
DCD Pipeline/Flow Through
165 BGA
166/7
I
256K x 36
GS881E36BD-150I
DCD Pipeline/Flow Through
165 BGA
150/7.5
I
256K x 36
GS881E36BD-133I
DCD Pipeline/Flow Through
165 BGA
133/8.5
I
Org
Part Number
1
Type
Package
Speed
2
(MHz/ns)
T
A
3
Status
Notes:
1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS881E18BT-150IT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00b 12/2002
34/34
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
9Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Format or Content
Page;Revisions;Reason
881E18B_r1
Creation of new datasheet